The invention discloses a formula and a preparation method of substrate-free low temperature reactive
hot melt adhesive tape. The
adhesive tape consists of substrate-free
dry glue and a double-sided release film or double-sided release paper; the glue is prepared from 100-150 parts of
thermoplastic polyurethane, 50-150 parts of
rosin glyceride, 1-40 parts of a blocked crosslinking agent, 1-10 parts of a
wetting leveling agent, 1-10 parts of a defoaming agent, 1-10 parts of a rheological agent, 0.1-5 parts of an anti-aging agent and 100-400 parts of a mixed
solvent of ketones and esters; the substrate-free low temperature reactive
hot melt adhesive tape is prepared by
coating a substrate with the glue,
drying, winding, and
cutting. By designing the deblocking temperature of the crosslinkingagent and the
softening point of the resin, the adhesive tape can be stored and transported at
room temperature, and can realize a
bonding strength of 2-3 N / mm<2> at a lower
heating temperature (90-110 DEG C) and a lower pressure (1-2 bar). Therefore, the substrate-free low temperature reactive
hot melt adhesive tape can solve the problems that the existing low-temperature
hot melt adhesive is low in
bonding strength, and the low-temperature reactive hot-melt adhesive requires special storage and transportation conditions; the substrate-free low temperature reactive
hot melt adhesive tape cangreatly reduce the
raw material storage and transportation costs of the electronic device manufacturer, and meets the bonding requirements for small parts of the current electronic products.