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A kind of low temperature impact resistant epoxy adhesive composition and preparation method thereof

A technology of epoxy adhesives and compositions, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve problems such as brittle cracks, poor toughness, and brittleness

Active Publication Date: 2020-05-01
HANGZHOU ZHIJIANG SILICONE CHEM +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] After the epoxy glue is cured, it is usually easy to be brittle and cracked under the action of external force because of its poor toughness.
The general toughening method can improve the toughness of the material at room temperature by adding a toughening agent, but at low temperature, the material with good toughness at room temperature will still become brittle

Method used

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  • A kind of low temperature impact resistant epoxy adhesive composition and preparation method thereof

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preparation example Construction

[0079] The present invention also provides a kind of preparation method of above-mentioned epoxy adhesive composition, comprises the following steps:

[0080] A) heating and melting the epoxy resin after mixing to obtain the epoxy resin mixture;

[0081] B) Add difunctional epoxy diluent, toughening agent, inorganic filler, dewatering agent, thixotropic agent, heat-activated latent curing agent and curing accelerator to mixing and stirring in the epoxy resin mixture, vacuum Degassing to obtain an epoxy adhesive composition.

[0082] In the present invention, firstly, the epoxy resin is mixed and then heated and melted to obtain the epoxy resin mixed liquid.

[0083] Specifically, heating the liquid epoxy resin to 95-105°C, adding the solid epoxy resin, mixing and stirring until the solid epoxy resin melts to obtain the epoxy resin mixture;

[0084] Next, add difunctional epoxy diluent, toughening agent, inorganic filler, dewatering agent, thixotropic agent, heat-activated la...

Embodiment 1

[0090] The preparation of embodiment 1 toughening agent A

[0091] Add 100 parts of polyether polyol (DL-2000D) with a molecular weight of 2000D to the reactor, dehydrate at 105°C for 30 minutes, then add 0.6 parts of trimethylolpropane and 0.1 parts of organotin catalyst, mix well, and add 26.5 parts of MDI, the temperature was adjusted to 85-90° C., and the reaction was carried out for 2.0 hours under this condition to obtain a prepolymer. The mass percent content of —NCO groups in the prepolymer was detected to be 3.3%. Add 10.1 parts of butanone oxime according to the molar ratio of the ketoxime group to the -NCO group of 1.1:1, and perform a capping reaction at 85-90°C for 1.5 hours. The content of the -NCO group in the product is detected to be zero, and the increase Toughener A.

[0092] The number average molecular weight of the toughening agent A was determined to be 4500, the weight average molecular weight was 11000, and the dispersion index was 2.4.

Embodiment 2

[0093] The preparation of embodiment 2 toughening agent B

[0094] Add 200 parts of polyether polyol (DL 4000D) with a molecular weight of 4000D to the reactor, dehydrate at 105°C for 30 minutes, then add 1.0 part of trimethylolpropane and 0.2 part of organotin catalyst and mix well, add MDI28 under nitrogen protection part, adjust the temperature to 85-90° C., and react under this condition for 2.5 hours to obtain a prepolymer. The content of —NCO groups in the prepolymer was detected to be 1.9%. Add 13 parts of cyclohexanone oxime according to the molar ratio of the ketoxime group to the -NCO group of 1.1:1, and perform a capping reaction at 85 to 90°C for 1.5 hours, and detect that the content of the -NCO group in the product is zero, and obtain Toughener B.

[0095] The number average molecular weight of the toughening agent B was determined to be 8600, the weight average molecular weight was 22000, and the dispersion index was 2.6.

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Abstract

The present invention provides a low-temperature-impact-resistant epoxy adhesive composition, which comprises: at least two epoxy resins; at least a bifunctional epoxy diluent; at least three toughening agents, wherein the toughening agents at least comprise a liquid rubber toughening agent having a core-shell structure, an epoxy resin modified nitrile butadiene rubber, and a ketoxime-terminated reactive polyurethane elastic prepolymer; at least an inorganic filler; at least a water removing agent; at least a thixotropic agent; at least a thermally-activated latent curing agent; and at least acuring accelerator. According to the present invention, the two different epoxy resins are used as the raw materials, and the composite toughening agent at least comprising the liquid rubber toughening agent having the core-shell structure, the epoxy resin modified nitrile butadiene rubber and the ketoxime-terminated reactive polyurethane elastic prepolymer is added, such that the obtained epoxyadhesive composition has good low-temperature-impact resistance.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a low-temperature impact-resistant epoxy adhesive composition and a preparation method thereof. Background technique [0002] After the epoxy glue is cured, it is usually prone to brittle cracking under the action of external force due to its poor toughness. The general toughening method can improve the toughness of the material at room temperature by adding a toughening agent, but at low temperature, the material with good toughness at room temperature will still become brittle. Contents of the invention [0003] In view of this, the technical problem to be solved by the present invention is to provide a low-temperature impact-resistant epoxy adhesive composition and a preparation method thereof. The low-temperature impact-resistant epoxy adhesive composition provided by the present invention has good low-temperature impact resistance. [0004] The invention pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08
CPCC08L2205/025C08L2205/035C09J11/04C09J11/08C09J163/00C08L63/00C08L15/00C08L75/08C08K13/04C08K7/20C08K2003/265C08K3/36
Inventor 何永富桑广艺夏佳斌钱立飞
Owner HANGZHOU ZHIJIANG SILICONE CHEM
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