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Tin alloy for copper alloy hot galvanizing and preparation method thereof

A technology of tin alloy and copper alloy, which is applied in the field of tin alloy for copper alloy hot-plating and its preparation, can solve the problems of short circuit of electronic connector or integrated circuit board, long residence time at room temperature, etc., and achieve low cost and simple alloy composition Effect

Inactive Publication Date: 2018-02-16
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Pure tin should not be directly used in the hot-dip plating process. The main reason is that the long residence time at room temperature or high temperature work will easily cause conductive whiskers to form on the surface of the hot-dip tin material, causing short circuits in electronic connectors or integrated circuit boards. It is of great significance to study tin-based alloys for hot-dip copper alloy materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A tin alloy for copper alloy hot-plating is characterized in that, is made up of the element of following mass fraction: the Zn of 3.0%, the Mg of 0.5%, the Bi of 0.5%, the Cu of 0.2%, the RE of 0.05%, surplus is Sn and unavoidable impurity elements; the RE is a mixture of La and Ce in a mass ratio of 60:40; the purity of the RE is more than 99.9% based on the sum of the mass fractions of La and Ce;

[0025] The preparation method of described tin alloy comprises the following steps:

[0026] (1) Preparation of master alloy: The preparation method of master alloy SnCu7 includes the following steps: Weigh pure Sn and pure Cu according to the mass ratio of 93:7, put them into a water-cooled copper-jacketed vacuum non-consumable melting furnace, and evacuate into the furnace The pressure is 0.007Pa, then filled with argon gas to 0.2-0.3MPa, arc melting until the ingredients are completely melted, and the arc is turned off to cool the melt until it is completely solidified,...

Embodiment 2

[0030] A tin alloy for copper alloy hot-plating is characterized in that, is made up of the element of following mass fraction: the Zn of 8.0%, the Mg of 0.75%, the Bi of 1.75%, the Cu of 0.25%, the RE of 0.075%, surplus is Sn and unavoidable impurity elements; the RE is a mixture of La and Ce in a mass ratio of 60:40; the purity of the RE is more than 99.9% based on the sum of the mass fractions of La and Ce;

[0031] The preparation method is the same as in Example 1. The performance indicators of the tin alloy in this example are: standard electrode potential 0.1461V, melting point 203.9°C, tensile strength 90.1MPa, and elongation 14.2%.

Embodiment 3

[0033] A tin alloy for copper alloy hot-plating, is characterized in that, is made up of the element of following mass fraction: the Zn of 11.0%, the Mg of 1.0%, the Bi of 3.0%, the Cu of 0.3%, the RE of 0.1%, surplus is Sn and unavoidable impurity elements; the RE is a mixture of La and Ce in a mass ratio of 60:40; the purity of the RE is more than 99.9% based on the sum of the mass fractions of La and Ce;

[0034] The preparation method is the same as in Example 1. The performance indicators of the tin alloy in this example are: standard electrode potential 0.0680V, ​​melting point 211.8°C, tensile strength 97.63MPa, and elongation 14.7%.

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Abstract

The invention discloses a tin alloy for copper alloy hot galvanizing. The tin alloy consists of the following elements in mass fraction: 1.5-11.0% of Zn, 0.2-1.0% of Mg, 0.2-3.5% of Bi, 0.1-0.5% of Cu, 0.05-0.2% of RE and the balance of Sn and inevitable impurity elements. The tin alloy has the advantages that components of the alloy are relatively simple, the cost is low, IMC thickness of a hot coating is small, and is small in increasing trend, cavities and crystal whiskers are liable to generate in use and the like, and can be used for hot galvanizing and deep processing of copper and the copper alloy. A copper plate belt product subjected to hot galvanizing treatment through the alloy disclosed by the invention is mainly used for manufacturing various electronic connectors, electronicsplicing parts and the like in the fields such as integrated circuits, electronic electrical apparatuses, intelligent equipment and the automobile industry.

Description

technical field [0001] The invention relates to the field of metal coating materials, in particular to a tin alloy for copper alloy hot-plating and a preparation method thereof. Background technique [0002] Tinned copper alloy strips are widely used in high-end fields such as aerospace, military industry, automobiles, communications and electronics. Although my country's copper strip industry continues to develop, tinned copper alloy strips still cannot meet market demand. At present, the research on the structure, performance and production process of the tin-plated layer of copper alloy strips mainly focuses on the research of electro-tin plating. The main advantage of electro-tin plating is that the thickness of the coating metal can be controlled at will, but its production process is cumbersome and the operation requirements are strict. , The price of electroplating equipment is high, and the composition of electroplating solution is complex. [0003] Hot-dip plating ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00C22C13/02C22C1/03C23C2/08
Inventor 田保红张毅刘玉亮王冰洁孙国强李武会殷婷田然赵转张晓辉刘勇李全安王顺兴
Owner HENAN UNIV OF SCI & TECH
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