Low-melting point thermoplastic polyurethane adhesive and preparation method thereof
A thermoplastic polyurethane and adhesive technology, used in polyurea/polyurethane adhesives, adhesives, adhesive additives, etc., can solve the problems of low peel strength, poor washing resistance, high processing and bonding temperature, and achieve improved processing and Excellent effect of thermal bonding performance, low initial flow temperature and low temperature resistance
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Embodiment 1
[0027] A low melting point thermoplastic polyurethane adhesive, which is mainly prepared from the following raw materials by weight fraction:
[0028]
[0029] (1) polybutylene sebacate diol (M-500), two (2,6)-diisopropyl carboimide, antioxidant 1010 joins in reactor A by weight percentage, nitrogen protection , keep the temperature of reactor A at 95°C, and fully stir in reactor A evenly. Add MDI to reactor B by weight percentage, protect the reactor with nitrogen, and keep the temperature of the reactor at 40°C. Add 1,6-hexanediol into reactor C according to the weight percentage, under nitrogen protection, keep the temperature of the reactor at 55°C, and fully stir in reactor C evenly.
[0030] (2) When the temperature of each reactor is stable, through the perfusion system with accurate metering, the raw material components in the reactors A, B and C are accurately metered by the metering pump according to the weight percentage of each component in the three reactors. ...
Embodiment 2
[0032] A low melting point thermoplastic polyurethane adhesive, which is mainly prepared from the following raw materials by weight fraction:
[0033]
[0034] The specific preparation process is the same as in Example 1, the difference being that the temperature of the reactor A is 100°C, the temperature of the reactor B is 50°C, and the temperature of the reactor C is 50°C; and radial shear dispersion for 3 minutes; the temperature of the twin-screw extruder was 165°C, and the screw speed was 170rmp.
Embodiment 3
[0036] A low melting point thermoplastic polyurethane adhesive, which is mainly prepared from the following raw materials by weight fraction:
[0037]
[0038] The specific preparation process is the same as in Example 1, except that the hydrolysis-resistant agent is monocarbodiimide; the holding temperature of reactor A is 98°C, the holding temperature of reactor B is 60°C, and the holding temperature of reactor C is 58°C; In the twin-screw premixing unit, it was dispersed by high-speed axial and radial shearing for 5 minutes; the temperature of the twin-screw extruder was 160°C, and the screw speed was 180rmp.
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Abstract
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