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Light-duty high-temperature-resistant and high-specific-surface-area polyimide conductive pulp and preparation method therefor

A polyimide pulp, high specific surface area technology, used in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. Resistant to bending and other problems, to achieve the effect of high specific surface area, small equipment investment and simple process

Active Publication Date: 2018-04-03
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, conductive materials with a certain specific surface area obtained by coating metal particles on the surface of non-metallic substrates have become a new research direction, such as conductive glass fibers, which can withstand high temperatures, but conductive glass fibers are brittle. , not resistant to bending, and the density is too high, close to the density of metal elements, so it cannot meet the requirements in some light-weight and high-strength application fields
Such materials often have relatively single performance, and cannot simultaneously have the properties of light weight, high temperature resistance, high specific surface area, and high electrical conductivity.

Method used

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  • Light-duty high-temperature-resistant and high-specific-surface-area polyimide conductive pulp and preparation method therefor
  • Light-duty high-temperature-resistant and high-specific-surface-area polyimide conductive pulp and preparation method therefor
  • Light-duty high-temperature-resistant and high-specific-surface-area polyimide conductive pulp and preparation method therefor

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preparation example Construction

[0025] The invention provides a light-weight, high-temperature-resistant, high-specific-surface-area polyimide conductive pulp and a preparation method thereof, the method comprising:

[0026] (1) Get polyamic acid fiber pulp and disperse evenly in deionized water;

[0027] (2) add ammoniacal liquor to the dispersion liquid of step (1), settle out after keeping certain hour, clean;

[0028] (3) adding the pulp obtained in step (2) into the metal salt solution, settling out after keeping for a certain period of time, and cleaning;

[0029] (4) placing the pulp obtained in step (3) in a reducing solution, keeping it for a certain period of time, and then settling out and cleaning;

[0030] (5) repeat steps (3) and (4) to obtain the polyamic acid pulp with metal layer on the surface;

[0031] (6) Heating the pulp obtained in step (5) to obtain polyimide pulp with a metal layer on the surface.

[0032] According to the method of the present invention, preferably:

[0033] In s...

Embodiment 1

[0044] This embodiment is used to illustrate one polyimide conductive pulp material and its preparation method of the present invention.

[0045] (1) Take 1g of polyamic acid fiber pulp and evenly disperse it in 100mL of deionized water;

[0046] (2) Add 1 mL of ammonia water to the dispersion in step (1) for 30 seconds at room temperature to form an organic ammonium salt on the pulp surface;

[0047] (3) adding the pulp obtained in step (2) to 35°C, 0.01M silver ammonia solution;

[0048] (4) placing the pulp obtained in step (3) at 35°C in a 0.5M glucose solution;

[0049] (5) repeating steps (3) and (4) 10 times can obtain the polyamic acid pulp with silver layer on the surface;

[0050] (6) The pulp obtained in step (5) is raised from room temperature to 350° C. at a heating rate of 10° C. / min.

Embodiment 2

[0052] This embodiment is used to illustrate one polyimide conductive pulp material and its preparation method of the present invention.

[0053] (1) Take 1g of polyamic acid fiber pulp and evenly disperse it in 100mL of deionized water;

[0054] (2) Add 1 mL of ammonia water to the dispersion in step (1) for 30 seconds at room temperature to form an organic ammonium salt on the pulp surface;

[0055] (3) adding the pulp obtained in step (2) to 35°C, 0.01M silver ammonia solution;

[0056] (4) placing the pulp obtained in step (3) at 35°C in 1M glucose solution;

[0057] (5) repeating steps (3) and (4) 10 times can obtain the polyamic acid pulp with silver layer on the surface;

[0058] (6) The pulp obtained in step (5) is raised from room temperature to 350° C. at a heating rate of 10° C. / min.

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Abstract

The invention discloses light-duty high-temperature-resistant and high-specific-surface-area polyimide conductive pulp and a preparation method therefor, and belongs to the technical field of conductive materials. Polyimide pulp is taken as a skeleton carrier, and a surface layer of the polyimide pulp is a high-conductivity or high-thermal-conductivity metal layer. The method comprises the steps:firstly scattering the polyimide pulp in deionized water in a uniform manner; secondly adding ammonia water to the deionized water, placing the polyimide pulp in a metal saline solution after settlingout, and enabling the polyimide pulp to carry metal ions; thirdly carrying out the reduction of the metal ions in a reducing solution; finally carrying out the high-temperature thermal processing ofpolyamide acid pulp carried by metal, thereby obtaining the polyimide conductive pulp with the surface being coated with the metal layer. Through combining the advantages of the polyimide and the metal layer, the polyimide conductive pulp is resistant to high temperature, is high in conductivity, is low in density, is high in specific surface area, and is a novel high-performance organic / inorganiccomposite conductive material.

Description

technical field [0001] The invention relates to the field of high-temperature-resistant, high-conductivity and light-weight conductive fillers. Specifically, it relates to a polyimide conductive pulp with light weight, high temperature resistance and high specific surface area and a preparation method thereof, belonging to the technical field of conductive materials. Background technique [0002] Conductive fillers refer to additive materials composed of conductive materials, which are mainly added to the matrix in the form of fillers to improve the conductivity of the matrix. [0003] According to the form of the filler, the conductive filler mainly has two forms of powder and fiber at present, and forms a conductive network through its overlapping inside the matrix to realize the conduction of charges. According to the filler material, conductive fillers can be divided into metal-based, carbon-based and conductive polymers. The metal system is mainly gold, silver, copper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 齐胜利刘少飞田国峰武德珍
Owner BEIJING UNIV OF CHEM TECH
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