A new type of LED filament manufacturing method
A technology of LED filament and manufacturing method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of chip welding short circuit and high price, and achieve the effects of product performance improvement, production cost reduction, and production efficiency improvement
Active Publication Date: 2020-07-14
深圳瑞沃微半导体科技有限公司
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Problems solved by technology
The advantage is that it can save investment in wire bonding machine equipment. At the same time, because the P / N electrode surface of the LED chip is connected to the substrate circuit through solder paste welding, the chip has better heat dissipation. The disadvantage is that the price of the flip chip is 15% higher than that of the regular chip. In addition, for chips below 10*30mil, due to the small size of the chip, it is easy to cause a short circuit between the P / N electrodes of the chip when soldering with solder paste
Method used
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Embodiment 1
[0025] Select the type of LED chip: formally installed blue light chip, the chip size is 8*15mil, the product structure is as follows figure 1 shown.
[0026] Step 1. Substrate pretreatment: use the metal substrate (6) (iron plate, substrate thickness 100-150 microns) as the substrate for filament packaging, the thickness of the substrate is 200±50 microns, and coat one side of the substrate with 50--100 microns thick Insulating transparent glue (4) (epoxy crystal-bonding glue);
[0027] Step 2. Laser drilling: Use a laser drilling machine on the pretreated substrate to perform laser drilling according to the corresponding positions of the chip electrode P pole (1) and the chip electrode N pole) (5) to form through holes (7), (8), the aperture range is micron, the laser is injected from the side of the substrate coated with insulating transparent glue, step 2 completes the parts such as image 3 shown;
[0028] Step 3. Chip bonding: Coat the electrode surface of the chip co...
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Abstract
The invention provides a new type of LED filament manufacturing technology, especially the use of pre-treated special substrates combined with solder paste technology, the surface of the substrate contacting the LED chip is first coated with insulating glue, and then the P / N electrode position of the substrate corresponding to the chip is used Laser drill through holes, face the chip electrode surface to the substrate surface coated with insulating glue, place the chip electrode corresponding to the through hole, use the through hole on the substrate to print the solder paste on the chip electrode surface by using the missing printing method, and heat and weld the chip electrode Conduction with the substrate, and finally corrode the metal of the insulating channel part of the substrate corresponding to the P / N electrode of the chip through chemical etching or laser cutting, and the electrode surface of the chip and the substrate form a solder paste welding path. While improving product performance, production efficiency Significantly improved, greatly reduced production costs.
Description
technical field [0001] The present invention relates to a new type of LED filament manufacturing technology, in particular to a pretreatment special substrate combined with missing printing solder paste technology, the P / N electrode position of the substrate corresponding to the chip is drilled with a laser, and the electrode surface of the chip faces the coating insulation On the substrate surface of the glue, place the chip electrodes corresponding to the through holes, and use conventional front-mounted chips without wiring, and make LED filaments with high efficiency and low cost. Background technique [0002] LED filaments have developed rapidly in recent years, and the market capacity has grown rapidly. At present, the main manufacturing technologies of LED filaments are mainly divided into two categories. One is to use LED front-mounted chips to cooperate with substrates (glass, sapphire substrates, ceramic substrates, and metal substrates). , wire bonding, molded sea...
Claims
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IPC IPC(8): H01L25/075H01L33/48H01L33/56H01L33/62H01L33/64
CPCH01L25/0753H01L33/486H01L33/56H01L33/62H01L33/647H01L2933/005H01L2933/0033H01L2933/0066H01L2224/73265H01L2224/48137H01L2224/16
Inventor 申凤仪王秀瑜申广
Owner 深圳瑞沃微半导体科技有限公司