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A device and working method for facilitating coating and shaping of semiconductor laser optical fiber

A laser and semiconductor technology, used in semiconductor lasers, lasers, phonon exciters, etc., can solve the problems of film peeling, poor shaping effect, affecting production efficiency, etc., to avoid fiber loss, avoid secondary transfer, improve The effect of shaping efficiency

Active Publication Date: 2020-01-10
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if shaping, it is necessary to transfer the optical fiber after coating for shaping again. The operation is complicated and the shaping effect is not good.
Moreover, when the fixture is used for optical fiber coating, the optical fiber is in a curved state, and the shape changes from a curved state to a straight state during shaping, which will cause uneven stress on the optical film and cause some of the film to fall off, thereby affecting the power of the shaped semiconductor laser.
[0008] In the prior art, there is only an independent device for optical fiber coating, and a second transfer is required during shaping, which will affect production efficiency

Method used

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  • A device and working method for facilitating coating and shaping of semiconductor laser optical fiber
  • A device and working method for facilitating coating and shaping of semiconductor laser optical fiber
  • A device and working method for facilitating coating and shaping of semiconductor laser optical fiber

Examples

Experimental program
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Effect test

Embodiment 1

[0050] A device that facilitates coating and shaping of semiconductor laser fibers, such as figure 1 shown, including:

[0051] - fiber holder 2 for fixing fiber 1; and

[0052] - The isolation plate is located under the optical fiber fixing frame 2 and is connected with the optical fiber fixing frame 2 in a detachable manner;

[0053] -The isolation plate includes two side connection plates 5 and some parallel spacer strips 6 fixed between the two side connection plates 5, the spacer strips 6 and the optical fiber 1 fixed on the optical fiber holder 2 are basically perpendicular to each other, and are used for Support fiber 1 during shaping.

[0054] The materials of the optical fiber fixing frame 2 and the isolation plate are stainless steel with a hardness less than 187HB. Avoid high-temperature deformation of the optical fiber fixing frame 2 and the isolation plate in the coating machine.

[0055] The optical fiber fixing frame 2 is a hollow rectangular frame, and doub...

Embodiment 2

[0063] Utilize the method described in embodiment 1 to carry out the method for semiconductor laser fiber coating and shaping, concrete steps comprise:

[0064] (1) remove the coating on the surface of the optical fiber 1, and cut the optical fiber 1 into a short optical fiber having the same width as the optical fiber holder 2;

[0065] (2) Put the shortened optical fiber 1 in a glass container, soak it in acetone and ultrasonically clean it for half an hour;

[0066] (3) Glue double-sided heat-resistant adhesive tape 3 on the opposite sides of the upper surface of the optical fiber holder 2;

[0067] (4) The optical fiber 1 cleaned in step (2) is evenly adhered to the double-sided high-temperature-resistant adhesive tape 3 on the opposite sides of the upper surface of the optical fiber holder 2 in sequence, and the optical fiber 1 is parallel to the width direction of the optical fiber holder 2;

[0068] (5) Fix the optical fiber fixing frame 2 glued to the optical fiber 1 ...

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Abstract

The present invention relates to a device convenient for film-coating and reshaping of semiconductor laser optical fibers. The device comprises an optical fiber fixing frame used for fixing the optical fibers; and an isolating plate located under the optical fiber fixing frame, wherein the isolating plate is connected with the optical fiber fixing frame in a dismountable way. The isolating plate comprises connecting plates on both sides of the isolating plate and a plurality of isolating bars fixed between the connecting plates on both sides, wherein the isolating bars are parallel to each other. The isolating bars are perpendicular to the optical fibers fixed on the optical fiber fixing frame on the whole, and the isolating bars are used for supporting the optical fibers when the opticalfibers are subjected to reshaping. The optical fibers are arranged on the optical fiber fixing frame to complete the film-coating of the optical fibers, and after the film-coating is completed, the lower part of the optical fiber fixing frame is assembled and connected with the isolating plate to perform reshaping of laser beams, so that the secondary transferring of the optical fibers is avoided,the operation is simple, and the production efficiency is high.

Description

technical field [0001] The invention relates to a device and a working method for facilitating coating and shaping of optical fibers of semiconductor lasers, which belong to the technical field of semiconductor lasers. Background technique [0002] Due to the advantages of small size, light weight, high conversion efficiency, long service life, and direct internal modulation, semiconductor lasers are widely used in medical, display, pumping, industrial processing and other fields, such as optical fiber communication, laser ranging, target Instructions, laser guidance, laser radar, space optical communication, etc. [0003] The combination of optical fibers and semiconductor lasers has made semiconductor lasers more widely used. For example, in the field of communication, how to make the output light of lasers more stable and transmit longer distances, and how to make the output of semiconductor lasers in pumping solid-state lasers Optical power can be more effectively trans...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/14
CPCH01S5/146
Inventor 位晓凤孙素娟李沛旭徐现刚
Owner Shandong Huaguang Optoelectronics Co. Ltd.
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