A kind of reactive polyurethane hot melt adhesive and preparation method thereof
A polyurethane hot-melt adhesive, reactive technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc. PUR and other issues, to achieve the effect of good heat resistance, wide application range and good tolerance
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Embodiment 1
[0040] The reactive polyurethane hot-melt adhesive of the present embodiment, the raw material composition is as follows:
[0041] raw material parts by weight Polypropylene glycol Mn=2000 45 Poly adipate polyester diol Mn=3000 32 Toluene diisocyanate 16 Hydroxy-terminated acrylate-carbonate copolymer resin Mn=2500 5.5 Additives to enhance water resistance 1 1.25 Dibutyltin dilaurate, dibutyltin diacetate (1:2 mixture by weight) 0.25
[0042] Among them: the structure of additive 1 for enhancing water resistance is:
[0043]
[0044] The preparation method of the reactive polyurethane hot-melt adhesive of the present embodiment follows the steps:
[0045] Step 1. Put polypropylene glycol, polyadipate polyester diol, and hydroxy-terminated acrylate-carbonate copolymer resin into the reaction kettle according to the metering ratio, heat at 120° C., and vacuum dehydrate for 2 hours under stirring.
[0046] Step 2, drop the te...
Embodiment 2
[0049] The reactive polyurethane hot-melt adhesive of the present embodiment, the raw material composition is as follows:
[0050]
[0051]
[0052] Among them: the structure of additive 2 for enhancing water resistance is:
[0053]
[0054] The preparation method of this embodiment follows the steps:
[0055] Step 1: Put polypropylene glycol, polyadipate polyester diol, and hydroxyl-terminated acrylate-carbonate copolymer resin into the reaction kettle according to the metering ratio, heat at 140° C., and vacuum dehydrate for 1.5 hours while stirring.
[0056] Step 2, drop the temperature to 100°C and drop in diphenylmethane diisocyanate, 2 The reaction was stirred at 90°C for 1 hour under protection.
[0057] Step 3: Add additive 3 for enhancing water resistance, bismorpholino diethyl ether, vacuumize and stir at 120° C. for 1 hour, and discharge to obtain hot melt adhesive 3 .
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