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Carbon nano-tube modified epoxy adhesive and preparation method thereof

A carbon nanotube modification, epoxy adhesive technology, used in epoxy resin glue, adhesives, adhesive additives and other directions, can solve the problem of poor dispersion of carbon nanotubes, affecting the storage stability of adhesives, industrial App restrictions, etc.

Inactive Publication Date: 2018-02-02
鹤山市海特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, simple addition of carbon nanotubes will cause poor dispersion of carbon nanotubes in the adhesive, and stratification will occur after long-term storage, which will affect the storage stability of the adhesive.
Therefore, its industrial application is greatly limited

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Add 10 parts of epoxy reactive diluent to 100 parts of CYD128 epoxy resin, stir and heat to 50°C, add 15 parts of nanomaterials, mix well, and stir evenly; add 17 parts of curing agent (704), and stir evenly Get epoxy adhesive.

[0019] The mechanical properties of the adhesive prepared in Example 1 are shown in Table 1. The shear strength is tested according to GB 7124-86, using a universal material testing machine, and the impact strength is tested according to GB / T 2567 2008, using a ZBC-4 pendulum Impact testing machine testing.

[0020] Table 1

[0021] performance item

Embodiment 2

[0023] Add 15 parts of epoxy reactive diluent (501) to 100 parts of CYD128 epoxy resin, stir and heat to 50°C, add 12 parts of nanomaterials, mix well, and stir evenly; add 20 parts of curing agent (704), stir A new type of epoxy adhesive can be obtained evenly. The mechanical properties of the adhesive prepared in Example 2 are shown in Table 2.

[0024] Table 2

[0025] performance item

Embodiment 3

[0027] Add 17 parts of epoxy reactive diluent (501) to 100 parts of CYD128 epoxy resin, stir and heat to 50°C, add 10 parts of nanomaterials, mix well, and stir evenly; add 14 parts of curing agent (704), stir A new type of epoxy adhesive can be obtained evenly. The mechanical properties of the adhesive prepared in Example 3 are shown in Table 3.

[0028] table 3

[0029] performance item

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PUM

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Abstract

The invention discloses a carbon nanotube modified epoxy adhesive, which consists of the following raw materials in parts by weight: 100 parts of CYD128 epoxy resin, 5-25 parts of epoxy reactive diluent, and 5-15 parts of carbon nanotubes , 15-25 parts of curing agent (704). Carbon nanotubes have a hollow tubular network structure and a quasi-one-dimensional material with an aspect ratio as high as 100-1000. Due to the good axial stability of carbon nanotubes, they show good resistance to deformation, and have extremely high strength, toughness and elastic modulus. Surface loaded SiO2 can further increase the surface area of ​​the product and strengthen the toughening effect. After modification with silane coupling agent A1160, the composite nanomaterials can be uniformly dispersed in the adhesive, avoiding agglomeration, and maintaining the stability of the adhesive. The preparation process of the epoxy adhesive is simple and easy for industrial production.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a carbon nanotube modified epoxy adhesive and a preparation method thereof. technical background [0002] Epoxy resin glue is an important thermosetting resin glue. Because of its excellent physical and mechanical properties, electrical insulation properties, chemical corrosion resistance, heat resistance and good bonding performance, epoxy resin adhesives formulated with it It is known as "universal glue". Epoxy resin glue has low toxicity, low volatility, wide matching ratio, easy operation, can be cured at room temperature, strong adhesion, good toughness, and is obviously superior to general monomer amine adhesives. Therefore, it is widely used in bonding various metal and non-metal materials, such as steel, aluminum, ceramics, glass, plastics, etc., for preparing polyamide anti-corrosion coatings, pasting glass, casting electrical appliances, sealing electronic components...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04
CPCC09J163/00C08K7/24C08K9/02C08K9/06C08K2201/011C09J11/04
Inventor 郑伟洲
Owner 鹤山市海特新材料有限公司