Special PPS (polyphenylene sulfide) plastic having good bonding property with epoxy adhesive and preparation method of PPS plastic

Abstract

The invention discloses special PPS (polyphenylene sulfide) plastic having good bonding property with an epoxy adhesive and a preparation method of the PPS plastic. The PPS plastic is prepared from the following raw materials in parts by mass: 50-80 parts of PPS resin as a main material as well as the following auxiliary materials: 10-50 parts of glass fiber, 1-5 parts of a silane coupling agent,3-15 parts of a flexibilizer, 0.3-3 parts of an antioxidant and 0.3-3 parts of a heat stabilizer. The special PPS plastic has the beneficial effects that the components are optimized, wherein a flexibilizer is optionally selected from anhydride modified ethylene thermoplastic elastomers, styrene thermoplastic elastomers and unsaturated epoxy copolymers, toughness and impact strength can be improved, polarity of the special PPS plastic and wettability of the special PPS plastic to the epoxy adhesive can also be improved, and accordingly, adhesion between the special PPS plastic and epoxy resinis improved, and requirements of the glue filling process are met; the content of the components is optimized, and mechanical properties and heat resistance of the special PPS plastic are improved.

Description

technical field [0001] The invention relates to the technical field of special plastics, in particular to a PPS special plastic with good bonding property with epoxy resin and a preparation method thereof. Background technique [0002] Insulation potting technology is to mechanically or manually pour the liquid compound into the device equipped with electronic components and circuits, and solidify it into a thermosetting polymer insulation material with excellent performance under normal temperature or heating conditions. [0003] Strengthen the integrity of electronic devices, improve the resistance to external shocks and vibrations; improve the insulation between internal components and lines, which is conducive to the miniaturization and lightweight of devices; avoid direct exposure of components and lines, improve the waterproof and moisture-proof performance of devices, and Improve performance and stability parameters. [0004] Because of the superior performance of ep...

AI Technical Summary

Problems solved by technology

[0012] (1) The operating viscosity is high, which is somewhat inconvenient in construction

[0013] (2) The impact strength is low and brittle

[0014] (3) The peel strength is low, and there are few resins with good adhesion to epoxy resins. Commonly used resins include polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) and polyethylene terephthalate. After glycol ester (PET), nylon (polyamide 6, polyamide 66, high-temperature nylon PPA, etc.) are potted and cured, there is a small gap between the resin and the epoxy glue, resulting in insufficient insulation and sealing, especially the lack of activity of PPS group, the adhesive viscosity with epoxy glue is only 3MPa;

[0020] However, unmodified PPS resin has obvious disadvantages and cannot be directly combined with epoxy adhesive:

[0021] (1) There is no active group in PPS that can react with epoxy groups; (2) Although PPS has the advantages of good fluidity and smooth surface, it still cannot meet the requirements of strong bonding force with epoxy glue

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