Silicon carbide powder nickel plating method
A technology of silicon carbide powder and electroless nickel plating, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problem of impure nickel-plated silicon carbide powder, reduce the efficiency of electroless nickel plating, and complicate the processing process and other issues, to achieve the effect of improving integrity and electroless plating efficiency, low cost and high purity
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Embodiment 1
[0026] The present embodiment provides a method for nickel-plating silicon carbide powder, which comprises the following steps:
[0027] Step 1. Coarse the silicon carbide powder with a hydrofluoric acid solution, and wash it to neutral after treatment;
[0028] Step 2, using potassium borohydride solution to activate the roughened silicon carbide powder;
[0029] Step 3: Prepare electroless nickel plating solution and reduction solution, place the electroless nickel plating solution in a constant temperature water bath, heat it to 75-80°C and keep it warm, add the activated silicon carbide powder into the constant temperature chemical nickel plating solution In the stirring state, reduce the solution several times until the reaction is completed;
[0030] Step 4: Filter the solution treated in Step 3, wash the resulting filter residue to neutral and dry it at 60° C., so as to obtain the desired nickel-plated silicon carbide powder.
[0031] In this embodiment, on the one ha...
Embodiment 2
[0040] On the basis of Example 1, this example provides a specific nickel-plating method for silicon carbide powder, the purpose of which is to electrolessly plate a layer with a thickness of about 0.5 μm on 50 g of silicon carbide powder with an average particle size of 12 μm Nickel plating, the specific operation is as follows:
[0041] Step 1. Add 50g of silicon carbide powder into the HF solution with a volume percentage of 20%, stir for 30 minutes and soak for 3 hours, then take out the soaked silicon carbide powder and wash it with deionized water until neutral;
[0042] Step 2: adding the silicon carbide powder after the coarsening treatment in step 1 into potassium borohydride solution with a concentration of 0.8% and infiltrating for 3 hours;
[0043] Step 3, configure 1L electroless nickel plating bath, wherein, the nickel sulfate that adopts and concentration is 25g / L is as main salt, adopts the lactic acid that concentration is 50mL / L as complexing agent, adopts co...
Embodiment 3
[0047] On the basis of Example 1, this example provides a specific nickel-plating method for silicon carbide powder, the purpose of which is to electrolessly plate a layer with a thickness of about 0.2 μm on 50 g of silicon carbide powder with an average particle size of 5 μm Nickel plating, the specific operation is as follows:
[0048] Step 1. Add 50g of silicon carbide powder into the HF solution with a volume percentage of 20%, stir for 20 minutes and soak for 2 hours, then take out the soaked silicon carbide powder and wash it with deionized water until neutral;
[0049] Step 2: adding the silicon carbide powder after the roughening treatment in step 1 into potassium borohydride solution with a concentration of 0.8% and infiltrating it for 2 hours;
[0050] Step 3, configure 1L electroless nickel plating bath, wherein, the nickel sulfate that adopts and concentration is 20g / L is as main salt, adopts the lactic acid that concentration is 40mL / L as complexing agent, adopts ...
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Abstract
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