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Tantalum target material assembly and manufacturing method thereof

A manufacturing method and tantalum target material technology, which are applied in the field of tantalum target material components and its manufacture, can solve the problems of low welding strength and low welding bonding rate, and achieve the effect of improving welding strength, increasing welding strength, and good wettability

Inactive Publication Date: 2017-12-08
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the tantalum target assembly formed in the prior art has the disadvantages of low welding bonding rate and low welding strength

Method used

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  • Tantalum target material assembly and manufacturing method thereof
  • Tantalum target material assembly and manufacturing method thereof
  • Tantalum target material assembly and manufacturing method thereof

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Embodiment Construction

[0033] The manufacturing method of the tantalum target assembly has the problem of low welding strength of the formed tantalum target assembly.

[0034] Now combined with a manufacturing method of tantalum target components, analyze the reasons for the low welding strength and low welding bonding rate of tantalum target components:

[0035] In the manufacturing method of the tantalum target assembly, diffusion welding is generally used to form the tantalum target assembly. However, diffusion welding has the disadvantages of high cost, high technical equipment requirements, and the backplane material cannot be reused. Brazing has attracted more and more attention because it can solve the above problems well. However, the current popular solders (such as In, SnAgCu, Sn, etc.) have poor wettability to tantalum materials. Therefore, the tantalum target assembly formed by the direct welding of the solder and the back plate has low strength and low welding bonding rate.

[0036] In orde...

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Abstract

The invention provides a tantalum target material assembly and a manufacturing method thereof. The manufacturing method comprises the steps that a tantalum target material, a back board and a solder are provided, wherein the tantalum target material comprises a first welding face, and the back board comprises a second welding face; a wetting layer is formed on the first welding face of the tantalum target material; and after the wetting layer is formed, the first welding face of the tantalum target material and the second welding face of the back board are welded by the solder, and then the tantalum target material assembly is formed. Wettability of the wetting layer and the solder is good, and the bonding force between the wetting layer and the tantalum target material is high. Thus, the wetting layer formed on the first welding face of the tantalum target material can increase the welding intensity of the formed tantalum target material assembly. Accordingly, the manufacturing method can improve the welding intensity of the tantalum target material assembly.

Description

Technical field [0001] The invention relates to the field of sputtering target manufacturing, in particular to a tantalum target assembly and a manufacturing method thereof. Background technique [0002] Target refers to a sputtering source that forms various functional thin films by sputtering coating. Simply put, the target material is the target material bombarded by high-speed energetic particles. In order to ensure that the target material has good electrical and thermal conductivity, the target material needs to be welded to the back plate (materials such as copper or aluminum) before sputtering to form a target assembly. [0003] With the development of the coating process, the application of target components has become more and more extensive. In particular, tantalum targets are widely used in the integrated circuit coating industry and have a broad market prospect. [0004] At the same time, with the development of the semiconductor field, the wafer size continues to exp...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C18/36C23C18/18
CPCC23C14/3414C23C18/1806C23C18/1834C23C18/36
Inventor 姚力军潘杰相原俊夫大岩一彦王学泽段高林
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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