Preparation method of novel nano-silver conductive adhesive

A nano-silver, conductive adhesive technology, applied in the field of conductive adhesive, can solve the problems of affecting the comprehensive performance and application of conductive adhesive, difficult to disperse uniformly, poor compatibility of matrix, etc., to reduce surface tension, enhance impact resistance and shear resistance. Performance, interface contact enhancement effect

Active Publication Date: 2018-05-11
深圳名飞远科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention utilizes carbon nanotubes modified by acidic solution as the carrier of silver particles, and disperses them into the epoxy resin matrix to form a carbon nanotube / silver conductive network. However, due to the relatively self-agglomeration of carbon nanotubes themselves Seriously, it is difficult to disperse evenly in the epoxy resin matrix, and the compatibility with the matrix is ​​poor, which greatly affects the comprehensive performance and application of the conductive adhesive

Method used

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  • Preparation method of novel nano-silver conductive adhesive
  • Preparation method of novel nano-silver conductive adhesive
  • Preparation method of novel nano-silver conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] First, the carbon nanotubes are modified, and the treatment process includes the following steps:

[0023] 1) Alkali treatment: After the carbon nanotubes are jet milled, they are mixed with sodium deoxycholate and a sodium hydroxide solution with a mass concentration of 0.1%. The mass ratio range of carbon nanotubes to sodium deoxycholate is 1 : 0.5, the mixed solution was stirred by a high-speed disperser for 1h after ultrasonication for 30min, filtered, and the filtrate was pulverized by a jet mill, and then in N 2 Under the protection of the atmosphere, react at 600°C for 60min, the product is 2 After cooling under the atmosphere, wash with deionized water and filter until neutral, vacuum dry at 40°C to constant weight, and set aside;

[0024] 2) Mix nitric acid with a mass concentration of 68% and sulfuric acid with a mass concentration of 98% at a volume ratio of 1:3, and then add deionized water for dilution. The volume ratio of the amount of deionized water add...

Embodiment 2

[0028] First, the carbon nanotubes are modified, and the treatment process includes the following steps:

[0029] 1) Alkali treatment: After the carbon nanotubes are jet milled, they are mixed with sodium deoxycholate and a sodium hydroxide solution with a mass concentration of 0.5%. The mass ratio range of carbon nanotubes to sodium deoxycholate is 1 : 1. After the mixed solution is ultrasonicated for 30 minutes, continue to stir for 1 hour through a high-speed disperser, filter, and the filtrate is pulverized by a jet mill, and then in N 2 Under the protection of the atmosphere, react at 700°C for 60min, the product is 2 After cooling under the atmosphere, wash with deionized water and filter until neutral, vacuum dry at 40°C to constant weight, and set aside;

[0030] 2) Mix nitric acid with a mass concentration of 68% and sulfuric acid with a mass concentration of 98% at a volume ratio of 1:3, and then add deionized water for dilution. The volume ratio of the amount of de...

Embodiment 3

[0034] First, the carbon nanotubes are modified, and the treatment process includes the following steps:

[0035] 1) Alkali treatment: After the carbon nanotubes are jet milled, they are mixed with sodium deoxycholate and a sodium hydroxide solution with a mass concentration of 0.1%. The mass ratio range of carbon nanotubes to sodium deoxycholate is 1 : 1.5, after the mixture was ultrasonicated for 60min, it was stirred for 1h by a high-speed disperser, filtered, and the filtrate was pulverized by a jet mill, and then in N 2 Under the protection of the atmosphere, react at 800°C for 30min, and the product is 2 After cooling under the atmosphere, wash with deionized water and filter until neutral, vacuum dry at 40°C to constant weight, and set aside;

[0036] 2) Mix nitric acid with a mass concentration of 68% and sulfuric acid with a mass concentration of 98% at a volume ratio of 1:3, and then add deionized water for dilution. The volume ratio of the amount of deionized water...

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Abstract

The invention discloses a preparation method of a novel nano-silver conductive adhesive. The preparation method comprises the following steps: a) preparing nano-silver bonding carbon nano-tube powder;b) preparing the nano-silver conductive adhesive; c) solidifying the nano-silver conductive adhesive. The preparation method disclosed by the invention has the advantages that by using a modified carbon nano-tube as a bearing matrix, nano-silver particles are deposited on the carbon nano-tube by adopting a liquid phase reduction method; because the carbon nano-tube is subjected to acid-alkali compounding treatment, a large quantity of unsaturated bonds exist on the surface of the carbon nano-tube, so that surface tension is greatly reduced; because the tube length of the carbon nano-tube is shorter, the nano-silver particles can be massively and uniformly attached onto the surface of the carbon nano-tube, and interface contact between the carbon nano-tube and a micro-silver strip in the conductive adhesive is effectively enhanced, and a conductive ratio of the conductive adhesive is improved; meanwhile, with addition of the modified carbon nano-tube, anti-impact performance and anti-shearing performance of the conductive adhesive are also enhanced.

Description

technical field [0001] The invention relates to the technical field of conductive adhesive, in particular to a preparation method of nano-silver conductive adhesive. Background technique [0002] The connection material is a key factor affecting the line resolution and connection strength of the assembly technology. The aging resistance of the connection material directly affects the performance and application value of electronic products. At the same time, with the development of society, people's awareness of environmental protection has gradually increased, and new requirements have been put forward for the development of connecting materials. Research and development of new materials with low energy consumption and environmental friendliness to replace traditional materials with high energy consumption and harmful to the environment has caused people's attention. Conductive adhesive has the advantages of low curing temperature, high resolution, good thermomechanical pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02
CPCC08K7/24C08K9/02C08K2003/0806C08K2201/003C08K2201/004C08K2201/011C09J9/02C09J163/00
Inventor 李智许银梅王伯杰王飞蓉许名飞
Owner 深圳名飞远科技有限公司
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