This invention discloses a combined
electrode plasma process
system and a method for performing
plasma processes using combined electrodes. The combined
electrode plasma process
system includes a
vacuum chamber, an upper
electrode, a first electrode, a second electrode, and a double-sided
adhesive component. The upper electrode is disposed within the
vacuum chamber. The double-sided
adhesive component is used to fix the substrate to be processed onto the second electrode. The second electrode can be selectively combined with the first electrode to form a lower electrode. A plasma process space is formed between the lower electrode and the upper electrode to perform
plasma processing on the substrate. When the plasma process is stopped, the first electrode and the second electrode can be separated, and the substrate fixed to the second electrode can be removed together for transport. This invention offers the
advantage of flexible process timing through the design of the second electrode.