Resin material for cutting diamond wire and resin plate for cutting diamond wire

A technology for diamond wire cutting and resin materials, which is applied in the fields of resin materials for diamond wire cutting and resin plates for diamond wire cutting, and can solve the problems of complex recycling and utilization of solid waste in cutting slurry treatment, high pressure caused by environmental protection, and low hardness.

Inactive Publication Date: 2017-12-29
ZHEJIANG YUHUI SOLAR ENERGY SOURCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, fillers such as aluminum hydroxide and magnesium hydroxide are added to the resin board used in the industry. Although its strength, hardness, elastic modulus and other indicators can meet the cutting needs, after the cutting is completed, the cutting slurry will enter the environmental protection pool for processing. Or recycling, due to the presence of metals in it, the subsequent treatment of cutting slurry or the recycling of solid waste will be more complicated, causing greater pressure on environmental protection, and the cost will be relatively high; in addition, aluminum hydroxide, hydroxide Magnesium and other fillers have low hardness, and are easy to wrap on the wire mesh during cutting, which affects cutting, and the edge chipping rate of silicon wafers is about 3%.

Method used

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  • Resin material for cutting diamond wire and resin plate for cutting diamond wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Add 50 parts of flame retardant silicon dioxide, 3 parts of coupling agent Wolan, and 20 parts of silicon powder with a particle size of 0.5 to 100 μm into 40 parts of epoxy resin, stir well, and then add curing agent three 10 parts of methylhexamethylene diamine, after being fully stirred evenly, spread evenly in the mold by a distributing machine, put it into a constant temperature box at 100°C to cure for 30 minutes, and then cool down naturally to obtain a resin board for diamond wire cutting.

[0042] The resin plate has a Shore hardness of 88, no bending, no deformation, and is suitable for diamond wire cutting of silicon rods; the resin plate for diamond wire cutting prepared in Example 1 is used for slicing silicon rods, and the chipping rate of the slices is 1.3%. .

Embodiment 2

[0044] Add 10 parts of flame retardant tetrabromobisphenol A, two parts of silane coupling agent A-172, 60 parts of silicon powder with a particle size of 0.5 to 100 μm, and 0.1 part of initiator cobalt naphthenate into 40 parts of unsaturated resin , and then add 2 parts of curing agent methyl ethyl ketone peroxide to it, and after fully stirring evenly, spread it evenly in the mold through a distribution machine, enter the constant temperature box at 80°C and cure for 60 minutes, and then cool down naturally to obtain a resin plate for diamond wire cutting.

[0045] The resin plate has a Shore hardness of 90, no bending, no deformation, and is suitable for diamond wire cutting of silicon rods; the resin plate for diamond wire cutting prepared in Example 2 is used for silicon rod slices, and the chipping rate of slices is 0.93%. .

Embodiment 3

[0047] Add 25 parts of flame retardant melamine, 40 parts of silicon powder with a particle size of 0.5 to 100 μm, and 0.1 part of initiator cobalt naphthenate into 40 parts of epoxy resin, and then add 2 parts of curing agent methyl ethyl ketone peroxide , after fully stirring evenly, spread it evenly in the mold through a distribution machine, enter the constant temperature box at 80°C and cure for 60 minutes, and then cool down naturally to obtain a resin plate for diamond wire cutting.

[0048] The resin plate has a Shore hardness of 90, no bending, no deformation, and is suitable for diamond wire cutting of silicon rods; the resin plate for diamond wire cutting prepared in Example 3 is used for slicing silicon rods, and the chipping rate of the slices is 1.2%. .

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Abstract

The invention provides a resin material for cutting a diamond wire and a resin plate for cutting the diamond wire. The resin material for cutting the diamond wire comprises the following components in parts by weight: 20 to 70 parts of synthetic resin, 5 to 50 parts of a flame retardant, 10 to 70 parts of silicon powder and 1 to 20 parts of a curing agent; the flame retardant is selected from one or more of bromine-series flame retardants, nitrogen-series flame retardants, phosphorus-nitrogen-series flame retardants and silicon-series flame retardants. Compared with the prior art, the resin material for cutting the diamond wire takes the silicon powder as filler, and does not take a metal-containing compound as the filler, so that cutting slurry does not require subsequent treatment, environment-protection pressure is lightened, and the cutting slurry is beneficial to cyclic utilization; the characteristics of the resin material are close to the characteristics of a cut silicon rod, which is beneficial to cutting, so that the yield of silicon pieces is high. The shore hardness of the resin plate prepared by the resin material is 80 to 96, and does not have bending or deformation; the edge breakage rate of a silicon rod slice is about 1 percent.

Description

technical field [0001] The invention relates to the technical field of diamond wire cutting, in particular to a resin material for diamond wire cutting and a resin plate for diamond wire cutting. Background technique [0002] Wafer cutting is an important link in the manufacture of photovoltaic solar cells. At present, most of them use diamond wire cutting technology to cut single crystal silicon rods into single crystal silicon wafers. Before using this technology for cutting, the silicon rod needs to be glued to the resin board to fix the position of the silicon rod and facilitate cutting. [0003] At present, fillers such as aluminum hydroxide and magnesium hydroxide are added to the resin board used in the industry. Although its strength, hardness, elastic modulus and other indicators can meet the cutting needs, after the cutting is completed, the cutting slurry will enter the environmental protection pool for processing. Or recycling, due to the presence of metals in i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L101/02C08K3/36C08K5/136C08K5/3492B28D7/00
CPCB28D5/0058C08K3/36C08K5/136C08K5/34922C08K2201/014C08L63/00
Inventor 李仙寿翟蕊孟凡昌
Owner ZHEJIANG YUHUI SOLAR ENERGY SOURCE
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