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Conducting silver paste

A technology of conductive silver paste and silver powder, which is applied to conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems such as the inability of resin to fully and effectively coat silver powder, the poor adsorption of silver powder on the surface layer, and the poor hardness of high polymer. Improve conductivity, easy preparation and good adhesion

Inactive Publication Date: 2018-12-18
常州宏润织造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conductive silver powder is a metal powder with relatively high hardness, but the hardness of high polymers such as resin is generally poor
However, when the demand for high hardness is met by increasing the filling amount of silver powder, a relatively small amount of resin cannot fully and effectively coat the silver powder, resulting in poor adsorption of the silver powder on the surface and falling off.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0012] 72% flake silver powder, 10% nano-scale silver powder, 19% thermoplastic polyimide resin, 50% boron nitride and 1% triterpene saponin.

[0013] Example

[0014] 60% flake silver powder, 1% nanometer silver powder, 14% thermoplastic polyimide resin, 30% boron nitride and 0.6% triterpene saponin.

[0015] Example

[0016] 68% flake silver powder, 8% nano-scale silver powder, 16% thermoplastic polyimide resin, 35% boron nitride and 0.8% triterpene saponin.

[0017] The beneficial effects of the present invention are: the present invention is unique in design, reasonable in composition, convenient in preparation, has excellent electrical conductivity, and has good adhesion to the base material, while improving the electrical conductivity and mechanical properties of the coating, it ensures the adhesiveness and durability of the coating. Ease of processing, hardness, diffusivity, and low environmental pollution.

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PUM

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Abstract

The invention relates to the technical field of silver paste, in particular to an electrically conductive silver paste. Comprises the following components in parts by mass: flake silver powder 60-72%,nanometer silver powder 1-10%, thermoplastic polyimide resin 14-19%, boron nitride 30%-50% and triterpenoid saponin 0.6-1%. The invention has the advantages of unique design, reasonable composition,convenient preparation, excellent electric conductivity, good adhesion to the substrate, high electric conductivity and mechanical performance of the coating, and at the same time, the adhesion, processability, hardness and diffusion of the coating are ensured, and the environmental pollution is small.

Description

technical field [0001] The invention relates to a silver paste, in particular to a conductive silver paste. Background technique [0002] As a functional printing material, conductive paste has been widely used in electronic information products due to its good physical properties. With the development of electronic products to be lighter, thinner, more functional and more environmentally friendly, its Performance also puts forward higher requirements. Among them, the low-temperature halogen-free conductive silver paste is widely used in membrane switches, capacitive electrodes, touch screens, etc. because of its excellent electrical conductivity, thermal conductivity, and practicability. Low-temperature conductive silver paste is a uniform paste made by stirring and dispersing conductive silver powder as a conductive filler with high polymer resin, solvent, curing agent, and additives. After the conductive silver paste is coated on the substrate, it is dried in a low temp...

Claims

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Application Information

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IPC IPC(8): H01B1/22
CPCH01B1/22
Inventor 孙全英
Owner 常州宏润织造有限公司