Graphene coating for heat-dissipating copper foils and preparation method and application thereof

A technology for heat dissipation copper foil and graphene, which is applied in epoxy resin coatings, chemical instruments and methods, coatings, etc. Low coefficient effect

Inactive Publication Date: 2018-04-17
SHENZHEN GUOCHUANG JIAWEI GRAPHENE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As we all know, a lot of heat will be generated during the use of electronic products. If the packaging material does not have excellent thermal conductivity, the heat generated cannot be dissipated, which will lead to a rapid decrease in the life and reliability of electronic products.

Method used

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  • Graphene coating for heat-dissipating copper foils and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Embodiment 1: a kind of coating for graphene heat dissipation copper foil, used raw material consumption is as follows:

[0046] 10 parts by weight of graphene slurry, including 25 parts by weight of graphene powder, 6 parts by weight of surface treatment agent (BYK 101), and 60 parts of solvent (propylene glycol methyl ether acetate);

[0047] 30 parts by weight of boron nitride slurry, including 20 parts by weight of boron nitride powder, 6 parts by weight of surface treatment agent, and 80 parts of solvent (propylene glycol methyl ether acetate);

[0048] The binding agent is low hydroxyl value acrylic resin MR-767 and its curing agent amino epoxy resin MR-818, 10 parts by weight;

[0049] Thinner (propylene glycol methyl ether acetate) 50 parts by weight.

[0050] The preparation method is as follows: mix 1-60 parts by weight of diluent and 1-10 parts by weight of surface treatment agent, then add 30-80 parts by weight of graphene powder for mixing and stirring to ...

Embodiment 2

[0056] Embodiment 2: a kind of coating for graphene heat dissipation copper foil, used raw material consumption is as follows:

[0057] Graphene slurry 15 parts by weight, graphene slurry comprises 50 parts by weight of graphene powder, 5 parts by weight of surface treatment agent (BYK 101);

[0058] 45 parts by weight of boron nitride slurry, including 10 parts by weight of boron nitride powder, and 5 parts by weight of surface treatment agent;

[0059] Adhesive (for low hydroxyl value acrylic resin and its curing agent amino epoxy resin) 5 parts by weight;

[0060] The diluent is 35 parts by weight of butyl acetate.

[0061] The preparation method is the same as that of Example 1.

Embodiment 3

[0062] Embodiment 3: a kind of coating for graphene heat dissipation copper foil, used raw material consumption is as follows:

[0063] 20 parts by weight of graphene slurry, the graphene slurry includes 10 parts by weight of graphene powder, and 1 part by weight of surface treatment agent (BYK 101);

[0064] 60 parts by weight of boron nitride slurry, including 30 parts by weight of boron nitride powder, and 9 parts by weight of surface treatment agent;

[0065] Adhesive (for acrylic resin) 10 parts by weight;

[0066] Diluent (for ethylene glycol) 10 parts by weight.

[0067] The preparation method is the same as that of Example 1.

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Abstract

The invention provides graphene coating for heat-dissipating copper foils, comprising graphene slurry, boron nitride slurry, a binder and a thinner, wherein the graphene slurry is made by mixing graphene powder, a surface treating agent and a solvent, and the boron nitride slurry is made by mixing boron nitride powder, a surface treating agent and a solvent. The graphene coating organically combines the graphene slurry and boron nitride slurry with copper foils and can provide great additive action for improving heat conductivity and heat-dissipating property of heat-dissipating insulating copper foils. The invention also provides a preparation method of the graphene coating for heat-dissipating copper foils and a copper foil.

Description

technical field [0001] The invention relates to the field of heat dissipation materials, in particular to a coating for graphene heat dissipation copper foil, a preparation method and an application. Background technique [0002] With the rapid development of electronic technology, electronic products are developing in the direction of miniaturization, high power, and high integration, which causes the heat generation of electronic components to increase rapidly on a large scale. The result is that the temperature or The junction temperature rises rapidly, and the heat conduction effect directly affects the stability of electronic product performance and the safety of use. As we all know, a lot of heat will be generated during the use of electronic products. If the packaging material does not have excellent thermal conductivity, the generated heat cannot be dissipated, which will lead to a rapid decrease in the life and reliability of electronic products. Every time the tem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D133/04C09D163/00C09D7/62B32B15/01
CPCC09D133/04B32B15/01C08K2003/385C08L2203/20C09D163/00C08L63/00C08K3/04C08K3/38C08L33/04
Inventor 丁显波宗阳阳王东卫
Owner SHENZHEN GUOCHUANG JIAWEI GRAPHENE TECH CO LTD
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