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Manufacturing method of LED light source manufactured through vacuum sputtering technology

An LED light source, vacuum sputtering technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of device pollution failure, blackening of the silver-plated layer at the bottom of the bracket, gold wire breakage, etc., to improve reflectivity and gloss. , Various effects of forming process

Pending Publication Date: 2018-02-16
SHENZHEN SMALITE OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most serious silver layer has reacted, and the gold wire is broken, causing the LED to open
[0003] As we all know, the airtightness of the LED bracket is not good, especially at high temperature, it is more likely to cause device pollution and failure, and the silver plating layer at the bottom of the bracket turns black, which reduces the reliability of the device

Method used

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  • Manufacturing method of LED light source manufactured through vacuum sputtering technology
  • Manufacturing method of LED light source manufactured through vacuum sputtering technology
  • Manufacturing method of LED light source manufactured through vacuum sputtering technology

Examples

Experimental program
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Effect test

specific Embodiment approach 1

[0020] Specific implementation mode one: as Figure 1-6 As shown, this specific embodiment adopts the following technical scheme: it includes a base material 1, a bracket filling glue material a, an LED bracket 2, a fluorescent glue 3, a chip 4, a gold wire 5 and an air-avoiding device 6, and the top of the base material 1 passes through The base material filling glue a is fixedly connected with the LED bracket 2, and the upper middle part of the LED bracket 2 is provided with an air-avoiding device 6, and a chip 4 is installed above the air-avoiding device 6, and a gold wire 5 is welded on the chip 4, and the chip 4 Fluorescent glue 3 is packaged above the gold wire 5 .

[0021] As a preference, the bottom of the LED bracket 2 is an inverted T-shaped design.

[0022] Preferably, materials such as copper, silver, tin, nickel, or zinc are deposited on the upper surface of the substrate 1 by vacuum sputtering technology.

[0023] Further preferably, an aluminum oxide layer, a ...

specific Embodiment approach 2

[0025] Specific implementation mode two: refer to Figure 7 The difference between this specific embodiment and specific embodiment 1 is that: the upper surface of the substrate 1 is treated in a different way, wherein, the upper surface of the substrate 1 is sequentially deposited three layers from bottom to top by vacuum sputtering technology. Aluminum oxide layer, titanium dioxide and silver mixed layer, titanium dioxide and silicon dioxide mixed layer, titanium dioxide layer; other compositions and connections are the same as those in the first embodiment.

specific Embodiment approach 3

[0026] Specific implementation mode three: refer to Figure 8 The difference between this specific embodiment and specific embodiment 1 is that: the upper surface of the substrate 1 is treated in a different way, wherein, the upper surface of the substrate 1 is sequentially deposited three layers from bottom to top by vacuum sputtering technology. Aluminum oxide thin film layer, titanium dioxide and silver mixed layer, aluminum oxide layer, titanium dioxide layer; other compositions and connections are the same as those in the first embodiment.

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Abstract

The invention discloses a manufacturing method of an LED light source manufactured through a vacuum sputtering technology, and relates to the technical field of LED light sources. The upper part of the a base material is fixedly connected with an LED support through a base material filled rubber material; an avoiding device is arranged at the middle part of the upper part of the LED support; a chip is mounted above the avoiding device; the chip is welded with a gold thread; and fluorescence rubber is packaged inside the chip and the upper part of the gold thread. The main body of the base material is selected from an aluminum material, through the vacuum sputtering technology, the material such as copper, silver, tin, nickel or zinc is deposited at the upper part of the specific base material to form an easily welded interface, and an LED packaging support aluminum material is manufactured, so that the technology protects the surface of the material from being vulcanized, brominated and oxidized, and the reflectivity and glossiness of the base material are improved. Titanium oxide on the surface and the thicknesses of titanium oxide and silver layers are controlled, routing and positive and negative tin soldering functions on the substrate surface of the special LED support can be realized, and the forming processing technology of the special LED support is varied.

Description

technical field [0001] The invention relates to a method for manufacturing an LED light source manufactured by vacuum sputtering technology, and belongs to the technical field of LED light sources. Background technique [0002] Since the advent of LED, it has been widely valued and developed rapidly, which is inseparable from its own advantages. These advantages are summarized as follows: high brightness, low operating voltage, low power consumption, miniaturization, long life, impact resistance and stable performance. The development prospect of LED is very broad, and it is currently developing towards higher brightness, higher weather resistance, higher luminous density, and higher luminous uniformity. However, in the actual process of producing and using LED products, problems such as "product vulcanization (including vulcanization, halogenation, oxidation and other pollution phenomena) leading to product failure" are often encountered. These problems bring certain losse...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/60
CPCH01L33/483H01L33/60H01L33/62H01L2933/0066H01L2933/0058H01L2933/0033
Inventor 李俊东柳欢陈健平刘云
Owner SHENZHEN SMALITE OPTOELECTRONICS CO LTD
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