Method for effectively controlling diamond wire wet chemical black silicon battery piece EL poor performance
A diamond wire and wet chemical technology, applied in the manufacture of circuits, electrical components, final products, etc., can solve the problems of low cell efficiency, open voltage, low short current, metal pollution, etc., achieve normal appearance and efficiency, and reduce production Cost, the effect of reducing the proportion of bad and low-efficiency tablets
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Embodiment 1
[0021] A kind of method of effectively controlling diamond wire wet chemical black silicon battery sheet EL bad (crack) of the present invention, it comprises the following steps:
[0022] 1) Texturing: After the original silicon wafer is treated by removing the damaged layer, silver deposition, digging holes, preliminary desilvering, and hole expansion, it is treated with a chemical mixed solution, which is an acidic mixed solution composed of hydrochloric acid and water , and the volume ratio in the mixed solution is hydrochloric acid: water=36:199, the concentration of the hydrochloric acid is 37%, and the weight loss of the wet-process black silicon textured silicon wafer is controlled at 0.35~0.45g;
[0023] 2) From the diffusion process of the normal production line process, it can be processed in the normal production line process.
[0024] When processing in step 1), the feed rate of cleaning machine is controlled at 270s / 480pcs (sheet); The principle of replenishment ...
Embodiment 2
[0027] A method for effectively controlling the EL defect (crack) of the diamond wire wet chemical black silicon cell, it comprises the following steps:
[0028] 1) Texturing: After the original silicon wafer is treated by removing the damaged layer, silver deposition, digging holes, preliminary desilvering, and hole expansion, it is treated with a chemical mixed solution, which is an acidic mixed solution composed of hydrochloric acid and water , and the volume ratio in the mixed solution is hydrochloric acid: water=45:190, the concentration of the hydrochloric acid is 37%, and the weight loss of wet-process black silicon textured silicon wafers is controlled at 0.35~0.45g;
[0029] 2) From the diffusion process of the normal production line process, it can be processed in the normal production line process.
[0030] When processing in step 1), the feed rate of cleaning machine is controlled at 230s / 480pcs (sheet); The principle of replenishment of hydrochloric acid in the mi...
Embodiment 3
[0033] A method for effectively controlling the EL defect (crack) of the diamond wire wet chemical black silicon cell, it comprises the following steps:
[0034] 1) Texturing: After the original silicon wafer is treated by removing the damaged layer, silver deposition, digging holes, preliminary desilvering, and hole expansion, it is treated with a chemical mixed solution, which is an acidic mixed solution composed of hydrochloric acid and water , and the volume ratio in the mixed solution is hydrochloric acid: water=85:150, the concentration of the hydrochloric acid is 37%, and the weight loss of the wet-process black silicon textured silicon wafer is controlled at 0.35~0.45g;
[0035] 2) From the diffusion process of the normal production line process, it can be processed in the normal production line process.
[0036] When processing in step 1), the feed rate of cleaning machine is controlled at 215s / 480pcs (sheet); The principle of replenishment of hydrochloric acid in the...
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