Unlock instant, AI-driven research and patent intelligence for your innovation.

Copper base surface anti-mouse-bite immersion tin liquid, chemical immersion tin method and anti-mouse-bite immersion copper base plate thereof

A chemical immersion tin, anti-rat bite technology, applied in the direction of assembling printed circuits with electrical components, can solve the problem of not attracting enough attention, and achieve the effect of excellent solderability

Active Publication Date: 2018-11-06
深圳市德瑞勤科技有限公司
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Compared with the Giavani phenomenon of chemical immersion silver, the mouse bite phenomenon of chemical immersion tin has less influence on the electrical performance of the circuit, so it has not attracted enough attention

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper base surface anti-mouse-bite immersion tin liquid, chemical immersion tin method and anti-mouse-bite immersion copper base plate thereof
  • Copper base surface anti-mouse-bite immersion tin liquid, chemical immersion tin method and anti-mouse-bite immersion copper base plate thereof
  • Copper base surface anti-mouse-bite immersion tin liquid, chemical immersion tin method and anti-mouse-bite immersion copper base plate thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Embodiment 1 Immersion tin liquid composition

[0052]

[0053] The etched test board with solder mask to be processed is cleaned, rinsed, micro-etched, rinsed, pre-dipped, tinned, rinsed and dried.

[0054] To inspect the appearance of immersion tin, see figure 1 ;Test tin thickness with x-ray machine, see figure 2 ; The surface crystal structure of the sample was tested by SEM, see image 3 ; Test the surface composition of the sample with EDX, see Figure 4 ; Remove the solder mask with sodium hydroxide, observe and measure the mouse bite depth under a microscope.

Embodiment 2

[0055] Embodiment 2 Immersion tin liquid composition

[0056]

[0057] The etched test board with solder mask to be processed is cleaned, rinsed, micro-etched, rinsed, pre-dipped, tinned, rinsed and dried.

[0058] Remove the solder mask with sodium hydroxide, observe and measure the mouse bite depth under a microscope.

Embodiment 3

[0059] Example 3 Immersion tin liquid composition

[0060]

[0061]

[0062] The etched test board with solder mask to be processed is cleaned, rinsed, micro-etched, rinsed, pre-dipped, tinned, rinsed and dried.

[0063] Remove the solder mask with sodium hydroxide, observe and measure the mouse bite depth under a microscope.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of tin plating of copper substrates, particularly to a copper base surface anti-mouse-bite immersion tin liquid and a chemical immersion tin method thereof, and an anti-mouse-bite immersion copper base plate obtained through the chemical immersion tin method, wherein the copper base surface anti-mouse-bite immersion tin liquid comprises 25-100 g / L Sn<2+> ions, 25-100 mL / L an organic or inorganic acid having the same anion as a tin source, 200-400 g / L composite organic acid, 30-60 g / L tin-copper counter potential agent, and 15-50 ppm Ag<+> ions. According to the present invention, with the chemical immersion tin method based on the anti-mouse-bite immersion tin liquid, the mouse-bite depth of the copper base interface can be controlled at less than 4.1 [mu]m, and the excellent weldability can be achieved after at least 5 lead-free reflow welding cycles.

Description

technical field [0001] The invention relates to the field of tin plating of copper substrates, in particular to a rat-biting anti-rat-biting tin immersion tin solution on a copper-based surface, a chemical tin-immersion method thereof, and the obtained rat-bite-proof copper substrate. Background technique [0002] Printed circuit boards, also known as PCB circuit boards, are providers of electrical connections for electronic components, and chemical immersion tin products have been used as one of the alternative finished products for PCB circuit boards. However, in the final assembly and use of chemical immersion tin, problems of solderability, tin whiskers, and rat bites of chemical immersion tin will be involved. Regarding the tin whisker problem of chemical immersion tin, a method of adding trace metal ions to suppress the growth of tin whiskers is provided in patents CN103124807B and CN1387465A. However, we know that during the soldering process, the tin deposited on th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C18/48C23C18/18C23C18/31H05K3/34
CPCH05K3/34C23C18/1651C23C18/1844C23C18/31C23C18/48
Inventor 吴昌根
Owner 深圳市德瑞勤科技有限公司