Packaging structure for high-power density plastic package type IPM (Intelligent Power Module) and processing technology thereof
A technology with high power density and packaging structure, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of delamination damage of packaging structure, failure of packaging structure, deformation of solder layer, etc., to improve thermal conductivity and reduce heat loss. The effect of resistance and strengthening binding force
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[0030] The present invention will be further described below with reference to the drawings and embodiments.
[0031] The present invention proposes a high-power density plastic-encapsulated IPM module packaging structure, which generally includes: a DBC substrate with graphene film on the upper surface, a MOSFET chip, an FRD chip, a driver chip, a PCB board, a solder layer, and graphene filling Reinforced thermal conductive glue, bonding wire, lead frame, plastic enclosure, graphene filled and reinforced encapsulation resin.
[0032] See figure 1 , Using chemical vapor deposition to patternly grow a first graphene film 30 on the center of the connection area corresponding to the cathode of the FRD chip 16 on the upper surface of the DBC substrate 12, and on the center of the connection area corresponding to the drain of the MOSFET chip 15 on the upper surface of the DBC substrate 12 The second graphene film 31 is patterned and grown. The first graphene film 30 and the second grap...
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