Compositions, cured products, prepregs and laminates

A composition and laminate technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., to achieve the effects of achieving adhesion, heat resistance, and easy impregnation

Active Publication Date: 2021-07-20
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although this curing agent is excellent in heat resistance, dielectric properties, etc., it has problems in terms of adhesion

Method used

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  • Compositions, cured products, prepregs and laminates
  • Compositions, cured products, prepregs and laminates
  • Compositions, cured products, prepregs and laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0102] Although an Example and a comparative example are given and this invention is demonstrated concretely, this invention is not limited to these. Unless otherwise specified, "part" means a mass part, and "%" means a mass %. Measuring methods were measured by the following methods, respectively.

[0103] The analysis method and measurement method are shown below.

[0104] (1) Non-volatile components: According to JISK6910 standard (5.6 Non-volatile components). Specifically, when the sample amount was 1 g, the test temperature was 150° C., and the test time was 1 hour, the solid content remaining after distilling off the solvent was used as a nonvolatile content.

[0105] (2) Solubility: Formulated at a predetermined ratio, the case where crystallization was not observed even after being left at room temperature for 1 week and then impacted by stirring was indicated by "○", and the case where uniform dissolution was not possible, or Those that precipitated crystals withi...

Synthetic example 1

[0111]In a separable flask made of glass with a stirring device, a thermometer, a nitrogen gas introduction device, a cooling pipe and a dropping device, add 105 parts of phenol novolak resin (phenolic hydroxyl equivalent (g / eq.) is 105, and the softening point is 130°C), 0.1 parts of p-toluenesulfonic acid, and the temperature was raised to 150°C. While maintaining this temperature, 94 parts of styrene was dripped over 3 hours, and stirring was continued at this temperature for 1 hour. Then, it was dissolved in 500 parts of methyl isobutyl ketone (MIBK), and washed with water five times at 80°C. Then, MIBK was distilled off under reduced pressure to obtain a styrene-modified phenol novolac resin (b-1) represented by the following formula (4). The obtained (b-1) had a phenolic hydroxyl equivalent of 199, a softening point of 110° C., and p (average value) in the formula (4) of 0.9.

[0112] [chemical 5]

[0113]

Synthetic example 2

[0115] In the same device as in Synthesis Example 1, 105 parts of phenol novolak resin (phenolic hydroxyl equivalent: 105, softening point: 67°C) and 0.13 parts of p-toluenesulfonic acid were added, and the temperature was raised to 150°C. While maintaining this temperature, 156 parts of styrene was dripped over 3 hours, and stirring was continued at this temperature for 1 hour further. Then, the same treatment as in Synthesis Example 1 was performed to obtain a styrene-modified phenol novolak resin (b-2). The obtained (b-2) had a phenolic hydroxyl equivalent of 261, a softening point of 75° C., and p of 1.5.

[0116] The description of the symbols used in Examples and Comparative Examples is as follows.

[0117] (1) Bisphenol compound (A):

[0118] BisP-TMC: 4,4'-(3,3,5-trimethylcyclohexylene)bisphenol (manufactured by Honshu Chemical Industry Co., Ltd., BisP-TMC, phenolic hydroxyl equivalent: 155, melting point: 206°C)

[0119] (2) Phenolic compound (B):

[0120] (b-1): ...

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Abstract

The present invention relates to a composition, a cured product, a prepreg, and a laminate. The present invention provides a curing agent composition capable of improving the solubility of an epoxy resin curing agent excellent in dielectric properties and improving the balance of properties such as dielectric properties and adhesive force, and an epoxy resin composition using the same. The epoxy resin hardener composition of the present invention is a combination of a bisphenol compound (A) having an alicyclic structure represented by the following general formula (1) and a phenol compound (B) represented by the following general formula (2). Dissolved in an organic solvent (C) selected from non-aromatic solvents, and the mass ratio of bisphenol compound (A) to phenol compound (B) is (A):(B)=5:95~95 : 5.

Description

technical field [0001] The present invention relates to an epoxy resin curing agent composition providing a cured product having low dielectric properties and excellent adhesion, an epoxy resin composition comprising the curing agent composition and an epoxy resin, a cured product thereof, and a prepreg materials and laminates. Background technique [0002] The progress of electrical and electronic equipment is remarkable, especially the printed wiring board in data communication equipment performs large-capacity and high-speed processing of data, so the demand for improvement of dielectric properties such as low dielectric constant and low dielectric loss tangent is increasing. In addition, the wiring of the metal foil is roughened to ensure the adhesive force, but due to the need for high-speed processing in recent years, there is a tendency to suppress the roughening, and the problem of ensuring the adhesive force has also become apparent. [0003] As a means of improvin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/62C08G59/40C08L63/00C08K7/14B32B15/14B32B17/02B32B27/04
CPCB32B15/14B32B2260/023B32B2260/046B32B2262/101C08G59/4007C08G59/621C08K7/14C08L63/00C08L2201/08C08L2203/20B32B27/38C08J5/24
Inventor 高岛智行石原一男
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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