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High-transparency and heat-conducting potting adhesive for electronic product and preparation method of potting adhesive

A high-transparency, heat-conducting potting technology, which is applied in adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc. Meet the use requirements of potting glue and other issues, and achieve the effects of excellent chemical medium resistance, excellent leakage resistance, and good thermal conductivity

Inactive Publication Date: 2018-04-06
SUZHOU KEMAO ELECTRONICS MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the actual processing of electronic products, the processing, assembly and sealing of many spare parts have higher transparency requirements. Although the existing potting glue has a certain degree of transparency, the transparency cannot meet the actual use standard; and the existing potting glue Poor thermal conductivity, unable to meet the use requirements of the prior art for potting compound

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Embodiment 1: a high-transparency thermally conductive potting compound for electronic products, which is composed of component A and component B;

[0019] Described A component is made up of the following raw materials by weight: 40 parts of liquid coumarone-indene resin, 30 parts of acrylic resin, 30 parts of melamine formaldehyde resin, 20 parts of dodecafluoroheptyl methacrylate, 15 parts of inorganic components parts, 1 part of antimony pentoxide, 1 part of silane coupling agent;

[0020] The B component is composed of the following raw materials in parts by weight: 2 parts of polytrimethylene adipate, 15 parts of tert-butyl peroxybenzoate, and 3 parts of 4-methyltetrahydrophthalic anhydride.

[0021] Further, the inorganic components are gas phase titanium dioxide and sodium polyacrylate, and the mass ratio is 1:3.

[0022] The method for preparing a high-transparency heat-conducting potting compound for electronic products includes the following steps:

[0023]...

Embodiment 2

[0028] Embodiment 2: A high-transparency thermally conductive potting compound for electronic products, which is composed of component A and component B; the component A is composed of the following raw materials by weight: liquid coumarone-indene resin 30 parts, 20 parts of acrylic resin, 20 parts of melamine formaldehyde resin, 10 parts of dodecafluoroheptyl methacrylate, 10 parts of inorganic ingredients, 0.5 parts of antimony pentoxide, and 0.5 parts of silane coupling agent; the B component is composed of The following raw materials in parts by weight are composed of: 1 part of polytrimethylene adipate, 10 parts of tert-butyl peroxybenzoate, 2 parts of 4-methyltetrahydrophthalic anhydride; the inorganic components are gas phase titanium dioxide and sodium polyacrylate, Its mass parts ratio is 1:2.

[0029] The method for preparing a high-transparency heat-conducting potting compound for electronic products includes the following steps:

[0030] 1) Put the silane coupling...

Embodiment 3

[0035] Embodiment 3: a high-transparency thermally conductive potting compound for electronic products, which is composed of A component and B component; the A component is composed of the following raw materials by weight: liquid coumarone-indene resin 50 parts, 40 parts of acrylic resin, 40 parts of melamine formaldehyde resin, 30 parts of dodecafluoroheptyl methacrylate, 20 parts of inorganic ingredients, 1.5 parts of antimony pentoxide, and 1.5 parts of silane coupling agent; the B component is composed of The following raw materials in parts by weight are composed of: 3 parts of polytrimethylene adipate, 20 parts of tert-butyl peroxybenzoate, 5 parts of 4-methyltetrahydrophthalic anhydride; the inorganic components are gas phase titanium dioxide and sodium polyacrylate, Its mass parts ratio is 1:4.

[0036] The method for preparing a high-transparency heat-conducting potting compound for electronic products includes the following steps:

[0037] 1) Put the silane couplin...

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PUM

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Abstract

The invention relates to a high-transparency and heat-conducting potting adhesive for an electronic product. The potting adhesive is prepared from a component A and a component B, wherein the component A is prepared from the following raw materials in parts by weight: 30-50 parts of liquid coumarone-indene resin, 20-40 parts of acrylic resin, 20-40 parts of melamine formaldehyde resin, 10-30 partsof dodecafluoroheptyl methacrylate, 10-20 parts of inorganic components, 0.5-1.5 parts of antimony pentoxide and 0.5-1.5 parts of a silane coupling agent; the component B is prepared from the following raw materials in parts by weight: 1-3 parts of polypropylene glycol adipate, 10-20 parts of tert-butyl peroxybenzoate and 2-5 parts of 1,2,3,6-tetrahydro-4-methylphthalic anhydride. The adhesive isapplicable to electronic product processing such as insulating and transparent heat-conducting potting of power supply modules, high-frequency transformers, connectors, sensors, electric heating parts, circuit boards and the like; the potting adhesive has good heat conductivity, transparency and flame retardance, is soft rubber-like after curing, has good impact resistance and high adhesive force, and has excellent properties of insulation, shock resistance, moisture resistance, corona resistance, leakage resistance and chemical medium resistance.

Description

technical field [0001] The invention relates to the technical field of electronic product processing materials, in particular to a high-transparency heat-conducting potting glue for electronic products and a preparation method thereof. Background technique [0002] In recent years, potting glue has been widely used in electronic circuits, LED, capacitor potting, etc. It is mainly used for bonding, sealing, potting and coating protection of electronic components, and the usage is increasing year by year. Electronic potting glue is liquid before curing and has fluidity. The viscosity of the glue varies according to the performance, material and production process of the product. After the potting glue is completely cured, its use value can be realized. After curing, it can play the role of waterproof and moistureproof, dustproof, insulation, sealing, anticorrosion, temperature resistance and shockproof. [0003] A very big feature or disadvantage of electronic products is tha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/04C09J11/06
CPCC09J4/06C09J11/04C09J11/06
Inventor 邹黎清
Owner SUZHOU KEMAO ELECTRONICS MATERIALS TECH