Light-duty high-temperature-resistant and high-specific-surface-area polyimide conductive pulp and preparation method therefor
A polyimide pulp, high specific surface area technology, used in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. Resistant to bending and other problems, to achieve the effect of high specific surface area, small equipment investment and simple process
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[0025] The invention provides a light-weight, high-temperature-resistant, high-specific-surface-area polyimide conductive pulp and a preparation method thereof, the method comprising:
[0026] (1) Get polyamic acid fiber pulp and disperse evenly in deionized water;
[0027] (2) add ammoniacal liquor to the dispersion liquid of step (1), settle out after keeping certain hour, clean;
[0028] (3) adding the pulp obtained in step (2) into the metal salt solution, settling out after keeping for a certain period of time, and cleaning;
[0029] (4) placing the pulp obtained in step (3) in a reducing solution, keeping it for a certain period of time, and then settling out and cleaning;
[0030] (5) repeat steps (3) and (4) to obtain the polyamic acid pulp with metal layer on the surface;
[0031] (6) Heating the pulp obtained in step (5) to obtain polyimide pulp with a metal layer on the surface.
[0032] According to the method of the present invention, preferably:
[0033] In s...
Embodiment 1
[0044] This embodiment is used to illustrate one polyimide conductive pulp material and its preparation method of the present invention.
[0045] (1) Take 1g of polyamic acid fiber pulp and evenly disperse it in 100mL of deionized water;
[0046] (2) Add 1 mL of ammonia water to the dispersion in step (1) for 30 seconds at room temperature to form an organic ammonium salt on the pulp surface;
[0047] (3) adding the pulp obtained in step (2) to 35°C, 0.01M silver ammonia solution;
[0048] (4) placing the pulp obtained in step (3) at 35°C in a 0.5M glucose solution;
[0049] (5) repeating steps (3) and (4) 10 times can obtain the polyamic acid pulp with silver layer on the surface;
[0050] (6) The pulp obtained in step (5) is raised from room temperature to 350° C. at a heating rate of 10° C. / min.
Embodiment 2
[0052] This embodiment is used to illustrate one polyimide conductive pulp material and its preparation method of the present invention.
[0053] (1) Take 1g of polyamic acid fiber pulp and evenly disperse it in 100mL of deionized water;
[0054] (2) Add 1 mL of ammonia water to the dispersion in step (1) for 30 seconds at room temperature to form an organic ammonium salt on the pulp surface;
[0055] (3) adding the pulp obtained in step (2) to 35°C, 0.01M silver ammonia solution;
[0056] (4) placing the pulp obtained in step (3) at 35°C in 1M glucose solution;
[0057] (5) repeating steps (3) and (4) 10 times can obtain the polyamic acid pulp with silver layer on the surface;
[0058] (6) The pulp obtained in step (5) is raised from room temperature to 350° C. at a heating rate of 10° C. / min.
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Abstract
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