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LIM low-oil-powder-separation high-electric-conductive silicone rubber composition and preparation method of same

A silicone rubber composition, high conductivity technology, applied in the field of LIM low oil powder separation high conductivity silicone rubber composition and its preparation, can solve problems such as oil powder separation, to improve production efficiency, improve conductivity stability and pass rate , Improve the effect of mechanical properties

Active Publication Date: 2018-03-02
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a LIM low-oil-powder-separation high-conductivity silicone rubber composition and its preparation method to solve the problem of oil-powder separation in the injection molding process of the existing conductive silicone rubber composition

Method used

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  • LIM low-oil-powder-separation high-electric-conductive silicone rubber composition and preparation method of same
  • LIM low-oil-powder-separation high-electric-conductive silicone rubber composition and preparation method of same
  • LIM low-oil-powder-separation high-electric-conductive silicone rubber composition and preparation method of same

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Embodiment 1

[0052] A preparation method of a LIM low-oil powder separation high-conductivity silicone rubber composition, comprising the following steps:

[0053] Step 1: Base rubber preparation: 50 parts by mass of vinyl-terminated silicone oil of 10000mPa·s, 20 parts by mass of vinyl-terminated silicone oil with a specific surface area of ​​300mPa 2 / g of fumed silica, 5 parts by mass of hexamethylsilazane and 1 part by mass of water were added to the kneader, stirred at room temperature for 1 hour, then heated to 150°C and continued to stir for 2 hours, and finally added 50 parts by mass of Dilute with 10000mPa·s vinyl-terminated silicone oil, and obtain base rubber after cooling;

[0054] Step 2: Preparation of component A: Add 100g of the base glue prepared in step 1, 55.88g of 20um silver-coated glass powder, 223.52g of 45um silver-coated glass powder, 4.19g of vinyltriethoxysilane A151, and 18.73g in a planetary mixer D40 solvent oil, 0.27g Castel platinum catalyst (3000ppm), warm...

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Abstract

The invention relates to a LIM low-oil-powder-separation high-electric-conductive silicone rubber composition including: 100 parts of first organo-polysiloxane, 5-25 parts of second organo-polysiloxane, 15-25 parts of first white carbon black, 2-8 parts of second white carbon black, 5-10 parts of silazane, 1-2 parts of water, 0.05-0.15 parts of a platinum-based catalyst, 0.005-0.01 parts of an inhibitor, 250-500 parts of a metal-based electric-conductive filler, 1-10 parts of a silane coupling agent, and 5-50 parts of a volatile diluent. By adding the silane coupling agent, compatibility between the first organo-polysiloxane and the metal-based electric-conductive filler is improved, and then the second white carbon black is added to form a hydrogen bond network, thus cooperatively reducing the oil-powder separation between the first organo-polysiloxane and the metal-based electric-conductive filler. The composition can be used for injection moulding of complex products and can improvequalification rate of the products. In addition, the invention also provides a preparation method of the LIM low-oil-powder-separation high-electric-conductive silicone rubber composition. The methodincludes the steps of preparing base rubber, preparing a component A, preparing a component B and shaping the composition.

Description

technical field [0001] The invention relates to a LIM low-oil powder separation high-conductivity silicone rubber composition and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of electronic technology, the number of various wireless communication systems and high-frequency electronic devices has increased sharply, and the problems of electromagnetic interference (EMI) and electromagnetic compatibility (EMC) caused by electromagnetic waves have become increasingly serious, which not only cause interference and damage to electronic equipment , but also pollute the environment and endanger human health. At present, more powerful functions are continuously integrated into smaller components in electronic equipment. Traditional soldering can no longer meet the requirements of environmental sealing and electromagnetic sealing functions. Therefore, in order to solve the problems of environmental sealing and electromagnetic s...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K13/06C08K9/06C08K3/36C08K3/40
CPCC08L83/04C08L2205/025C08L2205/035C08L2205/05C08K2201/014C08K2201/001C08K2201/006C08K13/06C08K9/06C08K3/36C08K3/40Y02W30/62
Inventor 胡杨飞
Owner PINGHU ALLIED IND
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