Vacuum plating cathode target using foam metal for enhancing cooling effect

Abstract

The invention relates to a vacuum plating cathode target using foam metal for enhancing a cooling effect. The vacuum plating cathode target comprises a magnet yoke, a magnetic body, a target material,a backboard, a graphite flake, the foam metal and a cooling liquid flow channel. The graphite flake arranged between the target material and the backboard is used for decreasing the thermal contact resistance, the foam metal which is tightly connected to the other surface of the backboard and is further filled into the cooling liquid flow channel is used for increasing the heat exchange area, andthe cooling effect is enhanced.

Description

technical field [0001] The invention relates to a vacuum plating cathode target, in particular to a vacuum plating cathode target which uses foam metal to enhance cooling. Background technique [0002] In the vacuum coating production process, in order to improve production efficiency and film quality, people often obtain higher sputtering rates by increasing the flow of ions per unit time, and by applying a higher target voltage to make the ion hit the target surface. The higher velocity results in higher energies for the atoms escaping the target surface. This is achieved by increasing the power of the target. During the production process, the target is continuously bombarded by charged particles, and most of the energy is converted into heat, which causes the target itself to heat up. The temperature of the target rises sharply, which will damage the non-high temperature resistant. For the target material, there will be more large particles among the particles emitted a...

AI Technical Summary

Problems solved by technology

[0009] At present, most cathode targets use this indirect cooling method, but there is a problem with this cooling method: the heat transfer efficiency between the target and the back plate is not high, because the surface of the target and the back plate are not Ideal for smooth surfaces (such as image 3 shown), and the contact between the two surfaces is achieved by mechanical compression, so microscopically, there will be many gaps at the contact surface, and the gaps are filled with air, which reduces the efficiency of heat transfer

[0010] In general, whether direct cooling or indirect cooling is used, there is the same problem: the heat exchange between the cooling liquid and the target, and between the cooling liquid and the back plate can only be through the point where they are in direct contact. The interface conducts heat exchange, in other words the width of the coolant channel determines the rate of heat exchange

As the new process requires more and more sputtering power, the calorific value of the target will also increase, and the old cooling method is difficult to meet the future process requirements

Patent No. CN202054888 U's "A Magnetron Sputtering Device" can increase the contact area with the cooling medium and improve the cooling effect "Although this method increases the heat exchange area to a certain extent, the increased area is limited and the effect is also limited.

Images