Electroplating liquid and electroplating method thereof

A technology of electroplating solution and mass concentration, applied in the field of copper electroplating, can solve the problems of high toxicity, etc., achieve high plating ability, reduce plating hole defects, and thin coating thickness

Active Publication Date: 2018-11-06
GUANGDONG SKYCHEM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But, the electroplating solution of this invention contains pentavalent vanadium and has bigger toxicity

Method used

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  • Electroplating liquid and electroplating method thereof
  • Electroplating liquid and electroplating method thereof
  • Electroplating liquid and electroplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Example 1 Plated through hole

[0059] The electroplating solution of the present embodiment, in terms of mass concentration, comprises the following components:

[0060]

[0061]

[0062] Immerse the plate-shaped part with a through hole on the surface into the electroplating solution, and use the plate-shaped part as the cathode to conduct electroplating after electrifying, wherein the aspect ratio (AR) of the through hole is 5, and the forward current density is 9A / dm 2 , the forward current pulse time is 15ms, and the reverse current density is 27A / dm 2 , the reverse current pulse time is 1.5ms, and the electroplating time is 3h. The difference in TP value can be seen more intuitively through long-term electroplating.

Embodiment 2

[0075] Example 2 Plated Through Holes

[0076] The electroplating solution of the present embodiment, in terms of mass concentration, comprises the following components:

[0077]

[0078]Immerse the plate-shaped part with through holes on the surface into the electroplating solution, wherein the diameter of the through-hole is 300 μm and the hole height is 1500 μm μm, and the plate-shaped part is energized after the cathode is energized, and the forward current density is 10A. / dm 2 , the forward current pulse time is 40ms, and the reverse current density is 30A / dm 2 , the reverse current pulse time is 2ms, and the plating time is 60min.

Embodiment 3

[0086] Example 3 Plated Through Holes

[0087] The electroplating solution of the present embodiment, in terms of mass concentration, comprises the following components:

[0088]

[0089] Immerse the plate-shaped part with through-holes on the surface into the electroplating solution, wherein the diameter of the through-hole is 300 μm and the hole height is 1500 μm, and the plate-shaped part is energized after the cathode is energized, and the forward current density is 10A. / dm 2 , the forward current pulse time is 40ms, and the reverse current density is 30A / dm 2 , the reverse current pulse time is 2ms, and the plating time is 30min.

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Abstract

The invention provides electroplating liquid and an electroplating method thereof. The electroplating liquid comprises the following components including, by mass concentration, 0.3-25 g / L of tetravalent vanadium, 4-10 g / L of divalent iron, 0.3-5 g / L of ferric iron, 100-250 g / L of copper sulfate, 50-210 g / L of sulfuric acid and 30-150 mg / L of chloride. According to the electroplating liquid, the mass concentrations of the tetravalent vanadium, the divalent iron, the ferric iron, the sulfuric acid, the copper sulfate and the chloride are adjusted, and a vanadium system is combined with an ironsystem to give play to higher deep plating capacity. The electroplating method is simple in operation and high in speed, electroplating can be completed within 20-120 minutes generally, the plate faceplating layer thickness is small, and reduction treatment does not need to be treated; and the plate face plating layer thickness is evenly distributed, and the production efficiency of a circuit board is improved.

Description

technical field [0001] The invention belongs to the technical field of electroplating copper, and relates to an electroplating solution and an electroplating method thereof. Background technique [0002] With the development of science and technology, electronic products are becoming more and more intelligent and miniaturized, and this trend continues to promote the improvement of circuit board manufacturing process; and eventually leads to the emergence of high-density interconnection circuit boards (HDI). This kind of circuit board has a small pad diameter, a small wiring width, a small line spacing, and a large number of layers. Therefore, the number of through holes or blind holes that provide vias between different layers is large, and the pore size is small; this brings great challenges to the process of metallization in the holes, thereby establishing vias between layers, drilling process, filling material , and the subsequent process steps of the printed circuit boa...

Claims

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Application Information

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IPC IPC(8): C25D3/56C25D5/18C25D7/00
CPCC25D3/562C25D5/18C25D7/00
Inventor 章晓冬冯建松刘江波苏向荣王科宋通李智信
Owner GUANGDONG SKYCHEM TECH LTD
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