Method for preparing hollow microneedle array

A microneedle array and hollow technology, which is applied in the field of micromachining, can solve the problems of complex preparation process, high cost and poor structure controllability of the hollow microneedle array, and achieves the effects of high cost, simple operation and uniform material.

Active Publication Date: 2018-12-25
HUAZHONG UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above defects or improvement needs of the prior art, the object of the present invention is to provide a method for preparing hollow microneedle arrays in batches, wherein by improving the setting of the over

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  • Method for preparing hollow microneedle array
  • Method for preparing hollow microneedle array
  • Method for preparing hollow microneedle array

Examples

Experimental program
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Example

[0030] Examples 1-7

[0031] In summary, Examples 1-7 all include the following steps:

[0032] 1. Preparation of PMMA microneedle array negative template: adjust the processing parameters of the laser engraving machine (as shown in Table 1), so that the laser will etch microneedle holes of different sizes on the PMMA substrate;

[0033] 2. Preparation of the positive template for the PDMS microneedle array: mix PDMS (Sylgard 184) and the curing agent at a mass ratio of 10:1, and let it stand for a period of time to remove the bubbles in the mixture. After the bubbles are removed, add the above-mentioned PMMA microneedle array negative Vacuum the surface of the template for several minutes to allow PDMS to enter and fill the holes to obtain the positive template of the PDMS microneedle array with the same size as the negative template of the PMMA microneedle array;

[0034] 3. Use the silver mirror reaction to plate a silver seed layer on the surface of the PDMS microneedle array posi...

Example

[0041] Examples 8-13

[0042] In summary, Examples 8-13 all include the following steps:

[0043] 1. Preparation of PDMS substrate: Mix PDMS (Sylgard 184) and curing agent at a mass ratio of 10:1, let stand for a period of time to remove bubbles in the mixture, and then heat at 100°C for 1 hour to make it completely solidified. Obtain the PDMS substrate;

[0044] 2. Preparation of the negative template of the PDMS microneedle array: adjust the processing parameters of the laser engraving machine to a laser power of 100W, a laser scanning speed of 10 mm / s, and a frequency of 1 time, so that the length of the laser etching on the PDMS substrate is approximately 2000μm microneedle array negative template;

[0045] 3. Preparation of polymethyl methacrylate (PMMA) microneedle array positive template: Place the PMMA plate on the surface of the above-mentioned PDMS microneedle array negative template with engraved holes, heat and vacuum, so that PMMA enters and fills the holes. Obtain the ...

Example Embodiment

[0053] Example 14

[0054] This embodiment includes the following steps:

[0055] 1. Preparation of PDMS substrate: Mix PDMS (Sylgard 184) and curing agent at a mass ratio of 10:1, let stand for a period of time to remove bubbles in the mixture, and then heat at 100°C for 1 hour to make it completely solidified. Obtain the PDMS substrate;

[0056] 2. Preparation of the negative template of the PDMS microneedle array: adjust the processing parameters of the laser engraving machine to a laser power of 100W, a laser scanning speed of 10 mm / s, and a frequency of 1 time, so that the length of the laser etching on the PDMS substrate is approximately 2000μm microneedle array negative template;

[0057] 3. Preparation of polypropylene microneedle array positive template: Place the polypropylene plate on the surface of the above-mentioned PDMS microneedle array negative template engraved with holes, heat and vacuum, so that polypropylene enters and fills the holes, and the PDMS microneedles a...

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Abstract

The invention discloses a method for preparing a hollow microneedle array in bulk. The method for preparing the hollow microneedle array particularly comprises the steps that by means of a microneedlearray negative template with holes, a polymer microneedle array positive template is prepared, and then a metal seed layer is plated on the polymer microneedle positive template; then, a metal structure layer is electroplated on the microneedle array positive template with the surface attached with the metal seed layer, and a microneedle array needle wall is formed; organic solvent is used for removing the polymer microneedle array positive template, a metal microneedle array is obtained, the top of the microneedle array is subjected to polishing or laser cutting, and the hollow metal microneedle array can be obtained. Accordingly, by improving the whole technological process of the preparation method, compared with the prior art, the problems that at present, the hollow microneedle arraypreparation technology is complex, the cost is high, and the structural controllability is poor can be effectively solved.

Description

technical field [0001] The invention belongs to the technical field of micromachining, and more specifically relates to a method for preparing a hollow microneedle array, in particular, the hollow microneedle array can be prepared in batches based on laser engraving and electroplating technologies. Background technique [0002] With the development of microelectromechanical processing technology, microneedles are widely used in the medical field and are expected to become the next generation of transdermal drug delivery medical devices. Among them, hollow microneedles have outstanding advantages in microfluidic biomedical applications, which can realize the functions of drug delivery and blood collection at the same time, and can greatly reduce the pain during drug delivery or sampling. In addition, hollow microneedles can also be integrated with microfluidic chips to realize the integration of sampling, diagnosis and drug delivery. [0003] However, the current methods for...

Claims

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Application Information

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IPC IPC(8): A61M37/00
CPCA61M37/0015A61M2037/0053
Inventor 朱锦涛王华李钰策张连斌柳佩陶娟朱今巾杜虹瑶
Owner HUAZHONG UNIV OF SCI & TECH
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