Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of fast curing EMI thermal conductive material and preparation method thereof

A conductive material and rapid curing technology, applied in the field of shielding materials, can solve the problems of difficult production process, poor shielding effect, and low reproducibility, and achieve excellent curing performance, good electrical and thermal conductivity, and high reproducibility Effect

Active Publication Date: 2020-05-01
宁波安工电子有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcomings of poor shielding effect, difficult manufacturing process and low reproducibility in the prior art, and propose a fast-curing EMI heat-conducting and electrically-conducting material and its preparation method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of fast curing EMI thermal conductive material and preparation method thereof
  • A kind of fast curing EMI thermal conductive material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The present invention proposes a fast-curing EMI thermally and electrically conductive material, comprising the following parts by weight of raw materials: 70 parts of bisphenol A epoxy resin, 15 parts of butadiene-styrene copolymer, 0.4 parts of trimethylolpropane, 4, 1.2 parts of 4′-diphenylmethane diisocyanate, 1.2 parts of xylene diisocyanate, 1 part of dibutyltin dilaurate, 1 part of azobisisobutyronitrile, 4 parts of composite alloy powder, diluted with bisphenol A epoxy resin 50 parts;

[0026] The preparation method includes the following steps:

[0027] S1. Preparation of composite alloy powder: add copper powder and iron-based alloy powder to a ball mill at a mass ratio of 1:3, and add 2 times the mass of the grinding body and 1 times the mass of ethanol for ball milling for 6 hours, and then After drying, the composite alloy powder is obtained for use;

[0028] S2 According to 70 parts of bisphenol A epoxy resin, 15 parts of butadiene-styrene copolymer, 0.4 parts ...

Embodiment 2

[0032] The present invention proposes a fast-curing EMI thermally conductive material, which includes the following raw materials in parts by weight: 80 parts of bisphenol A epoxy resin, 20 parts of butadiene-styrene copolymer, 0.6 parts of trimethylolpropane, 4, 1.5 parts of 4′-diphenylmethane diisocyanate, 1.5 parts of xylene diisocyanate, 0.5 parts of dibutyltin dilaurate, 0.5 parts of azobisisobutyronitrile, 6 parts of composite alloy powder, diluted with bisphenol A epoxy resin 40 parts;

[0033] The preparation method includes the following steps:

[0034] S1. Preparation of composite alloy powder: add copper powder and iron-based alloy powder to a ball mill at a mass ratio of 1:4, and add 3 times the mass of the grinding body and 0.5 times the mass of ethanol for ball milling for 5 hours, and then After drying, the composite alloy powder is obtained for use;

[0035] S2 According to 80 parts of bisphenol A epoxy resin, 20 parts of butadiene-styrene copolymer, 0.6 parts of tr...

Embodiment 3

[0039] The present invention proposes a fast-curing EMI thermally conductive material, which includes the following raw materials in parts by weight: 60 parts of bisphenol A epoxy resin, 10 parts of butadiene-styrene copolymer, 0.2 parts of trimethylolpropane, 4, 4′-Diphenylmethane diisocyanate 1 part, xylene diisocyanate 1 part, dibutyltin dilaurate 1.5 parts, azobisisobutyronitrile 1.5 parts, composite alloy powder 3 parts, bisphenol A epoxy resin dilution 60 parts;

[0040] The preparation method includes the following steps:

[0041] S1. Preparation of composite alloy powder: add copper powder and iron-based alloy powder to a ball mill at a mass ratio of 1:2, and add 2 times the mass of the grinding body and 1 times the mass of ethanol for ball milling for 8 hours, and then After drying, the composite alloy powder is obtained for use;

[0042] S2 According to 60 parts of bisphenol A epoxy resin, 10 parts of butadiene-styrene copolymer, 0.2 parts of trimethylolpropane, 1 part of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of shielding materials, particularly relates to a fast curing EMI heat-conducting and conductive material and a preparation method thereof, and solves theproblems in the prior art that the shielding effect is poor, the difficulty of the production process is large, and the repetition rate is low. The fast curing EMI heat-conducting and conductive material is prepared from bisphenol A epoxy resin, butadiene-styrol copolymer, trimethylolpropane, 4,4'-diphenyl-methane-diisocyanate, xylene diisocyanate, di-n-butyltin dilaurate, azodiisobutyronitrile, composite alloyed powder and bisphenol A epoxy resin diluent; the preparation method comprises the following steps of S1, the preparation of the composite alloyed powder; S2, the preparation of the rawmaterials of the EMI heat-conducting and conductive material; and S3, the mixture of various raw materials. The provided EMI heat-conducting and conductive material has the advantages that the preparation method is simple, the use is convenient, the curing time is short, the shielding effect is good, the heat-conducting and conductive properties are excellent, and the repetition rate is good.

Description

Technical field [0001] The invention relates to the technical field of shielding materials, in particular to a fast curing EMI thermally conductive material and a preparation method thereof. Background technique [0002] EMI is electromagnetic interference. Its principle is to use the reflection, absorption and guidance of electromagnetic energy flow by shielding materials to block or attenuate the propagation of electromagnetic energy between the shielded area and the outside world, and to combine the harmonic voltage formed between the harmonics and the shielding material. Harmonic current is introduced into the earth to achieve the purpose of shielding harmonics. Common EMI electromagnetic shielding materials are mainly divided into four types: conductive rubber, conductive foam lining, metal EMI lining, conductive compounding agent and wave absorbing material. Among them, conductive compounding agent is simple to use, widely applicable, and shearing. The advantages of high s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L47/00C08L75/04C08K9/00C08K3/08
CPCC08K2003/085C08K2003/0856C08L63/00C08L2205/03C08L47/00C08L75/04C08K9/00C08K3/08
Inventor 朱旭彤张敏吴飞张洪胜何华军
Owner 宁波安工电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com