Method for assisting high-temperature laser brazing through self-propagating reaction of nano-multilayer film
A nano-multilayer, laser-assisted technology, applied in welding equipment, welding equipment, manufacturing tools, etc., to achieve the effect of reducing requirements, reducing heat-affected zone, and increasing joint area
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[0031] Example one
[0032] 1) The silicon substrate was ultrasonically cleaned in alcohol and pure water for 5 minutes. Dry after washing.
[0033] 2) Using magnetron sputtering to deposit Ti and Ni nano multilayer films on the substrate. The process parameters of magnetron sputtering deposition: deposition power is 250W, Ar gas flow is 40sccm, working pressure is 0.5Pa, background vacuum is 5*10 -4 Pa. The deposition time of Ti is 60s, and the deposition time of Ni is 45s. Alternate deposition for 400 cycles. The resulting multilayer film has a thickness of approximately 24 μm.
[0034] 3) The deposited multilayer film is peeled from the silicon substrate.
[0035] 4) Place the peeled multilayer film between two layers of 30 μm thick SnAgCu solder foil to form a composite intermediate layer.
[0036] 5) Carry out surface pretreatment of the base material to be welded, using #200 sandpaper, #400 sandpaper, #600 sandpaper, #800 sandpaper and #1000 sandpaper to polish the surface of...
Example Embodiment
[0041] Embodiment two
[0042] The difference between this embodiment and the first embodiment is that the nanometer multilayer film of Ti and Al is deposited by magnetron sputtering described in step 2. The process parameters of magnetron sputtering deposition: the deposition power is 200W, the deposition time of Ti is 70s, the deposition time of Al is 40s, the deposition cycle is 300 cycles, and the thickness of the obtained multilayer film is about 20μm. Others are the same as the first embodiment.
Example Embodiment
[0043] Embodiment three
[0044] The difference between this embodiment and the first or second embodiment is that the magnetron sputtering described in step two is used to deposit the nano multilayer film of Ni and Al. The process parameters of magnetron sputtering deposition: the deposition power is 300W, the deposition time of Ni is 60s, the deposition time of Al is 50s, and the alternate deposition is 400 cycles. The thickness of the obtained multilayer film is about 28μm. Others are the same as the first or second embodiment.
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