Semiconductor silicon abraded wafer cleaning agent and preparation method thereof

A cleaning agent, a technology of silicon grinding tablets, applied in the directions of detergent compounding agent, detergent composition, chemical instrument and method, etc., to achieve the effect of simple production process, simple operation and good commercial development prospects

Inactive Publication Date: 2018-02-13
天津鑫泰士特电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although there have been R&D and production companies of silicon abrasive cleaning agents in China in recent years, in general, there is no company whose products can be imported and occupy a place in the domestic market.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] Embodiments of the present invention are described in further detail below:

[0022] A cleaning agent for semiconductor silicon grinding discs, comprising a surfactant, an organic base, a complexing agent, a cosolvent and water, the composition and content of the cleaning agent in volume percentages are as follows: 1-15% of the surfactant; 1-15% of the organic base 3-5%; complexing agent 2-10%; cosolvent 3-10%; water 60-80%;

[0023] Wherein, the surfactant is selected from sodium dodecylbenzenesulfonate, nonylphenol polyoxyethylene ether, fatty alcohol polyoxyethylene ether or a combination thereof;

[0024] The organic base is selected from one or both of the following components: triethanolamine, tetramethylammonium hydroxide;

[0025] The complexing agent is selected from one or more of the following: disodium ethylenediaminetetraacetic acid, sodium citrate and ethylenediaminetetraacetic acid;

[0026] The co-solvent is selected from glycerol, ethanol, isopropanol...

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PUM

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Abstract

The invention discloses a semiconductor silicon abraded wafer cleaning agent and a preparation method thereof. The cleaning agent is prepared from a surface active agent, organic alkali, complexing agent, cosolvent and water. The cleaning agent is prepared from the following ingredients in percent by volume: 1 to 15% of the surface active agent, 3 to 5% of the organic alkali, 2 to 10% of the complexing agent, 3 to 10% of the cosolvent and 60 to 80% of the water. The cleaning agent prepared from the ingredients in percent by volume has advantages of simpleness in silicon wafer cleaning operation, no complex cleaning step, low cost, no pollution and special suitability for cleaning silicon carbide abraded silicon wafers.

Description

technical field [0001] The invention relates to the technical field of cleaning agents for silicon grinding discs, in particular to a cleaning agent for semiconductor silicon grinding discs and a preparation method thereof. Background technique [0002] Semiconductor silicon material processing technology: cutting, grinding, chemical mechanical polishing, cleaning and other processes. [0003] Now 12-inch large-diameter silicon single-crystal substrates have become the mainstream technology of IC manufacturing. There are only 8 300mm FAB foundries under construction or proposed in mainland China, and there are many 200mm FAB factories, which have a great demand for cleaning agents. , The unit manufacturing cost of semiconductor silicon wafers increases, and the yield rate plays a key role in the cost, so the optimization of the process and the stability of the cleaning agent performance become extremely critical. High product quality requirements require good selectivity an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/83C11D1/72C11D1/22C11D3/60C11D3/26C11D3/20C11D3/30
CPCC11D1/83C11D1/22C11D1/72C11D3/2082C11D3/26C11D3/30
Inventor 石建伟
Owner 天津鑫泰士特电子有限公司
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