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A kind of hydrophobic electrical insulation epoxy resin composition

A technology of epoxy resin and composition, applied in the direction of organic insulators, plastic/resin/wax insulators, etc., can solve problems such as poor hydrophobicity, improve hardness and mechanical properties, improve interface bonding, improve hardness and electrical resistance trace effect

Active Publication Date: 2020-05-08
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the defects of poor hydrophobicity of existing electrical insulating epoxy resin compositions, and then provide an electrical insulating epoxy resin composition with good hydrophobicity

Method used

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  • A kind of hydrophobic electrical insulation epoxy resin composition
  • A kind of hydrophobic electrical insulation epoxy resin composition
  • A kind of hydrophobic electrical insulation epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides a hydrophobic electrical insulating epoxy resin composition, the formula of which is as follows:

[0039]

[0040]

[0041] Preparation:

[0042] (1) Mix 2.4g of 2,4-diisocyanate and 4g of dodecafluoroheptanol in a high-speed disperser at 60°C, then add 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl 100g of ester, heated up to 90°C and stirred for 2.5h, then added 1g of silane coupling agent and divinylbenzene dissolved in 3g of polycarbosilane, and continued to stir at 60°C for 2h to obtain a fluorosilicon modified epoxy resin;

[0043] (2) Add 7g of aluminum hydroxide micropowder and 43g of silicon micropowder after surface activation and drying treatment to the prepared fluorosilicone modified epoxy resin, control the system temperature at 40°C, and perform high-speed dispersion and vacuum degassing pretreatment , the treatment time is 6h, the vacuum degree is 200Pa, and component A is obtained;

[0044] (3) Mix 85g of hexahydr...

Embodiment 2

[0048] This embodiment provides a hydrophobic electrical insulating epoxy resin composition, the formula of which is as follows:

[0049]

[0050]

[0051] Preparation:

[0052] (1) Mix 2.8g of 2,4-diphenylmethane diisocyanate and 7g of hexafluoropropylene oxide dimer in a high-speed disperser at 65°C, then add 3,4-epoxycyclohexylmethyl-3 , 100g of 4-epoxy cyclohexyl carboxylate, heated up to 85°C and stirred for 2h, then added 3g of hydrogen-containing silicone oil and 1g of silane coupling agent and continued to stir for 2h at 60°C to prepare a fluorosilicone modified epoxy resin;

[0053] (2) Add 8 g of surface-activated and dried aluminum hydroxide micropowder and 40 g of silicon micropowder to the prepared fluorosilicone modified epoxy resin, control the system temperature at 40°C, perform high-speed dispersion and vacuum degassing pretreatment, and process The time is 6h, the vacuum is 200Pa, and component A is prepared;

[0054] (3) Mix 80g of methylhexahydropht...

Embodiment 3

[0058] This embodiment provides a hydrophobic electrical insulating epoxy resin composition, the formula of which is as follows:

[0059]

[0060]

[0061] Preparation:

[0062] (1) Mix 2.5g of 2,4-dimethoxybenzyl isocyanate and 5g of dodecafluoroheptanol in a high-speed disperser at 50°C, then add 100g of tetraglycidyl diaminodiphenylmethane, and heat up to 80°C Stir for 2h, then add 5g of hydrogen-containing silicone oil and 1g of silane coupling agent and continue stirring for 2h at 60°C to obtain a fluorosilicon-modified epoxy resin;

[0063] (2) Add 6 g of dry surface-activated aluminum hydroxide micropowder and 40 g of silicon micropowder to the prepared fluorosilicon-modified epoxy resin, control the system temperature at 40°C, perform high-speed dispersion and vacuum degassing pretreatment, and process The time is 6h, the vacuum is 200Pa, and component A is prepared;

[0064] (3) Mix 90 g of methyl endomethylene tetrahydrophthalic anhydride and 1 g of 2,4,6-tri...

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Abstract

The invention belongs to the technical field of electrical insulation materials, and specifically relates to a hydrophobic electrical insulation epoxy resin composition. By adding a fluorine-containing modifier and a silicon-containing modifier into raw materials to realize fluorine-silicon union modification on epoxy resin, the epoxy resin is endowed with excellent hydrophobicity and toughness, wherein low molecular weight silicon oil having the molecular weight not more than 998 is adopted as the silicon-containing modifier, so that a demixing phenomenon can be better inhibited while the toughness is improved; and a low molecular weight fluoride having the molecular weight not more than 850 is adopted as the fluorine-containing modifier, so that the hydrophobicity of the composition is greatly improved. Meanwhile, the hardness and the electric mark resistance of the composition are improved by filling a proper amount of inorganic filler, so that the epoxy resin composition has good hydrophobicity, electrical insulation property and mechanical properties at the same time, and can be used as an umbrella skirt material of insulators.

Description

technical field [0001] The invention belongs to the technical field of electrical insulating materials, and in particular relates to an electrical insulating hydrophobic epoxy resin composition. Background technique [0002] The insulator is a special insulation control, which is used to support and reinforce the busbar and live conductors in circuit transmission, and to ensure sufficient distance and insulation between live conductors or between conductors and the earth. Insulators are often provided with sheds to increase the creepage distance. Traditional outdoor insulator sheds are made of materials such as porcelain, glass or high-temperature vulcanized silicone rubber. The insulator shed made of porcelain or glass has excellent mechanical properties, electrical insulation properties and weather resistance, but its hydrophobicity is poor, and it is easy to form a conductive film on the surface after being exposed to moisture, rain and snow. If it is not maintained and c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/22C08K3/36C08G59/14C08G18/58H01B3/40
CPCC08G18/58C08G59/14C08G59/1433C08G59/1494C08K3/22C08K3/36C08K9/06C08K2003/2227H01B3/40C08L63/00
Inventor 尹立李飞张翀杨威申巍张卓陈新王森张鹏
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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