Substrate-free low temperature reactive hot melt adhesive tape and glue used by same, and preparation methods of hot melt adhesive tape and glue

A technology of low-temperature reaction and hot-melt adhesive tape, which is applied in the direction of adhesives, adhesive types, film/sheet adhesives, etc., and can solve problems such as inconvenient storage and transportation, high gluing temperature, and difficulty in achieving sufficient bonding strength. , to achieve the effect of saving equipment and transportation costs, simple storage and transportation conditions, and mild sizing conditions

Active Publication Date: 2018-07-06
SUZHOU SHIHUA NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] But hot-melt tapes also have deficiencies: non-reactive hot-melt tapes tend to have low adhesion, and it is difficult to achieve sufficient bonding strength; while reactive hot-melt tapes can obtain higher adhesion, but there are problems with preservation and sizing. Contradiction—The low-temperature reaction type must be sealed and stored in isolation from the air, which is inconvenient for storage and transportation, and the short sizing time is difficult for practical application; the medium-high temperature reaction type hot-melt adhesive is easy to store, but the sizing temperature is high, and the electronic device is difficult to withstand
The current common hot-melt tapes are difficult to balance the glue thickness and reactivity, and it is difficult to take into account the reactivity and sizing temperature
In order to solve the above problems, the main low-temperature reactive hot-melt tapes in the current market use the curing agent and thermoplastic elastomer to mix directly and then wet-coat. The product must be stored and transported in a low-temperature refrigerator, and it needs to be used in a very short time. To complete various operations, there are very strict requirements on production equipment, storage and transportation equipment and the use environment, which greatly increases the production costs of related enterprises

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Thermoplastic polyurethane resin A1, softening point temperature 85-95°C, tensile strength 20 MPa, with hydroxyl groups, 45 parts; thermoplastic polyurethane resin A2, softening point temperature 130-135°C, tensile strength 30 MPa, with carboxyl groups, 55 Parts; Rosin Glyceride B1, softening point 85-95°C, 35 parts; Rosin Glyceride B2, softening point temperature 145-160°C, 15 parts; solvent acetone 20 parts, butanone 50 parts, methyl acetate 15 parts, acetic acid 15 parts of ethyl ester; 10 parts of TDI blocked by sodium bisulfite, the minimum unblocking temperature is 80 ℃; 1 part of wetting and leveling agent; 5 parts of anti-aging agent; 1 part of defoaming agent; 3 parts of rheological agent.

[0038]Under the condition of stirring rate of 100-350 rpm, swell polyurethane resins A1 and A2 in ketone solvents, rosin glycerides B1 and B2 in ester solvents, mix the above solutions and add wetting fluid after fully stirring Leveling agent, anti-aging agent, defoamer and...

Embodiment 2

[0042] Thermoplastic polyurethane resin A1, softening point temperature 85-95°C, tensile strength 20 MPa, with hydroxyl groups, 85 parts; thermoplastic polyurethane resin A2, softening point temperature 130-135°C, tensile strength 30 MPa, with carboxyl groups, 30 parts; thermoplastic polyurethane resin A3, softening point temperature 120-125 ℃, tensile strength 25 MPa, with amine groups, 35 parts; rosin glyceride B3, softening point 115-120 ℃, 90 parts; solvent butanone 290 parts, 70 parts of methyl acetate; 30 parts of sodium bisulfite-capped HDI with a minimum unblocking temperature of 90 °C; 10 parts of wetting and leveling agent; 3.5 parts of anti-aging agent; 10 parts of defoaming agent; 10 parts of rheological agent.

[0043] Under the condition of stirring speed of 100-350 rpm, swell polyurethane resins A1, A2 and A3 in ketone solvents, and rosin glyceride B3 in ester solvents, mix the above two solutions and add them to wet Leveling agent, anti-aging agent, defoaming a...

Embodiment 3

[0047] Thermoplastic polyurethane resin A1, softening point temperature 85-95℃, tensile strength 20 MPa, with hydroxyl group, 90 parts; thermoplastic polyurethane resin A3, softening point temperature 120-125℃, tensile strength 25 MPa, with amine group, 30 parts ; Thermoplastic polyurethane resin A4, softening point temperature 135-140 ° C, tensile strength 25 MPa, with hydroxyl and carboxyl groups, 10 parts; Rosin glyceride B1, softening point 85-95 ° C, 55 parts; Rosin glyceride B4, softening Point 107-115 ℃, 45 parts; solvent butanone 180 parts, methyl acetate 45 parts; sodium bisulfite-capped PAPI, minimum unblocking temperature 83 ℃, 40 parts; wetting and leveling agent 4 parts; anti-aging agent 0.1 part; 7 parts of defoamer; 1 part of rheological agent.

[0048] Under the condition that the stirring speed is 100-350 rpm, swell the polyurethane resins A1, A3 and A4 in the ketone solvent, add the rosin glyceride B1 and B4 pre-swelled in the ester solvent after fully stirri...

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Abstract

The invention discloses a formula and a preparation method of substrate-free low temperature reactive hot melt adhesive tape. The adhesive tape consists of substrate-free dry glue and a double-sided release film or double-sided release paper; the glue is prepared from 100-150 parts of thermoplastic polyurethane, 50-150 parts of rosin glyceride, 1-40 parts of a blocked crosslinking agent, 1-10 parts of a wetting leveling agent, 1-10 parts of a defoaming agent, 1-10 parts of a rheological agent, 0.1-5 parts of an anti-aging agent and 100-400 parts of a mixed solvent of ketones and esters; the substrate-free low temperature reactive hot melt adhesive tape is prepared by coating a substrate with the glue, drying, winding, and cutting. By designing the deblocking temperature of the crosslinkingagent and the softening point of the resin, the adhesive tape can be stored and transported at room temperature, and can realize a bonding strength of 2-3 N/mm<2> at a lower heating temperature (90-110 DEG C) and a lower pressure (1-2 bar). Therefore, the substrate-free low temperature reactive hot melt adhesive tape can solve the problems that the existing low-temperature hot melt adhesive is low in bonding strength, and the low-temperature reactive hot-melt adhesive requires special storage and transportation conditions; the substrate-free low temperature reactive hot melt adhesive tape cangreatly reduce the raw material storage and transportation costs of the electronic device manufacturer, and meets the bonding requirements for small parts of the current electronic products.

Description

technical field [0001] The invention discloses a substrate-free low-temperature-reactive hot-melt adhesive tape and a formula and preparation method thereof, belonging to the field of adhesives. Background technique [0002] Hot melt adhesive is an adhesive that does not have viscosity or low viscosity at room temperature, but becomes sticky after heating. It can be divided into reactive hot melt adhesive and non-reactive hot melt adhesive. Non-reactive hot-melt adhesive, in the hot-melt state after heating, exhibits the characteristics of pressure-sensitive adhesive. At this time, a certain pressure is applied to bond the adherend. After cooling to normal temperature, the colloid returns to non-viscous or low viscosity solids. Reactive hot-melt adhesive, in the hot-melt state after heating, not only exhibits the characteristics of pressure-sensitive adhesives, but also has reactivity, which further enhances the cohesion of the colloid, and at the same time reacts with func...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/10C09J175/06C09J11/08
CPCC08L2205/025C08L2205/035C09J7/00C09J11/08C09J175/06C09J2301/304C09J2301/408C08L75/06C08L93/04
Inventor 顾正青周帅计建荣
Owner SUZHOU SHIHUA NEW MATERIAL TECH
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