Resin material for cutting diamond wire and resin plate for cutting diamond wire

Abstract

The invention provides a resin material for cutting a diamond wire and a resin plate for cutting the diamond wire. The resin material for cutting the diamond wire comprises the following components in parts by weight: 20 to 70 parts of synthetic resin, 5 to 50 parts of a flame retardant, 10 to 70 parts of silicon powder and 1 to 20 parts of a curing agent; the flame retardant is selected from one or more of bromine-series flame retardants, nitrogen-series flame retardants, phosphorus-nitrogen-series flame retardants and silicon-series flame retardants. Compared with the prior art, the resin material for cutting the diamond wire takes the silicon powder as filler, and does not take a metal-containing compound as the filler, so that cutting slurry does not require subsequent treatment, environment-protection pressure is lightened, and the cutting slurry is beneficial to cyclic utilization; the characteristics of the resin material are close to the characteristics of a cut silicon rod, which is beneficial to cutting, so that the yield of silicon pieces is high. The shore hardness of the resin plate prepared by the resin material is 80 to 96, and does not have bending or deformation; the edge breakage rate of a silicon rod slice is about 1 percent.

Description

technical field [0001] The invention relates to the technical field of diamond wire cutting, in particular to a resin material for diamond wire cutting and a resin plate for diamond wire cutting. Background technique [0002] Wafer cutting is an important link in the manufacture of photovoltaic solar cells. At present, most of them use diamond wire cutting technology to cut single crystal silicon rods into single crystal silicon wafers. Before using this technology for cutting, the silicon rod needs to be glued to the resin board to fix the position of the silicon rod and facilitate cutting. [0003] At present, fillers such as aluminum hydroxide and magnesium hydroxide are added to the resin board used in the industry. Although its strength, hardness, elastic modulus and other indicators can meet the cutting needs, after the cutting is completed, the cutting slurry will enter the environmental protection pool for processing. Or recycling, due to the presence of metals in i...

AI Technical Summary

Problems solved by technology

[0003] At present, fillers such as aluminum hydroxide and magnesium hydroxide are added to the resin board used in the industry. Although its strength, hardness, elastic modulus and other indicators can meet the cutting needs, after the cutting is completed, the cutting slurry will enter the environmental protection pool for processing. Or recycling, due to the presence of metals in it, the subsequent treatment of cutting slurry or the recycling of solid waste will be more complicated, causing greater pressure on environmental protection, and the cost will be relatively high; in addition, aluminum hydroxide, hydroxide Magnesium and other fillers have low hardness, and are easy to wrap on the wire mesh during cutting, which affects cutting, and the edge chipping rate of silicon wafers is about 3%.

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