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Electromagnetic shielding computer mainframe casing material

A host shell, electromagnetic shielding technology, applied in the fields of magnetic field/electric field shielding, electrical components, etc., can solve the problems of insufficient comprehensiveness, limited applicability, insufficient protection performance, etc., and achieves complete structure, simple and convenient preparation, and good compatibility of raw materials. Effect

Inactive Publication Date: 2018-09-04
合肥酷睿网络科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the progress of society, the development of computers and the complexity of the application environment, due to the consideration of factors such as protecting fragile electronic components and strengthening the strength of the overall structure, the protection performance of the existing computer mainframe shell products on the market seems to be getting better and better. Insufficient and comprehensive, especially in terms of electromagnetic shielding and overall structural strength, which limits its applicability to a certain extent, therefore, it needs to be improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] An electromagnetic shielding computer mainframe shell material, weighing the following materials:

[0031] Nylon 66 40kg, modified polyphenylene ether 20kg, modified montmorillonite 10kg, palygorskite powder 8kg, porous limestone 2kg, carbon black N220 2kg, activated alumina 1kg, polydimethylsiloxane 1kg, maleic acid Dibutyl acid 1kg, silicone masterbatch 0.6kg, crosslinking agent 1kg, flame retardant 1kg, aluminate coupling agent ASA type 1kg and stabilizer 1kg;

[0032] The preparation and selection of some of the above raw materials are as follows:

[0033] (1) Modified montmorillonite: Weigh 10kg of montmorillonite, soak it in 10% hydrochloric acid by mass concentration for 3 hours, wash and dry in deionized water, and then soak it in 6% hydrogen peroxide solution by mass concentration for 3 hours. Wash it to neutrality, dry it, and then roast it at 300℃ for 16min; After the montmorillonite is air-cooled to 50℃, take it out, add 0.6kg of alkylphenol polyoxyethylene ether ...

Embodiment 2

[0046] An electromagnetic shielding computer mainframe shell material, weighing the following materials:

[0047] Nylon 66 45kg, modified polyphenylene ether 25kg, modified montmorillonite 12kg, palygorskite powder 10kg, porous limestone 2.5kg, carbon black N220 2.5kg, activated alumina 1.5kg, polydimethylsiloxane 1.1kg, Dibutyl maleate 1.25kg, silicone masterbatch 0.7kg, crosslinking agent 1.5kg, flame retardant 1.25kg, aluminate coupling agent ASA type 1.5kg and stabilizer 1.1kg;

[0048] The preparation and selection of some of the above raw materials are as follows:

[0049] (1) Modified montmorillonite: Weigh 12 kg of montmorillonite, soak it in 11% hydrochloric acid by mass concentration for 2.5 hours, wash and dry in deionized water, and then soak it in 7% hydrogen peroxide solution by mass concentration for 2.5 hours. Wash with ionized water to neutrality, dry, and calcinate at 310℃ for 14min; After the montmorillonite is air-cooled to 53℃, take it out, add 0.7kg of alkylphe...

Embodiment 3

[0062] An electromagnetic shielding computer mainframe shell material, weighing the following materials:

[0063] Nylon 66 50kg, modified polyphenylene ether 30kg, modified montmorillonite 15kg, palygorskite powder 12kg, porous limestone 3kg, carbon black N220 3kg, activated alumina 2kg, polydimethylsiloxane 1.2kg, butene Dibutyl diacid 1.5kg, silicone masterbatch 0.8kg, crosslinking agent 2kg, flame retardant 1.5kg, aluminate coupling agent ASA type 2kg and stabilizer 1.2kg;

[0064] The preparation and selection of some of the above raw materials are as follows:

[0065] (1) Modified montmorillonite: Weigh 15 kg of montmorillonite, soak it in 12% hydrochloric acid by mass concentration for 2 hours, wash and dry in deionized water, and then soak it in 8% hydrogen peroxide solution by mass concentration for 2 hours. Wash it to neutrality, dry it, and then roast it at 320°C for 12 minutes; take out the montmorillonite after air-cooling to 55°C, add 0.8kg of alkylphenol polyoxyethylen...

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Abstract

The invention discloses an electromagnetic shielding computer mainframe casing material, and relates to the technical field of computer engineering materials. The casing material comprises nylon 66, modified polyphenyl ether, modified montmorillonite, palygorskite powder, porous limestone, carbon black N220, activated alumina, polydimethylsiloxane, dibutyl maleate, silicone masterbatch, crosslinking agent, flame retardant, coupling agent and stabilizer. The casing material is simple and convenient to prepare, green and environmentally friendly, and has excellent mechanical property, electromagnetic shielding property, high temperature flame retardancy, weathering and aging resistance, light weight, fast heat dissipation, wide application range, long service life and the like.

Description

Technical field [0001] The invention relates to the technical field of computer engineering materials, in particular to an electromagnetic shielding computer mainframe shell material. Background technique [0002] With the rapid development of the computer industry, computer casing protective materials are also developing in the direction of high strength, high rigidity and light weight. At present, most of the plastic enclosures on the market are made of PC / ABS engineering plastic alloy. This material not only has the excellent heat and weather resistance, dimensional stability and impact resistance of PC resin, but also has excellent processing fluidity of ABS resin. However, with the progress of society, the development of computers, and the complexity of the application environment, considering factors such as protecting fragile electronic components and strengthening the strength of the overall structure, the protection performance of the computer mainframe products on the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/06C08L71/12C08L83/04C08L25/06C08K13/06C08K9/02C08K9/04C08K3/34C08K7/26C08K3/04C08K3/22C08K5/053C08K5/18C08K3/38C08K5/523H05K9/00
CPCC08L77/06C08K2003/2227C08K2003/387C08L2201/02C08L2201/08C08L2205/025C08L2205/035H05K9/0081C08L71/126C08L83/04C08L25/06C08K13/06C08K9/02C08K9/08C08K3/346C08K7/26C08K3/04C08K3/22C08K5/053C08K5/18C08K3/38C08K5/523
Inventor 董雄飞
Owner 合肥酷睿网络科技有限公司
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