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A technology of acid and alkali resistance and tape, applied in the direction of adhesives, non-polymer adhesive additives, film/flake adhesives, etc., can solve problems such as poor production efficiency, achieve stable product quality, low material cost, The effect of good acid and alkali resistance
Inactive Publication Date: 2018-03-02
张永宏
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Summary
Abstract
Description
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Problems solved by technology
At present, the manufacturing process of FPC is still a single-layer operation, and the production efficiency is poor, which can be further improved.
Method used
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Embodiment 1
[0011] An acid and alkali resistant tape, the tape is composed of a base layer and an adhesive layer, and the adhesive layer is made of the following components by weight: 22-35 parts of high styrene rubber, 1.2-1.4 parts of titanate coupling agent Parts, 8-12 parts of ethanol, 16-18 parts of hexamethylene diisocyanate, 16-23 parts of dioctyl phthalate, 1.3-1.5 parts of silicon dioxide, 12-16 parts of polyacrylate rubber, styrene 20-25 parts of butadiene copolymer, 12-16 parts of benzyl salicylate, 6-10 parts of ethyl silicate, 8-16 parts of methyltriethoxysilane, 5.5-10 parts of triethylamine, poly 15-19 parts of imide, 5-10 parts of activated carbon, 14-20 parts of sodium propylene sulfonate, 2-5 parts of polyester resin, 4-8 parts of dimethyl silicone oil, 0.4-0.5 parts of sodium hexametaphosphate, benzene Ethylene 12-14 parts.
Embodiment 2
[0013] An acid and alkali resistant tape, the tape is composed of a base layer and an adhesive layer, the adhesive layer is made of the following components by weight: 26 parts of high styrene rubber, 1.4 parts of titanate coupling agent, 12 parts of ethanol Parts, 16 parts of hexamethylene diisocyanate, 16 parts of dioctyl phthalate, 1.3 parts of silicon dioxide, 16 parts of polyacrylate rubber, 22 parts of styrene butadiene copolymer, 13 parts of benzyl salicylate 9 parts of ethyl silicate, 15 parts of methyltriethoxysilane, 9 parts of triethylamine, 15 parts of polyimide, 6 parts of activated carbon, 15 parts of sodium propylene sulfonate, 2-4 parts of polyester resin , 4-8 parts of dimethyl silicone oil, 0.4-0.5 parts of sodium hexametaphosphate, 12-14 parts of styrene.
[0014] The invention provides an acid and alkali resistant adhesive tape. The novel adhesive tape of the invention has low application cost, low material cost, easy realization, stable product quality, go...
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PUM
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Abstract
The invention provides an acid and alkali resistant adhesive tape. The adhesive tape is composed of a base layer and an adhesive layer, wherein the adhesive layer is prepared from the following components in parts by weight: 22-35 parts of high styrene rubber, 1.2-1.4 part of a titanate coupling agent, 8-12 parts of ethanol, 16-18 parts of hexamethylene diisocyanate, 16-23 parts of dioctyl phthalate, 1.3-1.5 parts of silicon dioxide, 12-16 parts of polyacrylate rubber, 20-25 parts of a styrene-butadiene copolymer, 12-16 parts of benzyl salicylate, 6-10 parts of ethyl silicate, 8-16 parts of methyl triethoxysilane, 5.5-10 parts of triethylamine, 15-19 parts of polyimide, 5-10 parts of activated carbon, 14-20 parts of sodium allylsulfonate, 2-5 parts of polyester resin, 4-8 parts of dimethylsilicone oil, 0.4-0.5 parts of sodium hexametaphosphate and 12-14 parts of styrene. The invention provides the acid and alkali resistant adhesive tape. According to the novel adhesive tape provided by the invention, the application cost is low, the material cost is low, the implementation is easy, and the produced product is stable in quality, has good acid and alkali resistance and has relatively high popularization and application values.
Description
technical field [0001] The invention relates to the field of adhesive tapes, in particular to an acid and alkali resistant adhesive tape. Background technique [0002] With the rapid development of electronic technology, the physical size of integrated circuits is gradually reduced, and the degree of integration is constantly improving. The manufacturing process of FPC so far is almost always processed by subtractive method, also known as etching method. Usually, copper clad board is used as the starting material, and the resist layer is formed by photolithography, and the unnecessary part of the copper surface is etched to form a circuit conductor. , and then press the cover film under high temperature and high pressure to form a circuit board. In this circuit board forming process, acid and alkali resistant and high temperature resistant tape is required to protect the copper clad board so that it will not be eroded by the acid and alkali liquid to the photoetched circuit...
Claims
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Application Information
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