A method for reducing cracks in the back electrode region of MWT batteries
A back electrode and battery technology, applied in circuits, electrical components, photovoltaic power generation, etc., can solve the problem of rising fragmentation rate at the component end, and achieve the effect of reducing the fragmentation rate, reducing cracks, and reducing the coverage area.
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[0026] The method for reducing the cracks in the electrode area on the back of the MWT battery includes the following steps:
[0027] (1) Silicon wafer: using solar-grade P-type monocrystalline or polycrystalline silicon wafer as the substrate;
[0028] (2) Laser drilling: laser drilling on the silicon wafer, the holes are an N×N array, and the hole shapes are center, square or cone; a better choice, the hole diameter of laser drilling is 100-400μm ;
[0029] (3) Texturing: Use conventional chemical cleaning and texturing methods for texturing to form a light trap surface;
[0030] (4) Diffusion: use POCl3 diffusion source on the suede for high-temperature single-sided diffusion to form a PN junction;
[0031] (5) Mask: On the back surface of the silicon wafer (take the punched hole as the center), prepare a diameter of 1-10mm (for example, 1, 2, 4, 8, 10mm in diameter) and a thickness of 1-50μm (for example, a thickness of 25μm) The round organic mask (such as paraffin film) is prepa...
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