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Even-plating agent used for electroplating copper and relevant metal copper electroplating combination agent thereof

A technology for electroplating metal and copper electroplating, applied in the field of electroplating metal copper composition and electroplating additives, can solve the problems of uneven current density distribution, difficulty in making fine lines, uneven thickness of surface copper, etc., so as to reduce current efficiency and improve uniformity. The effect of improving the plating ability and improving the fineness of the line

Inactive Publication Date: 2018-01-19
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the electroplating and blind hole filling of high aspect ratio through holes, due to the uneven distribution of current density in the center of the hole and the hole, the thickness of the copper in the hole and the surface is uneven, and the surface copper is too thick. Make fine lines
At present, the existing electroplating additives cannot solve this problem, so how to effectively reduce the thickness of surface copper when electroplating and filling blind holes with high aspect ratio through-holes, and then improve the circuit fineness of today's printed circuit boards, has become an issue in this field. technical issues to be resolved

Method used

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  • Even-plating agent used for electroplating copper and relevant metal copper electroplating combination agent thereof
  • Even-plating agent used for electroplating copper and relevant metal copper electroplating combination agent thereof
  • Even-plating agent used for electroplating copper and relevant metal copper electroplating combination agent thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] In this embodiment, 200mg / L benzoquinone and 10% copper sulfate are used to form a mixed solution system, and a three-electrode system is adopted, wherein the platinum electrode is used as the working electrode, the copper electrode is used as the counter electrode, and the mercuric sulfate electrode is used as the reference electrode; the scanning potential of the workstation is set to 0.5~-0.6V, the scan rate is 0.1V / S, the experiment scans 200 circles and finds that no peak attenuation occurs.

[0104] The standard electrode reduction potential of copper electrodeposition (that is, copper ions change to copper) is -0.342V, but considering the existence of overpotential and other influencing factors (such as electroplating additives, etc.) in the actual process, copper electrodeposition in acidic copper sulfate electroplating solution The potential range is -0.4~-0.78V vs. SSE. In this potential range, copper ions can obtain electrons at the cathode to become copper a...

Embodiment 2

[0106] In this embodiment, Hall cell electroplating is used to measure the effect of using the leveling agent provided by the present invention on the current efficiency.

[0107] This embodiment uses a current density of 4A / dm 2 , the electroplating time is 10min, the electroplating temperature is normal temperature, and the capacity of the Hall tank used for electroplating is 250mL; the plated piece is a 10cm×5cm brass sheet, and the brass sheet needs to be degreased, micro-etched, and pre-dipped before electroplating. , Washing treatment. The anodes used in electroplating are phosphor copper anodes. Table 1 shows the electroplating metal copper composition used in Hall cell electroplating and the calculated current efficiency.

[0108] The basic electroplating solution formula used in this embodiment is as follows:

[0109]

[0110] The calculation of current efficiency in the present embodiment is obtained according to Faraday's law M=k*I*t, wherein k is the electroc...

Embodiment 3

[0117] In this implementation, a Harlem cell is used to test the throwing ability of a double-sided printed circuit board with through holes electroplated with the plating formulation containing the throwing agent provided by the present invention.

[0118] The thickness of the test board used in this embodiment is 1.6 mm, and the diameter of the through hole is 250 μm. The test board is double-sided and its size is 10cm×5cm; the temperature of the plating solution is normal temperature, and the plating density is 2A / dm 2 , the electroplating time is 70min, and the stirring method is cathode bubbling; the capacity of the Harlem cell used for electroplating is 1.5L.

[0119] The basic electroplating formula used in this embodiment is the same as that of Example 1 as follows.

[0120] Before electroplating, the test board is subjected to acid degreasing and pre-dipping process to remove the surface contamination of the test board.

[0121] In this example, the electroplating a...

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Abstract

The invention discloses an even-plating agent used for electroplating copper and a relevant metal copper electroplating formula, and belongs to the technical field of electroplating and electro-deposition. The even-plating agent is one or more organic matters containing a first kind of active functional group or a second kind of active functional group; the first kind of active functional group and the second kind of active functional group are conjugate; and the reduction potential of the organic matters containing the active functional group under an electrochemical system is not higher thanthe reduction potential of copper electro-deposition so that the active functional group in the even-plating agent can have a competitive reaction with copper ions, the copper deposition current efficiency of a cathode is reduced, reduction of the thickness of surface copper is facilitated, the even-plating agent is especially suitable for improving the throwing power of electroplating and blindhole filling of through holes with high ratios of thickness to diameter, and thus the circuit fineness of existing printed circuit boards is improved.

Description

technical field [0001] The invention belongs to the technical field of electroplating and electrodeposition, and in particular relates to an electroplating additive used in the process of electroplating metal copper to improve the throwing ability of a plating solution and a related electroplating metal copper composition. Background technique [0002] With the development of electronic products in the direction of multi-function, high density, light and fast, printed circuit board (Printed circuit board, PCB) as an indispensable carrier in electronic products also develops accordingly, high density interconnection (High density interconnection, HDI ) technology came into being. HDI technology is a printed circuit board manufacturing technology that improves wiring density through through holes, blind holes, and buried holes. In the HDI printed board process, hole metallization is the most important process. With the increase of the number of HDI board layers, the thickness...

Claims

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Application Information

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IPC IPC(8): C25D3/38
Inventor 郑莉王翀朱凯陈苑明何为周国云王守绪
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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