Transparent epoxy adhesive and application thereof

An epoxy adhesive, transparent technology, applied in the direction of adhesive, epoxy resin, adhesive type, etc., can solve the problems of unable to meet the requirements of use, poor compatibility of epoxy resin, affecting the adhesion of adhesives, etc.

Inactive Publication Date: 2017-11-28
ZHONGSHAN DONGYI HIGH TECH MATERIAL
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet these properties, many studies have added tougheners such as rubber or polyurethane resin and fillers to epoxy adhesives, which will affect the transparency of the adhesive, and the adhesive layer is prone to whitening and yellowing; or adding saturated polyester resins, which will affect The heat resistance and cohesive force of the adhesive; or adding transparent polyimide resin, which has poor compatibility with epoxy resin, affects the cohesive force of the adhesive and the cost is very high, and cannot meet the use requirements in the application

Method used

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  • Transparent epoxy adhesive and application thereof
  • Transparent epoxy adhesive and application thereof
  • Transparent epoxy adhesive and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0030] The preparation method of embodiment 1-4 and comparative example 1-2 is as follows:

[0031] Add each component according to the ratio in Table 1, add a certain amount of methyl ethyl ketone and stir to make a 40% transparent adhesive. (embodiment 1-4 is transparent epoxy adhesive, hereinafter collectively referred to as transparent adhesive to facilitate description of preparation method.)

[0032] Examples 1-4 and Comparative Examples 1-2 were applied to prepare transparent flexible copper-clad laminates, transparent cover films and transparent pure rubber films, respectively.

[0033] The preparation method of the transparent flexible copper clad laminate is as follows:

[0034] Use a coating machine to coat the transparent adhesive on the transparent polyimide film, the thickness of the coating is 12 μm after drying, and then dry it in an oven at 150 ° C for 5 minutes to cure to a semi-cured state, and then use a temperature of 100 ° C and Under the pressure of 0....

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Abstract

The invention discloses a transparent epoxy adhesive and application thereof. The adhesive is prepared from the following components in parts by weight: 30 to 40 parts of aliphatic epoxy resin, 3 to 6 parts of hexahydrophthalic anhydride, 50 to 70 parts of toughening agent and 6 to 20 parts of translucent powder. By adopting the transparent epoxy adhesive, the influence of rubber on yellowing performance can be avoided; the influence of polyurethane on yellowing is avoided, and epoxy resin can be toughened. By adopting the transparent epoxy adhesive, an epoxy system and a flexible polyester system are combined together, the advantages of the epoxy system and the flexible polyester system are brought into full play, and the problems concerned with compatibility and yellowing resistance are solved; the flexible transparent adhesive has high transparency, high heat resistance and high bonding force.

Description

【Technical field】 [0001] The invention relates to a transparent epoxy adhesive and its application. 【Background technique】 [0002] In recent years, under the trend of multi-functionality, lightness and diversification of electronic products, flexible printed circuit boards have developed rapidly, and the materials of flexible printed circuit boards, flexible copper clad laminates and cover films, have also developed rapidly. It is made of polyimide film or polyester film and copper foil or release paper. There are more and more applications requiring high transparency of flexible printed circuit boards (FPC) in optical components, touch screen products, and manufacturing process alignment, and more and more researches on transparent adhesives. [0003] However, flexible copper clad laminates, cover films, and pure glue used in flexible printed circuit boards need to have high adhesion, high heat resistance, and flexibility. In order to meet these properties, many studies ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08B32B37/12B32B15/20B32B15/08B32B15/09B32B27/10B32B27/28B32B27/36B32B29/00
CPCB32B15/08B32B15/09B32B15/20B32B27/10B32B27/281B32B27/36B32B29/002B32B37/12B32B2307/306C08L2201/08C08L2201/10C08L2205/16C09J11/04C09J11/08C09J163/00C08L67/00C08K3/34
Inventor 陈建平张正浩
Owner ZHONGSHAN DONGYI HIGH TECH MATERIAL
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