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A kind of aluminum nitride ceramic circuit board and preparation method

A technology of aluminum nitride ceramics and circuit boards, applied in the field of ceramic metallization, can solve the problems of difficult mass production, rising production costs, poor bonding force, etc., and achieves the effects of excellent performance, light size, and guaranteed conductivity.

Active Publication Date: 2020-09-15
上海铠琪科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent CN101798238.A "Ceramic metallization method" discloses a ceramic metallization method, which uses gold nanoparticle solution as an activator, and the activated ceramic substrate is directly electroless nickel-plated, and the production cost is increased due to the use of gold nanoparticles
CN206226830U "a thin film ceramic circuit board" is a transition metal layer between the ceramic substrate and the circuit layer, and the process is complex
In the above methods, after metallization, the bonding force between the metal layer and the aluminum nitride ceramic is poor, the process is complicated, some are not environmentally friendly, it is difficult to produce in batches, and the price is high.

Method used

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  • A kind of aluminum nitride ceramic circuit board and preparation method

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Effect test

Embodiment 1

[0034] Such as figure 1 Shown, get long 8mm, wide 5mm, the aluminum nitride ceramic plate 1 of thick 0.76mm, wherein:

[0035] According to the provided circuit pattern, make a 20um silk-screen printing plate, configure electronic paste, and the electronic paste includes metal powder and organic solvent mixed, wherein, the metal powder contains 30% Cu, 50% Ag and 20% Ti; the organic solvent is mainly made of 90% terpineol and 10% ethyl cellulose; the electronic slurry contains metal powder particle size requirements less than 5um, at this time, the viscosity of the electronic slurry is 70Pa· s. Then, the circuit in the screen printing board is directly printed on the aluminum nitride ceramic board through the electronic paste to obtain a circuit board 2 with a metal layer thickness of 45um; the circuit board is sintered in a vacuum furnace. Before vacuum sintering, the printed circuit board is dried at a temperature of 120°C and kept warm for 15 minutes, that is, the first d...

Embodiment 2

[0037] Such as figure 1 As shown, get long 15mm, wide 5mm, the aluminum nitride ceramic plate 1 of thick 0.2mm, wherein:

[0038] According to the provided pcb circuit pattern, make a 25um silk-screen printing board, configure electronic paste, and the electronic paste includes metal powder mixed with organic solvent, wherein the metal powder contains 45% Cu and 5% Ag and 50% Ti; the organic solvent is mainly made of 92% terpineol and 8% ethyl cellulose; the electronic slurry contains metal powder particle size requirements less than 5um, at this time, the viscosity of the electronic slurry is 100Pa ·s. Then, the circuit in the screen printing board is directly printed on the aluminum nitride ceramic board through the electronic paste to obtain a circuit board 2 with a metal layer thickness of 35um; the circuit board is sintered in an atmosphere furnace. Before vacuum sintering, dry the printed ceramic circuit board at a temperature of 120°C and continue heating for 20 minut...

Embodiment 3

[0040] Such as figure 1 Shown, get long 5mm, wide 8mm, the aluminum nitride ceramic plate 1 of thick 0.51mm, wherein:

[0041]According to the provided circuit pattern, a 35um steel mesh is made, and an electronic paste is configured. The electronic paste includes a mixture of metal powder and an organic solvent, wherein the metal powder contains 50% Cu, 45% Ag and 5% Ti; the organic solvent is mainly made of 97% terpineol and 3% ethyl cellulose; the electronic slurry contains metal powder particle size requirements less than 5um, at this time, the viscosity of the electronic slurry is 160Pa· s. Then, the circuit in the steel mesh is directly printed on the aluminum nitride ceramic board through the electronic paste to obtain a circuit board 2 with a metal layer thickness of 80um; the circuit board is sintered in a vacuum furnace. Before vacuum sintering, the printed ceramic circuit board is dried at a temperature of 150°C and a holding time of 20 minutes, that is, the first...

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Abstract

The invention relates to an aluminum nitride ceramic circuit board and a preparation method. The method comprises the following steps of (1) preparing an electronic paste; (2) printing a circuit pattern with the electronic paste through a silk screen plate or a steel plate screen in an aluminum nitride ceramic plate; (3 sintering in vacuum. The method is simple and mature in process, low in cost,environmental-friendly, good in conductive properties, quick in heat conduction (a conductive layer does not contain glass phase), and high in soldering resistance, and the bonding force between a metal layer and aluminum nitride ceramics is far greater than other process methods.

Description

technical field [0001] The invention relates to the technical field of ceramic metallization, in particular to an aluminum nitride ceramic circuit board and a preparation method thereof. Background technique [0002] Aluminum nitride (AlN) ceramics have excellent thermal conductivity, and their thermal conductivity can reach 170W / m·K-230W / m·K, which is about Al 2 o 3 8-10 times that of ceramics, and the thermal expansion coefficient is close to that of silicon, which is a substitute for Al 2 o 3 Ideal substrate material for ceramics. However, due to the poor interfacial wettability between AlN and metallic Cu, the bonding strength is low. [0003] At present, the Chinese patent CN200510047855.0 "Production Method of Sputtering Copper Foil on Ceramic Substrate" discloses a production method of sputtering copper foil on ceramic substrate, which uses an unbalanced magnetron sputtering method to produce a ceramic copper-clad substrate. Chinese patent CN101798238.A "Ceramic ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/09H05K1/03H05K3/12H05K3/38C04B41/88
CPCC04B41/009C04B41/5116C04B41/5127C04B41/5133C04B41/88H05K1/0306H05K1/092H05K3/1216H05K3/1291H05K3/38H05K2201/0175H05K2203/085C04B35/581C04B41/4535
Inventor 张昕
Owner 上海铠琪科技有限公司