Preparation and encapsulation method of a low-temperature fast-bonding pre-sintered nano-network silver film

A nano-network and fast connection technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of inapplicability to large-scale applications, high prices, and low output, and achieve low production input costs, simple equipment, The effect of low content

Active Publication Date: 2018-11-20
深圳市先进连接科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This scheme mainly proposes a method for preparing nano-patterns based on the template method, which can produce relatively fine two-dimensional patterns. However, the template method has problems such as high price and low output.
Not suitable for large-scale applications in the packaging materials industry

Method used

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  • Preparation and encapsulation method of a low-temperature fast-bonding pre-sintered nano-network silver film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1 A method for preparing a pre-sintered network silver film that can be quickly connected at low temperature, comprising:

[0030] (S1): Prepare sodium citrate-coated silver particles with a size of 20 nm. The temperature of the solution prepared by the coating layer is 60°C, the reaction time is 5min, and the mass ratio of the coating layer to nano-silver is 1:1;

[0031] (S2): The nano-silver particles with a coating layer on the surface are dissolved in ethylene glycol using ultrasonic stirring, the mass fraction ratio is 1:5, and flocculation, centrifugation, and flocculation are carried out using an ethylene glycol solution containing saturated sodium chloride. The time is 3min, the centrifugal speed is 3000r / min, the centrifugal time is 5min, A:B=3:1, after the above method is repeated 4 times, the nano-silver precipitation after the chemical shearing of the coating layer is obtained;

[0032](S3): The obtained nano-silver precipitation is fully mechan...

Embodiment 2

[0034] Embodiment 2 A kind of preparation method of the pre-sintered network silver film that can be connected quickly at low temperature, comprising:

[0035] (S1): Prepare sodium citrate-coated silver particles with a size of 50 nm. The temperature of the solution prepared by the coating layer is 60°C, the reaction time is 5min, and the mass ratio of the coating layer to nano-silver is 1:1;

[0036] (S2): The nano-silver particles with a coating layer on the surface are dissolved in 1-2 propylene glycol using ultrasonic stirring, the mass fraction ratio is 1:9, and flocculation and centrifugation are carried out using 1-2 propylene glycol solution containing saturated sodium carbonate, The flocculation time is 3min, the centrifugal speed is 3000r / min, the centrifugal time is 5min, A:B=1:1, after repeating the above method 3 times, the nano-silver precipitation after the chemical shearing of the coating layer is obtained;

[0037] (S3): The obtained nano-silver precipitation...

Embodiment 3

[0039] Embodiment 3 A method for preparing a pre-sintered network silver film that can be quickly connected at low temperature, comprising:

[0040] (S1): the preparation size is the silver particle of coating PVP of 70nm, the solution temperature prepared by coating layer is 60 ℃, and the reaction time is 5min, and the mass ratio of coating layer and nano-silver is 1:1;

[0041] (S2): The nano-silver particles with a coating layer on the surface are dissolved in glycerol using ultrasonic stirring, the mass fraction ratio is 1:6, and the glycerol solution containing saturated sodium sulfate is used to flocculate and centrifuge it, and the flocculation time For 3min, the centrifugal speed is 3000r / min, the centrifugal time is 5min, A:B=4:1, after the above-mentioned method is repeated 5 times, the nano-silver precipitation after the chemical shearing of the coating layer is obtained;

[0042] (S3): The obtained nano-silver precipitation is fully mechanically mixed with methyl c...

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Abstract

The invention provides a preparation and encapsulation method of a low-temperature fast-bonding pre-sintered nano-network silver film, which comprises the following steps: S1, preparing nano-silver particles with specific size; S2, dissolving the nano-silver particles in an organic solvent, and performing chemical cutting on the nano-silver particles; S3, mechanically mixing the obtained nano silver precipitate with a binder, a dispersant and an organic solvent according to a certain proportion to obtain a nano silver paste; S4: the silver paste is printed into a film on a flexible substrate by means of steel screen printing or coating, and the pre-sintered nano-network silver film is obtained after heating. The nano-network silver film solves the problem that the traditional nano-silver solder paste can not realize the rapid preparation of large-area solder joints, and overcomes the disadvantage of poor sintering performance of silver particles in the ordinary silver film. The invention simplifies the sintering process of the nano silver solder joint, obtains good joint performance and no solder residue, the process is green and environmentally friendly, and can be used as the interconnecting material of a new generation of large-size and high-power chip packaging.

Description

technical field [0001] The invention relates to the field of electronic packaging, more specifically, to a method for preparing and packaging a pre-sintered nano-network silver film for low-temperature quick connection. Background technique [0002] In the field of electronic power, devices often need to carry large switching currents, voltages, energy density and long-term service reliability. IGBT modules, as their core, often need to have excellent heat dissipation, electrical conductivity and mechanical properties. This poses a challenge to device packaging. more stringent requirements. The traditional IGBT module is formed by crimping. The advantage of this method is that the device has good mechanical reliability through mechanical pressing, and the operation is simple. It does not need to consider the service reliability problems caused by welding parameters and the evolution of solder joint structure. However, with the increase of device integration, the high contac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L21/50
CPCH01L21/4814H01L21/50
Inventor 杨帆胡博李明雨靳清赵新亮
Owner 深圳市先进连接科技有限公司
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