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Resin composition

A resin composition and resin technology, which can be used in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of long-term underfill and void generation, and achieve the effect of good duration and excellent installation.

Active Publication Date: 2018-10-26
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the underfill is flowed between the IC chip and the substrate by utilizing the capillary phenomenon, there will be problems such as generation of voids, or taking a long time to flow the underfill, etc.

Method used

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Examples

Experimental program
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preparation example Construction

[0106] (Preparation of resin composition)

[0107] The resin composition of the present invention can be prepared by a usual method. For example, components (A) to (G) and (H) components and other compounding ingredients are added or added sequentially, and dispersed and mixed with a dispersing device such as a kneader, three-roll machine, or ball mill.

[0108]When the resin composition of the present invention is used as an NCP, it has excellent mountability in a TCB process, and has good moisture absorption reflow resistance, HAST resistance, and duration on a bench during TCB implementation.

[0109] The resin composition of the present invention enables mounting in a short time and has high productivity.

[0110] The resin composition of the present invention containing the component (H) has a flux effect and is excellent in solderability.

[0111] Next, the usage procedure of the resin composition of this invention is as follows.

[0112] When mounting a semiconductor...

Embodiment 1～26

[0118] (Examples 1-26, Comparative Examples 1-4)

[0119] According to the compounding ratio shown in the following table|surface, each raw material was mixed and dispersed using the three-roll mill, and the resin composition was prepared. In addition, the numerical value concerning each composition in a table shows a mass part.

[0120] Components used for preparation of the resin composition are as follows.

[0121] (A) (meth)acrylate compound represented by formula (1)

[0122]

[0123] (A1) Trade name BPE-100 (in formula (1), R 1 and R 2 Methyl, m+n=2.6), Shin-Nakamura Chemical Co., Ltd.)

[0124] (A2) Trade name BPE-80N (in formula (1), R 1 and R 2 Methyl, m+n=2.3), Shin-Nakamura Chemical Co., Ltd.)

[0125] (A3) Trade name BPE-200 (in formula (1), R 1 and R 2 is a methyl group, m+n=4.0), manufactured by Shin-Nakamura Chemical Industry Co., Ltd.)

[0126] (B) acrylate compound represented by formula (2)

[0127]

[0128] Product name DCP-A, manufactured b...

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Abstract

The present invention provides a resin composition that satisfies required properties to serve as a NCP. The resin composition according to the present invention contains: (A) a methacrylate compoundrepresented by formula (1); (B) an acrylate compound represented by formula (2); (C) an acrylate compound represented by formula (3); (D) a copolymer of butadiene and maleic anhydride; (E) an organicperoxide having a peroxy ester structure or a dialkyl peroxide structure; (F) a silica filler; and (G) a silane coupling agent. In the formula (1), the sum of m and n is 2.3-4.0, and each of R1 and R2is a hydrogen atom or a methyl group; and, in the formula (2), each of R1 and R2 is a phenly group or a CnH<2n> group (n = 1-6).

Description

technical field [0001] This invention relates to the resin composition used as NCP (Non Conductive Paste) at the time of semiconductor mounting. Background technique [0002] Conventionally, the semiconductor mounting method is to make the surface of the IC (Integrated Circuit) chip on which the electrodes (bumps) are formed and the surface of the substrate on which the electrodes (electrode pads) are formed to face each other, and place the surface of the IC chip A flip-chip method in which bumps are electrically connected to electrode pads on a substrate. [0003] In this flip chip method, in order to protect the connection part between the electrodes from external influences and to relax the stress caused by the difference in the linear expansion coefficient between the IC chip and the substrate, an underfill agent is usually used after the electrodes are connected. The liquid thermosetting adhesive flows between the semiconductor chip and the substrate to cure it. [0...

Claims

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Application Information

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IPC IPC(8): C08F290/06H01L21/60
CPCC08F290/06C08F279/02C08K3/36C08K5/09C08K5/14C08K5/5415C08K9/06C08L47/00
Inventor 明道太树酒井洋介宗村真一
Owner NAMICS CORPORATION
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