Preparation method of novel nano-silver conductive adhesive

A nano-silver, conductive adhesive technology, applied in the field of conductive adhesive, can solve the problems of affecting the comprehensive performance and application of conductive adhesive, difficult to disperse uniformly, poor compatibility of matrix, etc., to reduce surface tension, enhance impact resistance and shear resistance. Performance, interface contact enhancement effect
CN108018014AActive Publication Date: 2018-05-11深圳名飞远科技有限公司
8 Cites 13 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
深圳名飞远科技有限公司
Publication Date
2018-05-11

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a preparation method of a novel nano-silver conductive adhesive. The preparation method comprises the following steps: a) preparing nano-silver bonding carbon nano-tube powder;b) preparing the nano-silver conductive adhesive; c) solidifying the nano-silver conductive adhesive. The preparation method disclosed by the invention has the advantages that by using a modified carbon nano-tube as a bearing matrix, nano-silver particles are deposited on the carbon nano-tube by adopting a liquid phase reduction method; because the carbon nano-tube is subjected to acid-alkali compounding treatment, a large quantity of unsaturated bonds exist on the surface of the carbon nano-tube, so that surface tension is greatly reduced; because the tube length of the carbon nano-tube is shorter, the nano-silver particles can be massively and uniformly attached onto the surface of the carbon nano-tube, and interface contact between the carbon nano-tube and a micro-silver strip in the conductive adhesive is effectively enhanced, and a conductive ratio of the conductive adhesive is improved; meanwhile, with addition of the modified carbon nano-tube, anti-impact performance and anti-shearing performance of the conductive adhesive are also enhanced.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of conductive adhesive, in particular to a preparation method of nano-silver conductive adhesive. Background technique

[0002] The connection material is a key factor affecting the line resolution and connection strength of the assembly technology. The aging resistance of the connection material directly affects the performance and application value of electronic products. At the same time, with the development of society, people's awareness of environmental protection has gradually increased, and new requirements have been put forward for the development of connecting materials. Research and development of new materials with low energy consumption and environmental friendliness to replace traditional materials with high energy consumption and harmful to the environment has caused people's attention. Conductive adhesive has the advantages of low curing temperature, high resolution, good thermomechanical pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More