Anodic oxidation process for high-silicon high-copper die-cast aluminum and high-silicon high-copper die-cast aluminum alloy

An anodizing, high-copper technology, applied in anodizing, electrolytic coating, surface reaction electrolytic coating, etc., can solve the problems of high hardness, easy "burning, large thickness of oxide film and so on"

Active Publication Date: 2018-01-05
SHANGHAI MIRROR METAL SURFACE TREATMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on the above problems, the purpose of the present invention is to provide an anodic oxidation process for high-silicon and high-copper die-casting aluminum. By adding additives and adjusting power supply parameters, the anodic oxidation can be carried out smoothly, and the obtained oxide film has a large thickness and high hardness. The problem of easy "burning" of silicon high copper die-casting aluminum anodic oxidation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The invention provides an anodic oxidation process of high-silicon and high-copper die-casting aluminum, wherein the electrolytic solution for anodic oxidation includes 100g / L of sulfuric acid and 15g / L of additives, and the additives include glycerin, organic acids, sulfates and fluorides ;

[0027] The temperature of the electrolyte is 15°C;

[0028] The power supply voltage of the anodic oxidation is a high-frequency pulse power supply, the voltage is 60V, the frequency is 2000Hz, the duty cycle is 50%, and the current density is 2A / dm 2 , the oxidation time is 60 minutes;

[0029] The organic acid is selected from citric acid, the sulfate is selected from nickel sulfate, and the fluoride is selected from calcium fluoride.

[0030] According to the above-mentioned anodizing process, for high-silicon and high-copper die-casting aluminum ADC10 (copper content 2.0-4.0, silicon content 7.5-9.5), ADC10 high-silicon and high-copper die-casting aluminum film layer is 50um...

Embodiment 2

[0032] The invention provides an anodic oxidation process of high-silicon and high-copper die-casting aluminum, wherein the electrolytic solution for anodic oxidation includes 400g / L of sulfuric acid and 10g / L of additives, and the additives include glycerin, organic acids, sulfates and fluorides ;

[0033] The temperature of the electrolyte is 5°C;

[0034] The power supply voltage of the anodizing is a variable voltage DC power supply, the voltage is 120V, the frequency is 5-500Hz, the duty cycle is 1-50%, and the current density is 1A / dm 2 , the oxidation time is 90 minutes;

[0035] The organic acid is selected from tartaric acid, the sulfate is selected from barium sulfate, and the fluoride is selected from aluminum fluoride.

[0036] According to the above-mentioned anodizing process, for high-silicon and high-copper die-casting aluminum ADC10 (copper content 2.0-4.0, silicon content 7.5-9.5), ADC10 high-silicon and high-copper die-casting aluminum film layer is 30-40u...

Embodiment 3

[0038] The invention provides an anodic oxidation process of high-silicon and high-copper die-casting aluminum, the electrolyte of the anodic oxidation includes 160g / L of sulfuric acid and 15g / L of additives, and the additives include glycerin, organic acids, sulfates and fluorides ;

[0039] The temperature of the electrolyte is 25°C;

[0040] The power supply voltage of the anodization is DC superimposed pulse power supply, the voltage is 120V, the frequency is 50-200Hz, the duty cycle is 40-70%, and the current density is 3A / dm 2 , the oxidation time is 80 minutes;

[0041] The organic acid is malic acid, the sulfate is manganese sulfate, and the fluoride is calcium fluoride.

[0042] According to the above-mentioned anodizing process, for high-silicon and high-copper die-casting aluminum ADC12 (copper content 1.5-3.5, silicon content 9.6-12), ADC12 high-silicon and high-copper die-casting aluminum film layer is 30-50um, and the hardness is 400-450Hv.

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Abstract

The invention relates to an anodic oxidation process for high-silicon high-copper die-cast aluminum. According to the anodic oxidation process for the high-silicon high-copper die-cast aluminum, glycerinum, organic acid, sulfate and fluoride are added in an electrolyte, the temperature of the electrolyte is controlled to be 5-25 DEG C, and the current density of an anodic oxidation power supply is1-3 A/dm<2>. The problem that due to increase of the silicon-copper content in a high-silicon high-copper die-cast aluminum alloy, anodic oxidation becomes difficult, neither the thickness nor hardness of an oxide film can be ensured, and the performance of the oxide film is poor is solved. As for the high-silicon high-copper die-cast aluminum alloy treated by the anodic oxidation process, the thickness is stabilized to be 30 [mu]m or above and can be 50 [mu]m at most, and the hardness is stabilized to be 400-450 Hv.

Description

technical field [0001] The invention belongs to the technical field of aluminum alloy surface treatment, and in particular relates to a high-silicon, high-copper die-casting aluminum anodic oxidation process and a high-silicon, high-copper die-casting aluminum alloy. Background technique [0002] High-silicon aluminum alloy has been widely concerned because of its easy die-casting formability, good fluidity, excellent machinability and comprehensive mechanical properties. In order to improve the mechanical properties and processability of aluminum alloys, silicon and copper elements are usually added to aluminum alloys: silicon can improve the castability of alloys, improve the high-temperature fluidity of alloys, reduce shrinkage and thermal cracking tendency, and improve wear resistance, etc.; Copper can improve the fluidity, tensile strength and hardness of the alloy; therefore, high-silicon and high-copper die-casting aluminum alloys are widely used in many fields of mac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D11/08C25D11/10C25D11/04
Inventor 王琪包亚亚
Owner SHANGHAI MIRROR METAL SURFACE TREATMENT
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