Cooler-less olt optical components and optical modules for 10g-pon applications

Abstract

The invention discloses an OLT optical assembly and an optical module without a refrigerator for 10G-PON applications. The invention adopts a special 1577nm directly modulated laser (DML), which can reduce the dispersion effect and meet the transmission requirements of 10G-PON downlink; the invention does not need a semiconductor cooler (TEC) to control the temperature of the DML in the package design; The present invention adopts a heater on the package, and when the temperature is too low, the heater starts to work, effectively reducing the working temperature range of the laser, so that the wavelength drift of the DML does not exceed 10G- The range specified by PON (1575nm‑1580nm). The invention does not need a semiconductor refrigerator, reduces power consumption, simplifies the packaging structure, improves packaging yield, and greatly reduces the cost of 10G-PON OLT optical components and optical modules.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a 10G-PON application-oriented DML optical component without a cooler, an OLT optical module and a system using the same. Background technique [0002] As a new-generation broadband solution, the optical fiber access network has been widely used to provide users with a high-bandwidth, full-service access platform. And FTTH (Fiber To The Home, fiber to the home, connecting the fiber directly to the user's home) is called the most ideal business transparent network, and it is the ultimate way for the development of the access network. [0003] Among various schemes, a point-to-multipoint (P2MP) optical fiber access mode PON (Passive Optical Network, Passive Optical Network) is the best choice. PON is an optical distribution network that is applied to the access network, and is composed of a passive optical cable, an optical splitter / combiner (Splitter), etc. between ...

AI Technical Summary

Problems solved by technology

[0014] 1. The process of EML laser itself is complicated, the cost is high, and the output optical power is low

[0015] 2. Use TEC to control the working temperature of EML laser, resulting in excessive power consumption

Especially for the highly integrated Combo-PON, power consumption has become a difficult problem to solve

[0016] 3. There are many internal components in the optical component, the structure is complex, the packaging process is long, and the laser bonding accuracy is high, and the yield rate of the packaging process is low

[0017] 4. The overall cost of optical components is high

[0018] 5. In the circuit design of the optical module, a dedicated EML driver chip and a TEC driver chip are required, which are expensive and further increase the overall power consumption

[0019] 6. The design of 10G-PON OLT requires a powerful ventilation and cooling system

Moreover, due to the power consumption and size of the optical module, the port density of the board is low (currently each motherboard generally only has 8 10G-PON ports)

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