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Mask plate and mask plate manufacturing method

A mask and mask technology, used in semiconductor/solid-state device manufacturing, vacuum evaporation coating, coating and other directions, can solve the problems affecting the quality of evaporation products, affecting the flat state of the effective area of ​​evaporation, and surface wrinkles. The effect of improving the flat state, improving the yield, and improving the wrinkle state

Active Publication Date: 2020-04-14
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the fine metal mask (FMM Sheet) will have wrinkles on the surface after stretching, which will affect the flatness of the evaporation effective area, and then affect the quality of the evaporation product

Method used

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  • Mask plate and mask plate manufacturing method
  • Mask plate and mask plate manufacturing method

Examples

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Embodiment Construction

[0027] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details being omitted, or other methods, components, devices, steps, etc. may be adopted. In other instances, well-known technical solution...

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Abstract

The present disclosure relates to a mask and a method for manufacturing the mask, and relates to the field of display technology. The mask plate includes a plurality of mask units, and the mask unit includes an effective evaporation area and a plurality of welding areas distributed according to preset rules around the effective area of ​​evaporation, and the mask units located in the edge area of ​​the mask plate are connected to the mask plate The distribution of welding areas around the effective evaporation area of ​​the mask unit in the inner area is consistent. The present disclosure can not only help to improve the wrinkle state of the mask unit in the central area of ​​the mask plate, but also can improve the wrinkle state of the mask unit in the edge area of ​​the mask plate, thereby improving the wrinkle state of the entire mask plate, and further improving the The flatness of the surface of the board can improve the quality and yield of evaporation products.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular, to a mask and a method for manufacturing the mask. Background technique [0002] With the development of optical technology and semiconductor technology, flat panel displays represented by liquid crystal display (Liquid Crystal Display, LCD) and organic light emitting diode display (Organic Light Emitting Diode, OLED) have the advantages of light and thin, low energy consumption, fast response speed, color The characteristics of good purity and high contrast ratio occupy a dominant position in the display field. Among them, in the semiconductor manufacturing process, the photolithography process is a very important link, and the main function of the photolithography process is to copy the pattern on the mask plate to the silicon wafer, so as to prepare for the next etching or ion implantation process. . [0003] In the mask manufacturing process, such as the fine me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/04C23C14/24H01L51/56H10K99/00
CPCC23C14/042H10K71/166H10K71/00H10K71/164
Inventor 林治明黄俊杰张健白音必力郝志元辛小林张德刘旭张新建
Owner BOE TECH GRP CO LTD
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