Processing method of sapphire sheet product containing ink frame
A sapphire and ink technology, used in metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of difficulty in further improving cutting accuracy, large damage to sapphire strength, affecting the quality of sapphire sheet products, and saving machine and labor costs. , the effect of small strength damage and reduction of the number of equipment
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[0032] Step A: First, make a large sapphire substrate, and directly grind and polish it to achieve the required thickness and surface roughness of the finished product. Directly perform screen printing on a large sapphire substrate to obtain multiple ink patterns. The spacing between each pattern is about 1mm, and the screen printing pattern is about 0.5mm larger than the designed finished pattern (the outer radius of the ring is about 0.5mm larger than the finished product). The resulting product is figure 1 shown.
[0033]Step B: Use a carbon dioxide laser and use the CCD (image sensor) positioning method to cut the ink layer into the outline size required by the "finished pattern". The purpose of this step is to cut the ink layer on the ink surface with a uniform line width to ensure the next step PS (picosecond) laser cutting sapphire will not damage the ink layer and cause the ink layer to fall off, resulting in edge burrs, light leakage and other defects. The carbon di...
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