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Magnetron sputtering preparation process of folding-resistant high-barrier composite packaging films

A preparation process and composite packaging technology, applied in the direction of sputtering plating, metal material coating process, ion implantation plating, etc., can solve the problems of not being able to withstand folding, barrier films prone to cracks, etc., to reduce the permeability and cost, prolonging the shelf life of food, prolonging the effect of mildew and deterioration

Inactive Publication Date: 2018-07-10
GUIZHOU MINZU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to improve the problem that the thin-film gas barrier film prepared by PVD (sputtering method) is prone to cracks and is not resistant to folding during the use of such materials. material, and inorganic or inorganic oxide target materials on the plastic surface at the same time by magnetron co-sputtering vacuum plasma deposition technology to prepare a flexible, folding-resistant composite high-barrier film, and developed a magnetic composite high-barrier film resistant to folding Controlled sputtering preparation process

Method used

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  • Magnetron sputtering preparation process of folding-resistant high-barrier composite packaging films
  • Magnetron sputtering preparation process of folding-resistant high-barrier composite packaging films
  • Magnetron sputtering preparation process of folding-resistant high-barrier composite packaging films

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Preparations for cleaning and drying of the base material; take PA as the base material, use acetone, alcohol, and deionized water to ultrasonically clean it for 15 minutes, and then send it to the blower unit for drying.

[0035] (2) Send the prepared substrate into the pre-sputtering vacuum box for pre-sputtering cleaning, the pre-sputtering gas is 999.99% argon, the sputtering power increase rate is 2W hours / square centimeter, and the sputtering time is 150 Second;

[0036] (3) Take PI and SiO respectively 2 As the target, turn on the RF power supply, and prepare C-SiO by co-deposition on the pre-sputtered substrate 2 Composite high-resistance film, the vacuum degree of the vacuum chamber is controlled at 4×10 -5 Pa, the working gas is 999.99% argon, the flow rate of argon is 50sccm, the working pressure is 0.4Pa, the distance between the target and the base is 10cm, the rotation speed of the drum is 1.5m / min, PI, SiO 2 The sputtering power was controlled at 1...

Embodiment 2

[0038] (1) Preparations for cleaning and drying the base material; using PET as the base material, use acetone, alcohol, and deionized water to ultrasonically clean it for 30 minutes, and then send it to the blower unit for drying.

[0039] (2) Send the prepared substrate into the pre-sputtering vacuum box for pre-sputtering cleaning, the pre-sputtering gas is 999.99% argon, the sputtering power increase rate is 2W hours / square centimeter, and the sputtering time is 100 Second;

[0040] (3) Using PI and ZnO as targets, turn on the RF power supply, and co-deposit F-Si composite high-resistance films on the pre-sputtered substrate. The vacuum degree of the vacuum chamber is controlled at 3×10-5Pa, and the working gas is 999.99% argon, the argon gas flow rate is 60sccm, the working pressure is controlled at 0.2Pa, the target base distance is 6cm, the drum rotation speed is controlled at 2m / min, and the sputtering power of PI and ZnO is controlled at 1W / cm². The sputtering time w...

Embodiment 3

[0042] (1) Preparations such as cleaning and drying of the substrate; 90 parts by weight of polyethylene terephthalate (PET), 6.5 parts by weight of polyethylene LLDPE flexible chain molecules, and 0.5-15 parts by weight of butanediol additives ; Use twin-screw to extrude the mixture of the above raw materials of polyethylene terephthalate to prepare composite PET, and the base temperature is controlled at 190-195 °C; and composite PET is used as the base material, respectively with acetone, alcohol, deionized water Ultrasonic cleaning for 30 minutes, and then sent to the blower to dry.

[0043] (2) Send the prepared composite PET substrate into the pre-sputtering vacuum box for pre-sputtering cleaning. The pre-sputtering gas is 999.99% argon, and the sputtering power increase rate is 1.5W hours / square centimeter. The time is 120 seconds;

[0044] (3) Using PTFE and ZnO as targets respectively, turn on the RF power supply, and perform co-deposition on the pre-sputtered substr...

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Abstract

The invention discloses a magnetron sputtering preparation process of folding-resistant high-barrier composite packaging films. The magnetron sputtering preparation process is characterized by comprising the following steps that (1) a base material is prepared; (2) the base material is conveyed into a pre-sputtering vacuum tank for pre-sputtering cleaning, specifically, pre-sputtering gas is argonwith the purity being 99.95%-99.99%, the pre-sputtering power increase rate is 0.1-6 W per hour per square centimeter, and the sputtering time is 30-500 seconds; and (3) a radio frequency power supply is started, multiple targets are deposited on a pre-sputtering matrix at the same time, and accordingly the high-barrier composite film is obtained, specifically, the pre-sputtered base material iswound on the surface of a roller to be fixed, the vacuum degree of a vacuum chamber is controlled to be 0.1-10*10<-5> Pa, argon or argon-oxygen mixed gas serves as working gas, the purity of the argonis 99.95%-99.99%, the airflow volume is 10-450 sccm, the oxygen purity is 99.95%-99.999%, the airflow volume is 0.5-100 sccm, the working air pressure is controlled to be 0.2-2 Pa, the target-substrate distance is 4-16 cm, the rotating speed of the roller is controlled to be 0.5-10 m / min, and the sputtering time is 5-300 minutes.

Description

technical field [0001] The invention relates to the technical field of barrier packaging, in particular to a production process of a folding-resistant magnetron sputtering high barrier film. Background technique [0002] The development of barrier packaging stems from the barrier requirements for packaging films that are easy to oxidatively degenerate and deteriorate in food, medicine, and microelectronics products. Usually, a material with strong gas barrier properties and polyolefin with strong thermal seam properties and moisture barrier properties are simultaneously extruded, and it is a multilayer film. Since the advent of magnetron sputtering technology, due to its advantages such as fast deposition rate, low substrate temperature, and sputtering cathode size can be scaled up. It has been applied in many fields from microelectronic devices to several square meters of glass coating, and has gradually developed into a mainstream method for large-area high-speed depositi...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/12C23C14/06C23C14/02
Inventor 王超楠任达森张朝珍罗笙芸鲁听杨吟野黄宝进
Owner GUIZHOU MINZU UNIV
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