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hot melt adhesive

A technology of hot-melt adhesives and symmetry, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of low tensile breaking strength and low cohesion of hot-melt adhesives, Achieve the effects of small temperature dependence, stable adhesive force, and excellent tensile breaking strength

Active Publication Date: 2020-12-01
SANYO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned hot melt adhesives have problems of low cohesive force and low tensile breaking strength.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0100] [Synthesis of EO adduct (A-1) of bisphenol A]

[0101] 137.0 g of toluene (40% relative to bisphenol) and 342.4 g (1.50 mol) of bisphenol A ("bisphenol A" manufactured by Mitsubishi Chemical Corporation) were charged into a glass autoclave, and after replacing with nitrogen, the temperature was raised to At 75°C, bisphenol A was dispersed in toluene. To this was added 2.73 g of a 25% aqueous solution of tetramethylammonium hydroxide.

[0102] Nitrogen substitution was performed again, and EO was dripped and reacted in the range of 75-95 degreeC and reaction pressure 0.2 MPa or less. During the reaction, appropriate sampling was performed, and the addition mole distribution of the reactant to bisphenol was followed by GC, and the reaction was terminated when 1 mole of the addition product reached 0.1% or less. The EO required was 139.9 g (3.18 mol) and the reaction time was 7 hours.

[0103] After the reaction, unreacted EO, a catalyst, a solvent, etc. were distilled ...

manufacture example 2

[0106] [Synthesis of EO adduct (A-2) of bisphenol A]

[0107] 85.6 g (A-1) obtained in Example 1 (25 weight% with respect to the bisphenol A added later) was added to the glass autoclave, and it melt|dissolved as the solvent of a reaction system. After heating and melting at 110° C., 342.4 g (1.50 mol) of bisphenol A was charged and replaced with nitrogen, and then cooled to 95° C. to disperse bisphenol A. 0.30 g of sodium hydroxide was added thereto.

[0108] Nitrogen substitution was performed again, and EO was dripped and reacted in the range of 75-95 degreeC and reaction pressure 0.2 MPa or less. During the reaction, appropriate sampling was carried out, and the molar distribution of addition of reactants to bisphenol was traced by GC. The reaction was terminated when 1 mole of the adduct reached 0.1% or less. The EO required was 150.5 g (3.42 mol) and the reaction time was 7 hours.

[0109] After the reaction, the catalyst was neutralized with phosphoric acid, and unr...

manufacture example 3

[0112] [Synthesis of EO adduct (A-3) of bisphenol A]

[0113] The reaction was carried out in the same manner as in Production Example 2, except that the amount of EO to be added dropwise in Production Example 2 was 154.0 g (3.50 mol), and the reaction was terminated when 1 mol of the adduct became 0.1% or less.

[0114] After the reaction, the catalyst was neutralized with phosphoric acid, and unreacted EO was distilled off at 130 to 160° C. under reduced pressure to obtain an EO adduct of bisphenol A (A-3).

[0115] This (A-3) was analyzed by GC, and the obtained (A-3) had an average added mole number of EO per hydroxyl group of 1.10 and a monodispersity of 81.3%.

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Abstract

The purpose of the present invention is to provide a hot-melt adhesive which has a reduced temperature dependence, exhibits flowability immediately upon heating to above the melting point, and has an excellent rupture tensile strength. The hot-melt adhesive of the present invention comprises a thermoplastic urethane resin (F) produced from monomers including the following essential constituent monomers: a polyol (A) having an aromatic ring; a diisocyanate (B) having symmetry; one or more glycols (C) which are poly(methylene glycol) (C1) represented by general formula (1) and / or poly(ethylene glycol) (C2) represented by general formula (2); and a high-molecular-weight polyol (D). HO-(CH2)n-OH (1) [n is an integer of 2-8.] HO-(CH2CH2O)m-H (2) [m is an integer of 2-8.]

Description

technical field [0001] The present invention relates to a hot-melt adhesive containing a thermoplastic urethane resin. Background technique [0002] Thermoplastic resins generally have lower resin strength as the temperature rises, so heat resistance may become a problem during use. From the viewpoint of quality stability of products using thermoplastic resins, thermoplastic resins with little temperature dependence over a wide temperature range are desired. In addition, thermoplastic resins having sharp melt properties (expressing fluidity rapidly when the melting point is exceeded) are desired from the viewpoint of ease of handling during use. As such a thermoplastic resin with little temperature dependence, there is known a hot-melt adhesive comprising a diisocyanate having a symmetrical structure, a low-molecular-weight diol having a symmetrical structure, and / or a low-molecular-weight diamine having a symmetrical structure. A hard segment composed of classes (Patent D...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/04C08G18/66C09J11/06
CPCC08G18/66C09J11/06C09J175/04
Inventor 今井政登岛田哲也
Owner SANYO CHEM IND LTD
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