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Thermosetting vinyl silicone resin composition and its application in high frequency circuit board

A technology of vinyl silicone and resin composition, which is applied in the direction of circuit substrate materials, printed circuits, printed circuit manufacturing, etc., and can solve the problem of not meeting the requirements of the adhesion of copper-clad laminates, the dielectric loss of the substrate is not low enough, and the substrate layer In order to solve the problems of poor interlayer adhesion and achieve low dielectric loss, good interlayer adhesion between substrates, and improved interlayer adhesion between substrates

Active Publication Date: 2021-06-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Both of the above two patents use vinyl-modified polyphenylene ether resin as the main resin and vinyl silicone resin as the crosslinking agent. The dielectric loss of the prepared substrate is still not low enough to meet the market's increasing demand for high-frequency substrate dielectric loss. lower demand
[0009] For example, if vinyl silicone resin is used as the whole resin, although the prepared substrate has lower dielectric constant and dielectric loss, the adhesion between the substrate layers is poor, which cannot meet the requirements of the copper-clad laminate for the interlayer adhesion of the substrate. Require

Method used

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  • Thermosetting vinyl silicone resin composition and its application in high frequency circuit board
  • Thermosetting vinyl silicone resin composition and its application in high frequency circuit board
  • Thermosetting vinyl silicone resin composition and its application in high frequency circuit board

Examples

Experimental program
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Effect test

preparation example 1

[0090]Add a mixture of divinyltetramethyldisiloxane, concentrated hydrochloric acid, deionized water and ethanol into the three-necked flask, turn on the mechanical stirrer, and then quickly drop triethyl phenyl silicate under the condition of rapid stirring and heating under reflux Hydrolysis and condensation, after hydrolysis for a certain period of time, add toluene for extraction, then pour the reaction solution into a separatory funnel, and let it stand to separate layers. The water layer is separated, the oil layer is washed with water to neutrality, distilled and dried to remove the solvent toluene to obtain a three-dimensional network structure containing unsaturated double bonds, composed of monofunctional vinyl-containing siloxane units (M units) and The MT vinyl silicone resin V-10 obtained by hydrolytic condensation of trifunctional phenyl-containing siloxane units (T units) has a molecular weight Mn of 2130 as measured by GPC with toluene as the mobile phase.

preparation example 2

[0092] Add a mixture of divinyltetramethyldisiloxane, concentrated hydrochloric acid, deionized water and ethanol into the three-necked flask, turn on the mechanical stirrer, and then quickly drop triethyl phenyl silicate under the condition of rapid stirring and heating under reflux 1. Tetraethyl orthosilicate is hydrolyzed and condensed. After hydrolyzing for a certain period of time, add toluene for extraction, then pour the reaction solution into a separatory funnel, and let it stand for stratification. The water layer is separated, the oil layer is washed with water until neutral, and the solvent toluene is distilled and dried to obtain a monofunctional vinyl-containing siloxane unit (M unit) with a three-dimensional network structure containing unsaturated double bonds, MTQ vinyl silicone resin V-20, which is formed by hydrolytic condensation of trifunctional phenyl-containing siloxane units (T units) and tetrafunctional siloxane units (Q units), was tested by GPC with to...

preparation example 3

[0094] Add a mixture of divinyltetramethyldisiloxane, concentrated hydrochloric acid, deionized water and ethanol into the three-necked flask, turn on the mechanical stirrer, and then quickly drop triethyl phenyl silicate under the condition of rapid stirring and heating under reflux , Dimethyldiethoxysilane is hydrolyzed and condensed, after hydrolysis for a certain period of time, toluene is added for extraction, then the reaction solution is poured into a separatory funnel, and allowed to stand for stratification. The water layer is separated, the oil layer is washed with water until neutral, and the solvent toluene is distilled and dried to obtain a monofunctional vinyl-containing siloxane unit (M unit) with a three-dimensional network structure containing unsaturated double bonds, MDT vinyl silicone resin V-30, which is formed by the hydrolytic condensation of difunctional methyl-containing siloxane units (D units) and trifunctional phenyl-containing siloxane units (T unit...

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Abstract

The present invention relates to thermosetting vinyl silicone resin composition, said resin composition comprises: any one of MT vinyl silicone resin, MTQ vinyl silicone resin, MDT vinyl silicone resin, MDQ vinyl silicone resin One or at least two combinations of vinyl silicone resins; vinyl modified polyphenylene ether resins; and free radical initiators; the present invention also provides high-frequency circuit substrates and its application. The high-frequency circuit substrate of the present invention has low dielectric constant, low dielectric loss, and low water absorption, and the interlayer adhesion can meet the requirements for interlayer adhesion of copper-clad laminates, and at the same time can realize halogen-free and phosphorus-free V-0 grades Flame retardant.

Description

technical field [0001] The invention relates to a composition of vinyl silicone resin, in particular to a thermosetting vinyl silicone resin composition and its application in high-frequency circuit substrates. Background technique [0002] In recent years, with the rapid development of wireless communication technology and electronic products, electronic circuits have entered the stage of high-speed information processing and high-frequency signal transmission. However, when the frequency is greater than 300MHz or even above GHz, the electrical properties of the substrate will be seriously affected. The characteristics of electronic circuits, thus putting forward higher requirements on the performance of the substrate. [0003] In terms of dielectric constant performance, in high-frequency circuits, the transmission rate of the signal is related to the dielectric constant D of the insulating material k The relationship is: insulating material dielectric constant D k The l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L71/12C08K3/36C08K7/14H05K1/03H05K3/02B32B17/02B32B17/06B32B15/20B32B27/04B32B27/30
CPCB32B5/02B32B15/14B32B15/20B32B2260/021B32B2260/046B32B2262/101C08L83/04C08L2201/02C08L2201/08C08L2201/22C08L2203/20C08L2312/00H05K1/0373H05K3/022C08L71/126C08K3/36C08K7/14B32B17/02B32B17/06B32B27/04B32B27/30C08L71/12H05K1/03H05K3/02
Inventor 陈广兵曾宪平
Owner GUANGDONG SHENGYI SCI TECH
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