Unlock instant, AI-driven research and patent intelligence for your innovation.

Conductive slurry for semiconductor packaging and preparation method thereof

A conductive paste, semiconductor technology, applied in conductive materials dispersed in non-conductive inorganic materials, semiconductor devices, cable/conductor manufacturing, etc. Achieve the effect of improving antioxidant capacity, solving the decline of electrical conductivity, preventing agglomeration and oxidation

Active Publication Date: 2018-09-14
深圳市聚峰锡制品有限公司
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a conductive paste for semiconductor packaging and a preparation method thereof, which is used to solve the problem that the coating material organically coated with nano-metal particles is usually insulating, and if the coating material cannot be treated before using the nano-metal particles If it is effectively removed, it will have a great impact on the conductivity of the nano-metal particles, which will greatly affect the performance of the conductive paste.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0040] The present invention also provides a method for preparing conductive paste for semiconductor packaging, comprising the following steps:

[0041] a) In the mixed solution of protonic acid and dopant, after stirring and adding nano metal particles, then adding conductive polymer monomer, to obtain a conductive polymer in-situ polymerization reaction solution containing nano metal particles;

[0042] b) conducting in-situ polymerization reaction of the conductive polymer containing nano-metal particles under stirring to obtain a dispersion solution containing nano-metal covered by the conductive polymer;

[0043] c) drying the dispersion solution containing the nano metal covered by the conductive polymer to obtain the nano metal covered by the conductive polymer;

[0044] d) After mixing the solvent, the dispersant and the viscosity regulator, stirring and adding the nano-metal coated with the conductive polymer for dispersion to obtain the conductive paste.

[0045] In...

Embodiment 1

[0076] Add 20g of copper powder with an average diameter of 100nm into 100ml of dilute sulfuric acid with a mass fraction of 5%, and react for 5min under 1000rpm magnetic stirring at 25°C to obtain a dilute sulfuric acid solution containing nano-copper particles;

[0077] At 25°C, use deionized water to wash the dilute sulfuric acid solution containing the nano-copper particles for 3 times to obtain the nano-copper particles after cleaning with deionized water;

[0078] In addition, 0.06mol sodium persulfate is added to the reaction vessel, then dilute sulfuric acid and water are added into the reaction vessel, so that the concentration of the dilute sulfuric acid in the reaction vessel is 0.05M, and the concentration of sodium persulfate is 0.05M;

[0079] Under 1200rpm magnetic stirring, add nano-copper particles washed with deionized water to the reaction vessel, and then add aniline to the reaction vessel to obtain a conductive polymer in-situ polymerization reaction soluti...

Embodiment 2

[0085] Add 20g of copper powder with an average diameter of 100nm into 100ml of dilute sulfuric acid with a mass fraction of 5%, and react for 5min under 1000rpm magnetic stirring at 25°C to obtain a dilute sulfuric acid solution containing nano-copper particles;

[0086] At 25°C, use deionized water to wash the dilute sulfuric acid solution containing the nano-copper particles for 3 times to obtain the nano-copper particles after cleaning with deionized water;

[0087] In addition, 0.06mol sodium persulfate is added to the reaction vessel, then dilute sulfuric acid and water are added into the reaction vessel, so that the concentration of the dilute sulfuric acid in the reaction vessel is 0.05M, and the concentration of sodium persulfate is 0.05M;

[0088] Under 1200rpm magnetic stirring, add nano-copper particles washed with deionized water to the reaction vessel, and then add aniline to the reaction vessel to obtain a conductive polymer in-situ polymerization reaction soluti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention belongs to the field of electronic fine chemicals and particularly relates to conductive slurry for semiconductor packaging and a preparation method thereof. The conductive slurry is prepared by a conductive filler, a solvent, a dispersing agent and a viscosity modifier; the conductive filler is nano metal coated with a conductive polymer. The conductive filler in the conductive slurry provided by the invention uses the conductive polymer as a coating material for nano metal particles, so that the agglomeration phenomenon caused by the high surface energies of the nano metal particles can be improved, and the oxidation resistance of the nano metal particles is effectively improved, therefore, not only can the requirement of preventing the agglomeration and the oxidation of the nano metal particles be met, but also the influence of a coating layer on the conductive properties of the nano metal particles is reduced as a conductive polymer material that is not completely removed has conductive properties when the nano metal particles are in use, and the problem that the conductive properties of the nano metal particles are reduced by organic coating of the nano metal with a traditional polymer, so that the properties of the conductive slurry are greatly influenced is solved.

Description

technical field [0001] The invention belongs to the field of electronic fine chemicals, in particular to a conductive paste for semiconductor packaging and a preparation method thereof. Background technique [0002] Conductive paste is used in the field of chip packaging technology, for interconnection and solid crystal of semiconductor chips, conductive ink and printed circuit, etc. When the conductive filler in the conductive paste uses nano metal particles, in order to prevent the agglomeration of the nano metal particles due to their high surface energy and prevent the oxidation of the nano metal particles, organic materials are used to coat the nano metal particles. [0003] Traditional organic-coated coating materials are usually insulating, although they can also prevent the agglomeration and oxidation of nano-metal particles, but if the coating material cannot be effectively removed before using nano-metal particles, it will cause damage to the nano-metal particles. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H01L23/48
CPCH01B1/22H01B13/00H01L23/4827
Inventor 张昱邹其昱崔成强张凯陈云高健
Owner 深圳市聚峰锡制品有限公司