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Flexible copper clad laminate with lightproof insulating layer, method for preparing flexible copper clad laminate and application thereof

A technology of flexible copper-clad laminates and insulating layers, which is applied in the field of copper-clad laminates, and can solve the problem that the insulating layer of flexible copper-clad laminates cannot be opaque.

Active Publication Date: 2018-11-06
CHONGQING YUNTIANHUA HIGH END NEW MATERIALS DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The insulating layer of the flexible copper-clad laminate provided by this patent cannot achieve the purpose of light-tightness

Method used

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  • Flexible copper clad laminate with lightproof insulating layer, method for preparing flexible copper clad laminate and application thereof
  • Flexible copper clad laminate with lightproof insulating layer, method for preparing flexible copper clad laminate and application thereof
  • Flexible copper clad laminate with lightproof insulating layer, method for preparing flexible copper clad laminate and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] (1) Preparation of light-shielding black paste

[0079] Add 63 parts by mass of butanone, and add 0.06 parts by mass of polyether-modified polydimethylsiloxane interpolymer (BYK-333) and isopropyl tris(dodecylbenzenesulfonyl) titanate under stirring 0.29 parts by mass, stirred at 300rpm for 30min, slowly added 10 parts by mass of carbon black powder under stirring, stirred at 500rpm for 180min, monitored the particle size of the slurry, and the particle size was required to be <5μm. Then add 10.65 parts by mass of carboxyl-terminated nitrile rubber (1072CGJ), 16 parts by mass of aluminum hydroxide powder, and stir at 500 rpm for 120 min. Choose zirconium beads of φ1.5-φ1.6mm, sand mill for 24 hours, monitor the particle size of the slurry, the particle size is required to be <10um, the particle size distribution is uniform, the appearance is smooth after coating, and there are no obvious particles. Then seal it with a PE bag and store it at a low temperature of 5-10°C....

Embodiment 2

[0086] (1) Preparation of light-shielding black paste

[0087] Add 63 parts by mass of butanone, and add 0.07 parts by mass of polyether-modified polydimethylsiloxane (BYK-306) and isopropyl dioleic acid acyloxy (dioctyl phosphate acyloxy) under stirring 0.30 parts by mass of titanate, stirred at 300 rpm for 30 minutes, slowly added 9 parts by mass of carbon black powder under stirring, stirred at 500 rpm for 180 minutes, monitored the particle size of the slurry, the particle size requirement was The zirconium beads should be sanded for 24 hours, and the particle size of the slurry should be monitored. The particle size should be less than 10 μm, the particle size distribution should be uniform, and the appearance should be smooth after coating without obvious particles. Then seal it with a PE bag and store it at a low temperature of 5-10°C.

[0088] (2), prepare light-shielding epoxy resin

[0089] Add 47 mass parts of butanone, add 8 mass parts of carboxy-terminated nitri...

Embodiment 3

[0094] (1), preparation of light-shielding black paste

[0095] Add 67 parts by mass of butanone, and add 0.05 parts by mass of polyether-modified polydimethylsiloxane interpolymer (BYK-333) and isopropyl tris(dodecylbenzenesulfonyl) titanate under stirring 0.25 parts by mass, stirred at 300rpm for 30min, slowly added 8 parts by mass of carbon black powder under stirring, stirred at 500rpm for 180min, monitored the particle size of the slurry, the particle size requirement was The zirconium beads should be sanded for 24 hours, and the particle size of the slurry should be monitored. The particle size should be less than 10 μm, the particle size distribution should be uniform, and the appearance should be smooth after coating without obvious particles. Then seal it with a PE bag and store it at a low temperature of 5-10°C.

[0096] (2), prepare light-shielding epoxy resin

[0097] Add 41 mass parts of methyl ethyl ketone, add 8 mass parts of carboxy-terminated nitrile rubber ...

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Abstract

The invention provides a flexible copper clad laminate with a lightproof insulating layer, a method for preparing the flexible copper clad laminate and application thereof. The flexible copper clad laminate comprises an insulating base material layer, a shading epoxy resin layer and a copper foil layer. The insulating base material layer, the shading epoxy resin layer and the copper foil layer aresequentially in contact with one another; the shading epoxy resin layer comprises shading black slurry; the particle sizes of particles in the shading black slurry are smaller than 10 micrometers; the shading black slurry comprises modified carbon black slurry; the particle size of modified carbon black in the modified carbon black slurry is smaller than 5 micrometers; the modified carbon black slurry comprises dispersing agents, leveling agents and carbon black; the carbon black is red-phase carbon black with the oil absorption lower than 200 cm<3> / 100 g; the dispersing agents are selected from titanate coupling agents; the leveling agents are selected from polyether polyester modified organosiloxane. The flexible copper clad laminate, the method and the application have the advantages that the insulating layer of the flexible copper clad laminate is lightproof, and the flexible copper clad laminate is good in peel strength; the flexible copper clad laminate is further excellent in insulating property and good in dimensional stability, heat resistance, processability and electric characteristic, and has the excellent characteristics of the traditional flexible copper clad laminates, and special requirements of modern electronics on the lightproof insulating layer of the flexible copper clad laminate can be met.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a flexible copper-clad laminate with an opaque insulating layer, a preparation method and an application thereof. Background technique [0002] Flexible copper clad laminate (FCCL) is the processing substrate of flexible printed circuit board (FPC), which has been widely used in defense industry, electronics industry, automobile industry, information industry and other fields. The insulation layer of traditional flexible copper clad laminates is light-transmitting, and the copper foil circuit can be seen through the insulation layer. The insulation layer cannot block the light source on the copper foil circuit, especially the LED strong light source. The current common treatment method is to recoat A layer of black ink is used to shield light, but this will increase the processing steps, increase the cost, and reduce the yield rate. Therefore, it is nece...

Claims

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Application Information

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IPC IPC(8): B32B27/28B32B27/38B32B27/08B32B15/18B32B15/092B32B27/20B32B27/18B32B33/00C09J163/00C09J113/00C09J11/04C09J11/06
CPCB32B15/092B32B15/18B32B27/08B32B27/18B32B27/20B32B27/281B32B27/38B32B33/00B32B2307/206B32B2307/306B32B2307/41B32B2457/08C08K2003/2227C08K2201/011C09J11/04C09J11/06C09J163/00C08L13/00C08K13/06C08K9/08C08K9/04C08K3/04C08K3/22C08K5/13C08K3/36C08K3/34
Inventor 李鑫胡明源徐军贺光强李东蒋严彬
Owner CHONGQING YUNTIANHUA HIGH END NEW MATERIALS DEV CO LTD