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A lead-free solder alloy and its application, glass component

A technology of lead-free solder alloy and lead-free solder, applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve the problems of inability to obtain high adhesive strength, poor plastic deformation characteristics, and inability to offset stress, etc. Achieve the effect of superior performance, little difference in performance, and small welding stress

Active Publication Date: 2020-02-14
上海莜玮汽车零部件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, these lead-free solder alloys cannot achieve high bond strength
On the other hand, these lead-free solder alloys have poor plastic deformation characteristics and are prone to large soldering stress; for example, glass and electrical connectors (mostly made of copper) are two materials with very different thermal expansion coefficients. After the lead solder alloy is melted at high temperature to weld the glass and the connecting parts of the electronic components together, in the subsequent cooling process, due to the poor plastic deformation of the solder, it cannot offset the gap between the connecting parts of the electronic components and the glass. Resulting stresses which, in the case of relatively large temperature fluctuations, can lead to cracking of the glass

Method used

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  • A lead-free solder alloy and its application, glass component
  • A lead-free solder alloy and its application, glass component
  • A lead-free solder alloy and its application, glass component

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Components and mass percentages of the lead-free solder alloy of the present embodiment are:

[0041]Indium In: 63%, Silver Ag: 4.5%, Copper Cu: 0.5%, Iron Fe: 0.3%, Aluminum Al: 0.1%, and the balance is tin and unavoidable impurities.

[0042] The melting point or liquidus temperature of the above composition is 126.82°C, the solidus temperature is 113.40°C, and the Mohs hardness is 1-1.5.

Embodiment 2

[0044] Components and mass percentages of the lead-free solder alloy of the present embodiment are:

[0045] Indium In: 73.6%, silver Ag: 4.5%, copper Cu: 0.3%, and the balance is tin (about 21.6%) and unavoidable impurities.

[0046] The melting point or liquidus temperature of the lead-free solder alloy is 135.26°C, the solidus temperature is 122.24°C, and the Mohs hardness is 1-1.5.

Embodiment 3

[0048] Components and mass percentages of the lead-free solder alloy of the present embodiment are:

[0049] Indium In: 84.2%, silver Ag: 3.2%, copper Cu: 0.5%, iron Fe: 1.1%, and the balance is tin (about 11%) and unavoidable impurities.

[0050] The above-mentioned lead-free solder alloy has a melting point or a liquidus temperature of 140.01°C, a solidus temperature of 129.04°C, and a Mohs hardness of 1-1.5.

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Abstract

The invention provides a lead-free solder alloy and an application thereof and a glass assembly. The lead-free solder alloy provided by the invention is prepared from the following components in percentage by mass: 60-95% of indium, 1-6% of silver, 0.3-3% of copper, 0-2.5% of iron, 0-2% of aluminum and the balance tin and inevitable impurities. The lead-free solder alloy provided by the inventionis environment-friendly, has relatively high liquidus temperature and solidus temperature, can bear a relatively high working environment temperature, and meanwhile, is excellent in welding mobility and can provide relatively good bonding strength.

Description

technical field [0001] The invention belongs to the technical field of lead-free solder, and more specifically relates to an environment-friendly lead-free solder composition for glass. Background technique [0002] The windshield and rear window of a car often carry some necessary functions, for example, a defroster, radio antenna, etc. associated with the windshield, and a heating element, antenna, etc. associated with the rear window. [0003] In order to provide these types of functions to car windows, it is first necessary to print a metal coating (mainly composed of silver paste) on the glass as an electrical contact surface for electrical signal transmission; at the same time, a stable voltage supply to the glass window is required , there must be corresponding electrical connectors welded to the glass. [0004] Leaded solder has the advantages of good solder diffusion, low melting point, and low price during soldering, and is widely used between electrical connector...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/24
CPCB23K35/24
Inventor 孙虎赖小燕
Owner 上海莜玮汽车零部件有限公司
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